Inventor · disambiguated record
Carlos J. Sambucetti
Also filed as: SAMBUCETTI CARLOS J · SAMBUCETTI CARLOS JUAN
63 granted patents·7 pending applications·3,855 citations·filing 1975–2009
99Inventor score
Top patents by PatentIndex Score
70 records- 0199US6342733B1Reduced electromigration and stressed induced migration of Cu wires by surface coatingIBM·Filed 1999·Granted Jan 29, 2002·506 cites·11 claims
- 0298US6153935ADual etch stop/diffusion barrier for damascene interconnectsIBM·Filed 1999·Granted Nov 28, 2000·376 cites·22 claims
- 0398US5755859ACobalt-tin alloys and their applications for devices, chip interconnections and packagingIBM·Filed 1995·Granted May 26, 1998·405 cites·9 claims
- 0497US6573606B2Chip to wiring interface with single metal alloy layer applied to surface of copper interconnectIBM·Filed 2001·Granted Jun 3, 2003·307 cites·8 claims
- 0597US6358832B1Method of forming barrier layers for damascene interconnectsIBM·Filed 2000·Granted Mar 19, 2002·119 cites·27 claims
- 0697US6335104B1Method for preparing a conductive pad for electrical connection and conductive pad formedIBM·Filed 2000·Granted Jan 1, 2002·155 cites·45 claims
- 0796US6332569B1Etched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 2000·Granted Dec 25, 2001·97 cites·12 claims
- 0896US6323128B1Method for forming Co-W-P-Au filmsIBM·Filed 1999·Granted Nov 27, 2001·292 cites·20 claims
- 0994US6503834B1Process to increase reliability CuBEOL structuresIBM·Filed 2000·Granted Jan 7, 2003·79 cites·16 claims
- 1094US6268016B1Manufacturing computer systems with fine line circuitized substratesIBM·Filed 1996·Granted Jul 31, 2001·89 cites·21 claims
- 1193US4448804AMethod for selective electroless plating of copper onto a non-conductive substrate surfaceIBM·Filed 1983·Granted May 15, 1984·80 cites·20 claims
- 1292US7468320B2Reduced electromigration and stressed induced migration of copper wires by surface coatingIBM·Filed 2005·Granted Dec 23, 2008·14 cites·9 claims
- 1392US5775569AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1996·Granted Jul 7, 1998·120 cites·16 claims
- 1491US6105852AEtched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 1998·Granted Aug 22, 2000·73 cites·7 claims
- 1590US6646345B2Method for forming Co-W-P-Au filmsIBM·Filed 2001·Granted Nov 11, 2003·45 cites·5 claims
- 1690US4026713AWater based magnetic inks and the manufacture thereofIBM·Filed 1975·Granted May 31, 1977·40 cites·22 claims
- 1788US4478883AConditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrateIBM·Filed 1982·Granted Oct 23, 1984·57 cites·27 claims
- 1885US6819000B2High density area array solder microjoining interconnect structure and fabrication methodIBM·Filed 2003·Granted Nov 16, 2004·28 cites·4 claims
- 1985US6149122AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Nov 21, 2000·61 cites·5 claims
- 2084US6340630B1Method for making interconnect for low temperature chip attachmentIBM·Filed 2000·Granted Jan 22, 2002·28 cites·18 claims
- 2184US4948707AConditioning a non-conductive substrate for subsequent selective deposition of a metal thereonIBM·Filed 1988·Granted Aug 14, 1990·52 cites·20 claims
- 2284US4554182AMethod for conditioning a surface of a dielectric substrate for electroless platingIBM·Filed 1985·Granted Nov 19, 1985·50 cites·46 claims
- 2383US6457234B1Process for manufacturing self-aligned corrosion stop for copper C4 and wirebondIBM·Filed 1999·Granted Oct 1, 2002·53 cites·12 claims
- 2480US6127735AInterconnect for low temperature chip attachmentIBM·Filed 1996·Granted Oct 3, 2000·41 cites·15 claims
- 2578US6661098B2High density area array solder microjoining interconnect structure and fabrication methodIBM·Filed 2002·Granted Dec 9, 2003·18 cites·16 claims
- 2678US6133633AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Oct 17, 2000·40 cites·4 claims
- 2777US7273803B2Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structureIBM·Filed 2003·Granted Sep 25, 2007·16 cites·14 claims
- 2877US6779711B2Self-aligned corrosion stop for copper C4 and wirebondIBM·Filed 2002·Granted Aug 24, 2004·18 cites·10 claims
- 2977US5310580AElectroless metal adhesion to organic dielectric material with phase separated morphologyIBM·Filed 1992·Granted May 10, 1994·38 cites·16 claims
- 3076US6566612B2Method for direct chip attach by solder bumps and an underfill layerIBM·Filed 2002·Granted May 20, 2003·20 cites·8 claims
- 3175US5509557ADepositing a conductive metal onto a substrateIBM·Filed 1994·Granted Apr 23, 1996·40 cites·22 claims
- 3275US4525390ADeposition of copper from electroless plating compositionsIBM·Filed 1984·Granted Jun 25, 1985·27 cites·20 claims
- 3373US6732908B2High density raised stud microjoining system and methods of fabricating the sameIBM·Filed 2002·Granted May 11, 2004·19 cites·15 claims
- 3473US5897336ADirect chip attach for low alpha emission interconnect systemIBM·Filed 1997·Granted Apr 27, 1999·42 cites·43 claims
- 3571US5079070ARepair of open defects in thin film conductorsIBM·Filed 1990·Granted Jan 7, 1992·31 cites·21 claims
- 3670US6436803B2Manufacturing computer systems with fine line circuitized substratesIBM·Filed 2001·Granted Aug 20, 2002·11 cites·33 claims
- 3769US5866044ALead free conductive composites for electrical interconnectionsIBM·Filed 1996·Granted Feb 2, 1999·32 cites·4 claims
- 3868US5105537AMethod for making a detachable electrical contactIBM·Filed 1990·Granted Apr 21, 1992·25 cites·5 claims
- 3966US6099939AEnhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphologyIBM·Filed 1997·Granted Aug 8, 2000·35 cites·20 claims
- 4064US5545429AFabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocessIBM·Filed 1994·Granted Aug 13, 1996·25 cites·47 claims
- 4163US7033648B1Means of seeding and metallizing polyimideIBM·Filed 1996·Granted Apr 25, 2006·25 cites·11 claims
- 4263US6013713AElectrode modification using an unzippable polymer pasteIBM·Filed 1997·Granted Jan 11, 2000·18 cites·5 claims
- 4362US7081680B2Self-aligned corrosion stop for copper C4 and wirebondIBM·Filed 2004·Granted Jul 25, 2006·7 cites·24 claims
- 4462US4107063AWater based selectable charge magnetic inksIBM·Filed 1977·Granted Aug 15, 1978·11 cites·37 claims
- 4561US6747472B2Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the sameIBM·Filed 2002·Granted Jun 8, 2004·8 cites·22 claims
- 4661US6197222B1Lead free conductive composites for electrical interconnectionsIBM·Filed 1998·Granted Mar 6, 2001·22 cites·4 claims
- 4761US4441938ASoldering fluxIBM·Filed 1983·Granted Apr 10, 1984·14 cites·20 claims
- 4859US7825516B2Formation of aligned capped metal lines and interconnections in multilevel semiconductor structuresIBM·Filed 2002·Granted Nov 2, 2010·9 cites·1 claims
- 4959US6656750B1Method for testing chips on flat solder bumpsIBM·Filed 1999·Granted Dec 2, 2003·17 cites·7 claims
- 5059US6341418B1Method for direct chip attach by solder bumps and an underfill layerIBM·Filed 1999·Granted Jan 29, 2002·21 cites·23 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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