Inventor · disambiguated record
Takeshi Kishida
Also filed as: KISHIDA TAKESHI
25 granted patents·8 pending applications·216 citations·filing 1998–2025
95Inventor score
Files withRENESAS TECH CORP6MITSUBISHI ELECTRIC CORP5MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4PANASONIC CORP4ELPIDA MEMORY INC3
Top patents by PatentIndex Score
33 records- 0191US6549999B2Data processorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 15, 2003·47 cites·10 claims
- 0289US7969470B2Moving object detection apparatus, method and programSONY CORP·Filed 2006·Granted Jun 28, 2011·22 cites·10 claims
- 0378US10134742B2Semiconductor device including a semiconductor substrate, a pillar, and a beamMICRON TECHNOLOGY INC·Filed 2015·Granted Nov 20, 2018·3 cites·12 claims
- 0478US6199155B1Data processorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Mar 6, 2001·52 cites·26 claims
- 0576US7829983B2Semiconductor devicePANASONIC CORP·Filed 2006·Granted Nov 9, 2010·8 cites·6 claims
- 0669US7979676B2Method for instructing a data processor to process dataPANASONIC CORP·Filed 2009·Granted Jul 12, 2011·2 cites·10 claims
- 0769US6787878B1Semiconductor device having a potential fuse, and method of manufacturing the sameRENESAS TECH CORP·Filed 2000·Granted Sep 7, 2004·17 cites·1 claims
- 0858US8650386B2Data processor including an operation unit to execute operations in parallelPANASONIC CORP·Filed 2013·Granted Feb 11, 2014·0 cites·23 claims
- 0955US6744143B1Semiconductor device having test markRENESAS TECH CORP·Filed 2000·Granted Jun 1, 2004·5 cites·8 claims
- 1055US2025324716A1Semiconductor device and method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1154US6337268B1Method of manufacturing contact structureMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jan 8, 2002·7 cites·9 claims
- 1254US6313005B1Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 6, 2001·7 cites·11 claims
- 1353US7664934B2Data processor decoding instruction formats using operand dataPANASONIC CORP·Filed 2007·Granted Feb 16, 2010·0 cites·10 claims
- 1453US2025203997A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1553US2025351430A1Manufacturing method of a semiconductor wafer and a semiconductor waferRENESAS ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1652US6065112AMicroprocessor with arithmetic processing units and arithmetic execution unitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted May 16, 2000·26 cites·14 claims
- 1751US8900968B2Method for manufacturing a semiconductor deviceELPIDA MEMORY INC·Filed 2013·Granted Dec 2, 2014·0 cites·20 claims
- 1851US8443173B2Method for instructing a data processor to process dataKISHIDA TAKESHI·Filed 2011·Granted May 14, 2013·0 cites·3 claims
- 1947US6348950B1Video signal processing circuit and image pickup apparatus using the circuitSONY CORP·Filed 1999·Granted Feb 19, 2002·12 cites·6 claims
- 2046US7194602B2Data processorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 20, 2007·0 cites·8 claims
- 2146US6673671B1Semiconductor device, and method of manufacturing the sameRENESAS TECH CORP·Filed 2000·Granted Jan 6, 2004·3 cites·3 claims
- 2245US8564037B2Semiconductor device having isolation groove and device formation portionKISHIDA TAKESHI·Filed 2011·Granted Oct 22, 2013·0 cites·20 claims
- 2344US8952461B2Semiconductor device, designing method therefor, and manufacturing method thereforELPIDA MEMORY INC·Filed 2013·Granted Feb 10, 2015·0 cites·14 claims
- 2444US6400022B1Semiconductor device and fabrication process therefor and capacitor structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 4, 2002·2 cites·10 claims
- 2541US2011012245A1Semiconductor deviceYAMADA YUTAKA·Filed 2010·Application pending·0 cites
- 2641US2007272963A1Semiconductor device and method for fabricating the sameELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 2739US8742512B2Border between semiconductor transistors with different gate structuresKISHIDA TAKESHI·Filed 2012·Granted Jun 3, 2014·0 cites·20 claims
- 2835US6775920B2Method of fabricating semiconductor device comprising superposition inspection stepRENESAS TECH CORP·Filed 2003·Granted Aug 17, 2004·0 cites·5 claims
- 2935US2004150030A1Semiconductor device, and method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 3034US6251741B1Method of manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jun 26, 2001·3 cites·4 claims
- 3134US2006053274A1Information processing apparatus for changing firmware dataNYUUGAKU MASAHITO·Filed 2005·Application pending·0 cites
- 3232US6977199B2Method of fabricating semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Dec 20, 2005·0 cites·16 claims
- 3332US2003022489A1Method of fabricating high melting point metal wiring layer, method of fabricating semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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