Inventor · disambiguated record
Tien-Chung Yang
Also filed as: YANG TIEN-CHUNG
28 granted patents·13 pending applications·165 citations·filing 2010–2025
95Inventor score
Top patents by PatentIndex Score
41 records- 0198US10090284B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·43 cites·20 claims
- 0298US9859258B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·40 cites·20 claims
- 0397US11842983B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·3 cites·20 claims
- 0497US9793246B1Pop devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·30 cites·20 claims
- 0595US9806059B1Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·11 cites·20 claims
- 0692US11177238B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·5 cites·20 claims
- 0792US9922939B2Wafer level shielding in multi-stacked fan out packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 20, 2018·8 cites·20 claims
- 0891US10163701B2Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·6 cites·20 claims
- 0990US9659878B2Wafer level shielding in multi-stacked fan out packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·7 cites·20 claims
- 1089US10510715B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 17, 2019·5 cites·20 claims
- 1188US2025364441A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1288US2025372540A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1380US2025357458A1Semiconductor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1480US2025364384A1Reduction of cracks in redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1580US2024387401A1Semiconductor device with electromagnetic interference film and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1680US2025364391A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1777US10276542B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·3 cites·20 claims
- 1876US12019809B2Method for identifying size of object, optical sensing apparatus and systemPIXART IMAGING INC·Filed 2023·Granted Jun 25, 2024·0 cites·13 claims
- 1975US12482763B2Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 2074US9941248B2Package structures, pop devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·2 cites·20 claims
- 2173US11133197B2Semiconductor structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·1 cites·20 claims
- 2272US12237039B2Device ID setting method and electronic device applying the device ID setting methodPIXART IMAGING INC·Filed 2024·Granted Feb 25, 2025·0 cites·16 claims
- 2372US10825780B2Semiconductor device with electromagnetic interference protection and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 3, 2020·1 cites·20 claims
- 2470US12476178B2Reduction of cracks in redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 2570US12243833B2Semiconductor device with electromagnetic interference film and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 4, 2025·0 cites·20 claims
- 2666US11662828B2Method for identifying object, optical sensing apparatus and systemPIXART IMAGING INC·Filed 2021·Granted May 30, 2023·0 cites·16 claims
- 2766US2024038649A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2865US2023420438A1Semiconductor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2961US10217687B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 26, 2019·0 cites·20 claims
- 3060US2025323177A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3158US11915780B2Device ID setting method and electronic device applying the device ID setting methodPIXART IMAGING INC·Filed 2021·Granted Feb 27, 2024·0 cites·16 claims
- 3258US9929069B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·0 cites·20 claims
- 3357US12469807B2Fan-out package structures with cascaded openings in enhancement layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 3457US2024379571A1Semiconductor package with under-bump metallization providing improved package reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3555US11145633B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 12, 2021·0 cites·20 claims
- 3655US9564345B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·0 cites·20 claims
- 3754US2024047321A1Integrated fan-out package and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3850US2025246567A1Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3949US10340155B2Semiconductor structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 2, 2019·0 cites·19 claims
- 4044US2022137723A1Force sensor device and method for detecting force based on temporal or spatial differential imagePIXART IMAGING INC·Filed 2022·Application pending·0 cites
- 4138US8325534B2Concurrent operation of plural flash memoriesYANG TIEN-CHUNG·Filed 2010·Granted Dec 4, 2012·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →