Inventor · disambiguated record
Min Hao Hong
Also filed as: HONG MIN-HAO
25 granted patents·1 pending application·63 citations·filing 2011–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14JANGJIAN SHIU-KO5TAIWAN SEMICONDUCTOR MFG3CHOU YOU-HUA2Hong min hao1
Top patents by PatentIndex Score
26 records- 0197US9257476B2Grids in backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Feb 9, 2016·11 cites·20 claims
- 0296US9478581B2Grids in backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 25, 2016·9 cites·20 claims
- 0393US10357867B2Polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 23, 2019·8 cites·20 claims
- 0490US11961884B2Fill structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·2 cites·20 claims
- 0588US9041140B2Grids in backside illumination image sensor chips and methods for forming the sameJANGJIAN SHIU-KO·Filed 2012·Granted May 26, 2015·4 cites·19 claims
- 0686US8518818B2Reverse damascene processCHOU YOU-HUA·Filed 2011·Granted Aug 27, 2013·8 cites·11 claims
- 0784US8772899B2Method and apparatus for backside illumination sensorJANGJIAN SHIU-KO·Filed 2012·Granted Jul 8, 2014·3 cites·20 claims
- 0882US9718164B2Polishing system and polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 1, 2017·4 cites·20 claims
- 0982US9536834B2Reverse damascene processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 3, 2017·5 cites·20 claims
- 1081US10204807B2Apparatus and method for processing waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 1179US12324199B2Fill structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 1275US9607946B2Reverse damascene processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 28, 2017·3 cites·20 claims
- 1375US2025275194A1Fill Structures With Air GapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1467US9214514B2Mechanisms for forming semiconductor device having stable dislocation profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 15, 2015·2 cites·21 claims
- 1564US11358252B2Method of using a polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·20 claims
- 1664US9368540B2CIS image sensors with epitaxy layers and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 14, 2016·1 cites·20 claims
- 1762US8889461B2CIS image sensors with epitaxy layers and methods for forming the sameJANGJIAN SHIU-KO·Filed 2012·Granted Nov 18, 2014·1 cites·21 claims
- 1861US10861721B2Apparatus and method for processing waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 1958US9006070B2Two-step shallow trench isolation (STI) processTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 14, 2015·0 cites·20 claims
- 2055US9502280B2Two-step shallow trench isolation (STI) processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims
- 2153US9786707B2Image sensor isolation region and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 10, 2017·0 cites·20 claims
- 2250US9673244B2Image sensor isolation region and method of forming the sameJANGJIAN SHIU-KO·Filed 2012·Granted Jun 6, 2017·0 cites·20 claims
- 2348US8692299B2Two-step shallow trench isolation (STI) processHong min hao·Filed 2012·Granted Apr 8, 2014·0 cites·20 claims
- 2445US8796105B2Method and apparatus for preparing polysilazane on a semiconductor waferCHOU YOU-HUA·Filed 2012·Granted Aug 5, 2014·0 cites·19 claims
- 2543US9349902B2System and method for reducing irregularities on the surface of a backside illuminated photodiodeJANGJIAN SHIU-KO·Filed 2012·Granted May 24, 2016·0 cites·20 claims
- 2638US8455883B2Stressed semiconductor device and method of manufacturingLIAO MIAO-CHENG·Filed 2011·Granted Jun 4, 2013·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →