Inventor · disambiguated record
Satoshi Enokido
Also filed as: ENOKIDO SATOSHI
13 granted patents·1 pending application·121 citations·filing 1995–2020
91Inventor score
Files withSHINKAWA KK14
Top patents by PatentIndex Score
14 records- 0181US6464126B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2001·Granted Oct 15, 2002·32 cites·10 claims
- 0279US7324684B2Bonding apparatusSHINKAWA KK·Filed 2006·Granted Jan 29, 2008·7 cites·2 claims
- 0378US6467673B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2000·Granted Oct 22, 2002·27 cites·9 claims
- 0474US10262968B2Wire bonding apparatus and wire bonding methodSHINKAWA KK·Filed 2017·Granted Apr 16, 2019·2 cites·15 claims
- 0574US7224829B2Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination programSHINKAWA KK·Filed 2004·Granted May 29, 2007·18 cites·5 claims
- 0667US6762848B2Offset measurement method, tool position detection method and bonding apparatusSHINKAWA KK·Filed 2001·Granted Jul 13, 2004·13 cites·4 claims
- 0757US7209583B2Bonding method, bonding apparatus and bonding programSHINKAWA KK·Filed 2004·Granted Apr 24, 2007·6 cites·4 claims
- 0851US6814121B2Bonding apparatusSHINKAWA KK·Filed 2002·Granted Nov 9, 2004·4 cites·10 claims
- 0950US7330582B2Bonding programSHINKAWA KK·Filed 2006·Granted Feb 12, 2008·0 cites·2 claims
- 1049US12217996B2Conveying deviceSHINKAWA KK·Filed 2020·Granted Feb 4, 2025·0 cites·5 claims
- 1149US7324683B2Bonding pattern discrimination deviceSHINKAWA KK·Filed 2006·Granted Jan 29, 2008·0 cites·1 claims
- 1249US7321681B2Bonding pattern discrimination programSHINKAWA KK·Filed 2006·Granted Jan 22, 2008·0 cites·1 claims
- 1343US2007181651A1Method for setting capillary contact position data and wire bonding apparatus using the sameSHINKAWA KK·Filed 2007·Application pending·0 cites
- 1441US5772040AWorkpiece conveying apparatus used with workpiece inspection deviceSHINKAWA KK·Filed 1995·Granted Jun 30, 1998·12 cites·2 claims
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