Inventor · disambiguated record
Jin Seon Park
Also filed as: PARK JIN SEON
24 granted patents·7 pending applications·52 citations·filing 2008–2023
93Inventor score
Top patents by PatentIndex Score
31 records- 0190US11217543B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·2 cites·18 claims
- 0290US10763225B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·6 cites·20 claims
- 0389US8339796B2Embedded printed circuit board and method of manufacturing the sameLEE SANG CHUL·Filed 2010·Granted Dec 25, 2012·10 cites·4 claims
- 0485US11539138B2Chip radio frequency package and radio frequency moduleSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 27, 2022·1 cites·20 claims
- 0581US8305766B2Electronic component-embedded printed circuit board and method of manufacturing the samePARK JIN SEON·Filed 2010·Granted Nov 6, 2012·6 cites·9 claims
- 0680US11177449B2P-type semiconductor layer, P-type multilevel element, and manufacturing method for the elementUNIV HANYANG IND UNIV COOP FOUND·Filed 2019·Granted Nov 16, 2021·3 cites·23 claims
- 0779US11133592B2Chip radio frequency package and radio frequency moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 28, 2021·1 cites·18 claims
- 0879US7886414B2Method of manufacturing capacitor-embedded PCBSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 15, 2011·7 cites·5 claims
- 0977US8302270B2Method of manufacturing capacitor-embedded PCBKIM WOON-CHUN·Filed 2011·Granted Nov 6, 2012·3 cites·5 claims
- 1076US11095037B2Antenna moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 17, 2021·2 cites·10 claims
- 1173US8881382B2Embedded printed circuit board and method of manufacturing the sameLEE SANG CHUL·Filed 2011·Granted Nov 11, 2014·3 cites·8 claims
- 1273US8826527B2Electronic component-embedded printed circuit board and method of manufacturing the samePARK JIN SEON·Filed 2012·Granted Sep 9, 2014·3 cites·9 claims
- 1368US11732354B2Method and apparatus for forming layer, metal oxide transistor and fabrication method thereofIUCF HYU·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 1467US10790595B2Antenna module and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 29, 2020·1 cites·19 claims
- 1565US11909099B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1665US10270948B2Substrate for camera module and camera module having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Apr 23, 2019·1 cites·5 claims
- 1765US8552305B2Electronic component-embedded printed circuit boardPARK JIN SEON·Filed 2009·Granted Oct 8, 2013·3 cites·6 claims
- 1863US11183765B2Chip radio frequency package and radio frequency moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 23, 2021·0 cites·22 claims
- 1960US2024296341A1Apparatus and method for tackling data heterogeneity in federated learning using intermediate layer representation regularizationUNIV INDUSTRY COOPERATION GROUP KYUNG HEE UNIV·Filed 2023·Application pending·0 cites
- 2059US10985247B2Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel elementIUCF HYU·Filed 2018·Granted Apr 20, 2021·0 cites·12 claims
- 2159US10978561B2Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel elementIUCF HYU·Filed 2018·Granted Apr 13, 2021·0 cites·8 claims
- 2258US10991831B2Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel elementIUCF HYU·Filed 2018·Granted Apr 27, 2021·0 cites·18 claims
- 2357US11177551B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 16, 2021·0 cites·13 claims
- 2457US11015243B2Method and apparatus for forming layer, metal oxide transistor and fabrication method thereofIUCF HYU·Filed 2018·Granted May 25, 2021·0 cites·11 claims
- 2551US2015195905A1Package board, method of manufacturing the same, and semiconductor package using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2649US11101840B1Chip radio frequency package and radio frequency moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 24, 2021·0 cites·17 claims
- 2748US2022293867A1Organic-inorganic hybrid layer, organic-inorganic laminate comprising same layer, and organic electronic element comprising same laminate as gas barrierIUCF HYU·Filed 2020·Application pending·0 cites
- 2845US2015351228A1Package board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2940US2019229055A1Fan-out sensor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 3033US2015348918A1Package substrate, package, package on package and manufacturing method of package substrateSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3133US2015351247A1Package board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →