Inventor · disambiguated record
Christopher Hess
Also filed as: HESS CHRISTOPHER · HESS CHRISTOPHER K · HESS CHRISTOPHER L
132 granted patents·8 pending applications·1,806 citations·filing 2000–2024
99Inventor score
Top patents by PatentIndex Score
140 records- 0199US9496119B1E-beam inspection apparatus and method of using the same on various integrated circuit chipsPDF SOLUTIONS INC·Filed 2016·Granted Nov 15, 2016·77 cites·21 claims
- 0299US7461043B2Methods and apparatus to abstract events in software applications or servicesSIEMENS AG·Filed 2005·Granted Dec 2, 2008·205 cites·15 claims
- 0398US10593604B1Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2016·Granted Mar 17, 2020·19 cites·19 claims
- 0498US9870962B1Integrated circuit including NCEM-enabled, interlayer overlap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gatesPDF SOLUTIONS INC·Filed 2017·Granted Jan 16, 2018·13 cites·19 claims
- 0598US9799575B2Integrated circuit containing DOEs of NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2016·Granted Oct 24, 2017·19 cites·11 claims
- 0698US7751807B2Method and system for a hosted mobile management service architectureOOMBLE INC·Filed 2007·Granted Jul 6, 2010·141 cites·13 claims
- 0798US6834375B1System and method for product yield prediction using a logic characterization vehiclePDF SOLUTIONS INC·Filed 2000·Granted Dec 21, 2004·246 cites·11 claims
- 0897US9805994B1Mesh-style NCEM pads, and process for making semiconductor dies, chips, and wafers using in-line measurements from such padsPDF SOLUTIONS INC·Filed 2016·Granted Oct 31, 2017·15 cites·18 claims
- 0997US9627370B1Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and TS-short-configured, NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2016·Granted Apr 18, 2017·15 cites·20 claims
- 1097US6901564B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2002·Granted May 31, 2005·143 cites·45 claims
- 1196US10978438B1IC with test structures and E-beam pads embedded within a contiguous standard cell areaPDF SOLUTIONS INC·Filed 2019·Granted Apr 13, 2021·9 cites·14 claims
- 1296USD829231SDisplay screen or portion thereof with graphical user interfaceACTION TARGET INC·Filed 2017·Granted Sep 25, 2018·90 cites·1 claims
- 1396US8417772B2Method and system for transferring content from the web to mobile devicesLIN DANIEL J·Filed 2011·Granted Apr 9, 2013·29 cites·20 claims
- 1495US7716281B2Method and system for transferring content from the web to mobile devicesOOMBLE INC·Filed 2007·Granted May 11, 2010·51 cites·20 claims
- 1595US7174521B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2005·Granted Feb 6, 2007·32 cites·36 claims
- 1694US8484089B1Method and system for a hosted digital music library sharing serviceLIN DANIEL J·Filed 2009·Granted Jul 9, 2013·50 cites·20 claims
- 1794US7920856B2Method and system for hosted mobile management service architectureOOMBLE INC·Filed 2010·Granted Apr 5, 2011·18 cites·20 claims
- 1893US9741703B1Integrated circuit containing standard logic cells and ilbrary-compatible, NCEM-enabled fill cells, including at least via-open-configured, gate-short-configured, TS-short-configured, and AA-short-conigured, NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2016·Granted Aug 22, 2017·4 cites·20 claims
- 1993US9691672B1Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and metal-short-configured, NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2017·Granted Jun 27, 2017·4 cites·20 claims
- 2093US9627371B1Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and AA-short-configured, NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2016·Granted Apr 18, 2017·7 cites·20 claims
- 2193US8571535B1Method and system for a hosted mobile management service architectureLIN DANIEL J·Filed 2012·Granted Oct 29, 2013·13 cites·20 claims
- 2293US7487474B2Designing an integrated circuit to improve yield using a variant design elementPDF SOLUTIONS INC·Filed 2003·Granted Feb 3, 2009·182 cites·64 claims
- 2392US8178876B2Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturingHESS CHRISTOPHER·Filed 2004·Granted May 15, 2012·81 cites·42 claims
- 2492US8086226B2Method and system for a hosted mobile management service architectureLIN DANIEL J·Filed 2011·Granted Dec 27, 2011·11 cites·38 claims
- 2592US7434197B1Method for improving mask layout and fabricationPDF SOLUTIONS INC·Filed 2005·Granted Oct 7, 2008·21 cites·21 claims
- 2692US7356800B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2006·Granted Apr 8, 2008·15 cites·20 claims
- 2791US7673262B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2008·Granted Mar 2, 2010·11 cites·20 claims
- 2891US7373625B2System and method for product yield predictionPDF SOLUTIONS INC·Filed 2006·Granted May 13, 2008·12 cites·29 claims
- 2990US10199288B1Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one side-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective side-to-side short, corner short, and via open test areasPDF SOLUTIONS INC·Filed 2018·Granted Feb 5, 2019·2 cites·20 claims
- 3090US10199283B1Method for processing a semiconductor wager using non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three parallel conductive stripes using a moving stage with beam deflection to account for motion of the stagePDF SOLUTIONS INC·Filed 2017·Granted Feb 5, 2019·3 cites·20 claims
- 3190US9905487B1Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on test wafers that include multiple means/steps for enabling NC detection of V0 via opensPDF SOLUTIONS INC·Filed 2016·Granted Feb 27, 2018·3 cites·10 claims
- 3289US9786648B1Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATECNT-short-configured, and TS-short-configured, NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2016·Granted Oct 10, 2017·2 cites·20 claims
- 3389US9773773B1Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and GATECNT-short-configured, NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2016·Granted Sep 26, 2017·2 cites·20 claims
- 3489US9761575B1Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2016·Granted Sep 12, 2017·2 cites·20 claims
- 3589US8024400B2Method and system for transferring content from the web to mobile devicesOOMBLE INC·Filed 2007·Granted Sep 20, 2011·20 cites·28 claims
- 3689US7902852B1High density test structure array to support addressable high accuracy 4-terminal measurementsPDF SOLUTIONS INC·Filed 2007·Granted Mar 8, 2011·19 cites·20 claims
- 3788US9927216B2Target systemACTION TARGET INC·Filed 2016·Granted Mar 27, 2018·5 cites·26 claims
- 3888US9313296B1Method and system for a hosted mobile management service architectureLIN DANIEL J·Filed 2012·Granted Apr 12, 2016·5 cites·20 claims
- 3988US7509320B2Methods and apparatus to determine context relevant informationSIEMENS AG·Filed 2005·Granted Mar 24, 2009·18 cites·32 claims
- 4087US12429520B2Systems, devices, and methods for performing a non-contact electrical measurement on a cell, non-contact electrical measurement cell vehicle, chip, wafer, die, or logic blockPDF SOLUTIONS INC·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 4187US10290552B1Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stagePDF SOLUTIONS INC·Filed 2018·Granted May 14, 2019·2 cites·20 claims
- 4287US10199294B1Method for processing a semiconductor wafer using non-contact electrical measurements indicative of a least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stagePDF SOLUTIONS INC·Filed 2018·Granted Feb 5, 2019·1 cites·20 claims
- 4387US9761573B1Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cellsPDF SOLUTIONS INC·Filed 2016·Granted Sep 12, 2017·2 cites·20 claims
- 4487US9219797B2Method and system for a hosted mobile management service architectureLIN DANIEL J·Filed 2011·Granted Dec 22, 2015·5 cites·30 claims
- 4586US10096530B1Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including stitch open configured fill cellsPDF SOLUTIONS INC·Filed 2017·Granted Oct 9, 2018·4 cites·14 claims
- 4686US7783645B2Methods and apparatus to recall context relevant informationSIEMENS AG·Filed 2005·Granted Aug 24, 2010·17 cites·37 claims
- 4785US9947601B1Integrated circuit including NCEM-enabled, side-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gatesPDF SOLUTIONS INC·Filed 2017·Granted Apr 17, 2018·1 cites·19 claims
- 4884US9922968B1Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including chamfer short configured fill cellsPDF SOLUTIONS INC·Filed 2017·Granted Mar 20, 2018·1 cites·23 claims
- 4984US9773774B1Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cellsPDF SOLUTIONS INC·Filed 2017·Granted Sep 26, 2017·4 cites·17 claims
- 5084US9721937B1Integrated circuit containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-tip short configured fill cellsPDF SOLUTIONS INC·Filed 2017·Granted Aug 1, 2017·1 cites·23 claims
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