Inventor · disambiguated record
Masayuki Miyairi
Also filed as: MIYAIRI MASAYUKI
13 granted patents·1 pending application·54 citations·filing 1999–2020
86Inventor score
Top patents by PatentIndex Score
14 records- 0180US7789287B2Method of bondingTANAKA PRECIOUS METAL IND·Filed 2007·Granted Sep 7, 2010·10 cites·18 claims
- 0278US8505804B2Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric deviceOGASHIWA TOSHINORI·Filed 2008·Granted Aug 13, 2013·8 cites·3 claims
- 0366US6174462B1Conductive paste composition including conductive metallic powderDENSO CORP·Filed 1999·Granted Jan 16, 2001·36 cites·23 claims
- 0458US12000019B2Gold powder, production method for gold powder, and gold pasteTANAKA PRECIOUS METAL IND·Filed 2020·Granted Jun 4, 2024·0 cites·14 claims
- 0549US8962471B2Bump, method for forming the bump, and method for mounting substrate having the bump thereonOGASHIWA TOSHINORI·Filed 2013·Granted Feb 24, 2015·0 cites·20 claims
- 0649US8558433B2Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric deviceOGASHIWA TOSHINORI·Filed 2012·Granted Oct 15, 2013·0 cites·4 claims
- 0747US10366963B2Noble metal paste for bonding of semiconductor elementTANAKA PRECIOUS METAL IND·Filed 2016·Granted Jul 30, 2019·0 cites·11 claims
- 0847US9561952B2Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package memberTANAKA PRECIOUS METAL IND·Filed 2014·Granted Feb 7, 2017·0 cites·17 claims
- 0944US8492894B2Bump, method for forming the bump, and method for mounting substrate having the bump thereonOGASHIWA TOSHINORI·Filed 2010·Granted Jul 23, 2013·0 cites·3 claims
- 1041US2015014399A1Conductive paste for die bonding, and die bonding method with the conductive pasteTANAKA PRECIOUS METAL IND·Filed 2013·Application pending·0 cites
- 1139US10870151B2Structure and method for sealing through-hole, and transfer substrate for sealing through-holeTANAKA PRECIOUS METAL IND·Filed 2018·Granted Dec 22, 2020·0 cites·12 claims
- 1239US9539671B2Precious metal paste for bonding semiconductor elementMIYAIRI MASAYUKI·Filed 2011·Granted Jan 10, 2017·0 cites·11 claims
- 1338US11626334B2Through-hole sealing structureTANAKA PRECIOUS METAL IND·Filed 2017·Granted Apr 11, 2023·0 cites·20 claims
- 1435US10125015B2Package production method and package produced by the methodTANAKA PRECIOUS METAL IND·Filed 2015·Granted Nov 13, 2018·0 cites·17 claims
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