Inventor · disambiguated record
Ronilo Boja
Also filed as: BOJA RONILO · BOJA RONILO V
7 granted patents·3 pending applications·34 citations·filing 1993–2025
80Inventor score
Top patents by PatentIndex Score
10 records- 0193US10438863B1Chip package assembly with surface mounted component protectionXILINX INC·Filed 2018·Granted Oct 8, 2019·13 cites·20 claims
- 0292US10764996B1Chip package assembly with composite stiffenerXILINX INC·Filed 2018·Granted Sep 1, 2020·11 cites·20 claims
- 0376US8810028B1Integrated circuit packaging devices and methodsZOHNI NAEL·Filed 2010·Granted Aug 19, 2014·6 cites·15 claims
- 0465US11201095B1Chip package having a cover with windowXILINX INC·Filed 2019·Granted Dec 14, 2021·1 cites·16 claims
- 0551US2024222213A1Embedded silicon-based device components in a thick core substrate of an integrated circuit packageNVIDIA CORP·Filed 2022·Application pending·0 cites
- 0651US2024222221A1Mixed phase thermal interface material assembly with high thermal conductivity and low internal contact resistanceNVIDIA CORP·Filed 2023·Application pending·0 cites
- 0750US10219387B2Process for manufacturing a printed circuit board having high density microvias formed in a thick substrateNVIDIA CORP·Filed 2013·Granted Feb 26, 2019·0 cites·22 claims
- 0850US2025343099A1Hybrid Material Lid, Heat Sink, or Cold Plate for Semiconductor PackagesNVIDIA CORP·Filed 2025·Application pending·0 cites
- 0946US9659815B2System, method, and computer program product for a cavity package-on-package structureNVIDIA CORP·Filed 2014·Granted May 23, 2017·0 cites·20 claims
- 1026US5381641ABGA funnelADVANCED MICRO DEVICES INC·Filed 1993·Granted Jan 17, 1995·3 cites·20 claims
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