Inventor · disambiguated record
Syadwad Jain
Also filed as: JAIN SYADWAD
10 granted patents·2 pending applications·68 citations·filing 2013–2021
86Inventor score
Files withINTEL CORP12
Top patents by PatentIndex Score
12 records- 0194US8896110B2Paste thermal interface materialsINTEL CORP·Filed 2013·Granted Nov 25, 2014·30 cites·27 claims
- 0293US9070660B2Polymer thermal interface material having enhanced thermal conductivityINTEL CORP·Filed 2013·Granted Jun 30, 2015·16 cites·26 claims
- 0389US10580717B2Multiple-chip package with multiple thermal interface materialsINTEL CORP·Filed 2016·Granted Mar 3, 2020·11 cites·19 claims
- 0488US10651108B2Foam compositeINTEL CORP·Filed 2016·Granted May 12, 2020·4 cites·7 claims
- 0579US10056314B2Polymer thermal interface material having enhanced thermal conductivityINTEL CORP·Filed 2015·Granted Aug 21, 2018·3 cites·13 claims
- 0665US8866290B2Molded heat spreadersINTEL CORP·Filed 2013·Granted Oct 21, 2014·2 cites·25 claims
- 0761US10969840B2Heat spreaders with interlocked insertsINTEL CORP·Filed 2015·Granted Apr 6, 2021·1 cites·21 claims
- 0861US10763188B2Integrated heat spreader having electromagnetically-formed featuresINTEL CORP·Filed 2015·Granted Sep 1, 2020·1 cites·4 claims
- 0959US11652018B2Heat spreader edge standoffs for managing bondline thickness in microelectronic packagesINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 1047US11062970B2Heat spreader edge standoffs for managing bondline thickness in microelectronic packagesINTEL CORP·Filed 2017·Granted Jul 13, 2021·0 cites·10 claims
- 1131US2019027379A1Sintered heat spreaders with insertsINTEL CORP·Filed 2015·Application pending·0 cites
- 1230US2018323130A1Adhesive polymer thermal interface material with sintered fillers for thermal conductivity in micro-electronic packagingINTEL CORP·Filed 2015·Application pending·0 cites
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