Inventor · disambiguated record
Kenzo Yasuda
Also filed as: YASUDA KENZO
8 granted patents·8 pending applications·53 citations·filing 1999–2025
85Inventor score
Top patents by PatentIndex Score
16 records- 0189US9718385B2Vehicle seatNHK SPRING CO LTD·Filed 2015·Granted Aug 1, 2017·5 cites·7 claims
- 0280US9586508B2Vehicle seatNHK SPRING CO LTD·Filed 2015·Granted Mar 7, 2017·6 cites·7 claims
- 0377US9610871B2Vehicle seatNHK SPRING CO LTD·Filed 2015·Granted Apr 4, 2017·5 cites·3 claims
- 0476US8985696B2Vehicle seatYASUDA KENZO·Filed 2012·Granted Mar 24, 2015·11 cites·5 claims
- 0566US8936310B2Headrest and vehicle seat provided with the sameTAKAYAMA MASAMI·Filed 2012·Granted Jan 20, 2015·6 cites·3 claims
- 0661US2025276625A1Blower protection structure of a seatback, and vehicle seatNHK SPRING CO LTD·Filed 2025·Application pending·0 cites
- 0759US2025276624A1Blower protection structure of a seatback, and vehicle seatNHK SPRING CO LTD·Filed 2025·Application pending·0 cites
- 0858US9126517B2Vehicle seatNHK SPRING CO LTD·Filed 2014·Granted Sep 8, 2015·2 cites·4 claims
- 0955US2024359605A1Vehicle seatNHK SPRING CO LTD·Filed 2024·Application pending·0 cites
- 1053US2025010771A1Driver's seat heater and automobile driver's seatNHK SPRING CO LTD·Filed 2024·Application pending·0 cites
- 1153US2025074275A1Vehicle seatNHK SPRING CO LTD·Filed 2024·Application pending·0 cites
- 1252US2025010775A1Seatback pad and vehicle seatNHK SPRING CO LTD·Filed 2024·Application pending·0 cites
- 1352US2025074273A1Vehicle seatNHK SPRING CO LTD·Filed 2024·Application pending·0 cites
- 1449US6204486B1Heater unit for semiconductor processingNHK SPRING CO LTD·Filed 1999·Granted Mar 20, 2001·17 cites·16 claims
- 1546US9783091B2Seatback frame and resin for employing in a seatback frameNHK SPRING CO LTD·Filed 2015·Granted Oct 10, 2017·1 cites·7 claims
- 1639US2015273813A1Fiber-reinforced resin plate punching method and fiber-reinforced resin product fabrication methodNHK SPRING CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →