Inventor · disambiguated record
Sushumna Iruvanti
Also filed as: IRUVANTI SUSHUMNA
61 granted patents·6 pending applications·2,006 citations·filing 1989–2023
99Inventor score
Top patents by PatentIndex Score
67 records- 0197US6444496B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 2000·Granted Sep 3, 2002·123 cites·10 claims
- 0296US7816785B2Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and packageIBM·Filed 2009·Granted Oct 19, 2010·45 cites·10 claims
- 0396US5623394AApparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Apr 22, 1997·121 cites·18 claims
- 0493US7709951B2Thermal pillowIBM·Filed 2007·Granted May 4, 2010·27 cites·20 claims
- 0593US6294408B1Method for controlling thermal interface gap distanceIBM·Filed 1999·Granted Sep 25, 2001·156 cites·18 claims
- 0693US5724729AMethod and apparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Mar 10, 1998·71 cites·18 claims
- 0792US5990418AHermetic CBGA/CCGA structure with thermal paste coolingIBM·Filed 1997·Granted Nov 23, 1999·156 cites·19 claims
- 0892US5604978AMethod for cooling of chips using a plurality of materialsIBM·Filed 1995·Granted Feb 25, 1997·67 cites·17 claims
- 0991US8156998B2Patterned metal thermal interfaceFURMAN BRUCE K·Filed 2010·Granted Apr 17, 2012·12 cites·18 claims
- 1090US7694719B2Patterned metal thermal interfaceIBM·Filed 2007·Granted Apr 13, 2010·18 cites·16 claims
- 1190US6275381B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 1998·Granted Aug 14, 2001·65 cites·12 claims
- 1290US6085831ADirect chip-cooling through liquid vaporization heat exchangeIBM·Filed 1999·Granted Jul 11, 2000·115 cites·51 claims
- 1390US5098609AStable high solids, high thermal conductivity pastesRES FOUNDATION OF STATE UNIV O·Filed 1989·Granted Mar 24, 1992·91 cites·14 claims
- 1489US7268428B2Thermal paste containment for semiconductor modulesIBM·Filed 2005·Granted Sep 11, 2007·25 cites·6 claims
- 1589US5825087AIntegral mesh flat plate cooling moduleIBM·Filed 1996·Granted Oct 20, 1998·100 cites·16 claims
- 1689US5591789APolyester dispersants for high thermal conductivity pasteIBM·Filed 1995·Granted Jan 7, 1997·50 cites·17 claims
- 1787US8053284B2Method and package for circuit chip packagingIBM·Filed 2009·Granted Nov 8, 2011·15 cites·12 claims
- 1886US11152282B1Localized catalyst for enhanced thermal interface material heat transferIBM·Filed 2020·Granted Oct 19, 2021·2 cites·20 claims
- 1985US5659203AReworkable polymer chip encapsulantIBM·Filed 1995·Granted Aug 19, 1997·71 cites·16 claims
- 2084US8455998B2Method and package for circuit chip packagingIRUVANTI SUSHUMNA·Filed 2011·Granted Jun 4, 2013·8 cites·13 claims
- 2184US7381590B2Method and device including reworkable alpha particle barrier and corrosion barrierIBM·Filed 2006·Granted Jun 3, 2008·6 cites·15 claims
- 2284US5770478AIntegral mesh flat plate cooling methodIBM·Filed 1997·Granted Jun 23, 1998·71 cites·6 claims
- 2383US5819402AMethod for cooling of chips using blind holes with customized depthIBM·Filed 1997·Granted Oct 13, 1998·63 cites·16 claims
- 2482US11302651B2Laminated stiffener to control the warpage of electronic chip carriersIBM·Filed 2019·Granted Apr 12, 2022·2 cites·19 claims
- 2582US5981310AMulti-chip heat-sink cap assemblyIBM·Filed 1998·Granted Nov 9, 1999·59 cites·11 claims
- 2680US9045674B2High thermal conductance thermal interface materials based on nanostructured metallic network-polymer compositesIRUVANTI SUSHUMNA·Filed 2012·Granted Jun 2, 2015·5 cites·19 claims
- 2780US5706171AFlat plate cooling using a thermal paste retainerIBM·Filed 1995·Granted Jan 6, 1998·53 cites·18 claims
- 2879US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 2978US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 3078US5757620AApparatus for cooling of chips using blind holes with customized depthIBM·Filed 1996·Granted May 26, 1998·50 cites·26 claims
- 3177US11158562B2Conformal integrated circuit (IC) device package lidIBM·Filed 2020·Granted Oct 26, 2021·1 cites·19 claims
- 3276US10804181B2Heterogeneous thermal interface material for corner and or edge degradation mitigationIBM·Filed 2019·Granted Oct 13, 2020·2 cites·7 claims
- 3375US7981849B2Reversible thermal thickening greaseIBM·Filed 2007·Granted Jul 19, 2011·2 cites·15 claims
- 3475US7615850B2Method and device including reworkable alpha particle barrier and corrosion barrierIBM·Filed 2008·Granted Nov 10, 2009·2 cites·3 claims
- 3573US10607928B1Reduction of laminate failure in integrated circuit (IC) device carrierIBM·Filed 2019·Granted Mar 31, 2020·1 cites·20 claims
- 3673US10593564B2Lid attach optimization to limit electronic package warpageIBM·Filed 2018·Granted Mar 17, 2020·1 cites·6 claims
- 3773US8531025B2Thermal paste containment for semiconductor modulesEDWARDS DAVID L·Filed 2007·Granted Sep 10, 2013·9 cites·15 claims
- 3873US6656389B2Thermal paste for low temperature applicationsIBM·Filed 2001·Granted Dec 2, 2003·21 cites·16 claims
- 3973US5930597AReworkable polymer chip encapsulantIBM·Filed 1997·Granted Jul 27, 1999·38 cites·6 claims
- 4072US10083886B2Lid attach optimization to limit electronic package warpageIBM·Filed 2017·Granted Sep 25, 2018·1 cites·7 claims
- 4172US8232636B2Reliability enhancement of metal thermal interfaceHUMENIK JAMES N·Filed 2010·Granted Jul 31, 2012·5 cites·24 claims
- 4272US8021925B2Thermal paste containment for semiconductor modulesIBM·Filed 2007·Granted Sep 20, 2011·9 cites·16 claims
- 4372US6515061B1Polyester dispersants for high thermal conductivity pasteIBM·Filed 1997·Granted Feb 4, 2003·21 cites·19 claims
- 4470US6373133B1Multi-chip module and heat-sink cap combinationIBM·Filed 1999·Granted Apr 16, 2002·34 cites·15 claims
- 4569US11569181B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2020·Granted Jan 31, 2023·0 cites·11 claims
- 4669US9512291B2High thermal conductance thermal interface materials based on nanostructured metallic network-polymer compositesIBM·Filed 2015·Granted Dec 6, 2016·1 cites·19 claims
- 4769US5891755AProcess for flat plate cooling a semiconductor chip using a thermal paste retainerIBM·Filed 1997·Granted Apr 6, 1999·31 cites·4 claims
- 4867US10049896B2Lid attach optimization to limit electronic package warpageIBM·Filed 2015·Granted Aug 14, 2018·1 cites·3 claims
- 4963US6111314AThermal cap with embedded particlesIBM·Filed 1998·Granted Aug 29, 2000·23 cites·48 claims
- 5060US10892233B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2018·Granted Jan 12, 2021·0 cites·7 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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