Inventor · disambiguated record
Raed A. Sherif
Also filed as: SHERIF RAED · SHERIF RAED A
30 granted patents·1 pending application·2,041 citations·filing 1992–2004
98Inventor score
Top patents by PatentIndex Score
31 records- 0199US6350944B1Solar module array with reconfigurable tileHUGHES ELECTRONICS CORP·Filed 2000·Granted Feb 26, 2002·298 cites·14 claims
- 0297US6531653B1Low cost high solar flux photovoltaic concentrator receiverBOEING CO·Filed 2001·Granted Mar 11, 2003·156 cites·22 claims
- 0396US6330157B1Variable thermal exchanger and method thereofIBM·Filed 1999·Granted Dec 11, 2001·83 cites·8 claims
- 0496US5623394AApparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Apr 22, 1997·121 cites·18 claims
- 0593US6294408B1Method for controlling thermal interface gap distanceIBM·Filed 1999·Granted Sep 25, 2001·156 cites·18 claims
- 0693US5724729AMethod and apparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Mar 10, 1998·71 cites·18 claims
- 0792US5990418AHermetic CBGA/CCGA structure with thermal paste coolingIBM·Filed 1997·Granted Nov 23, 1999·156 cites·19 claims
- 0892US5604978AMethod for cooling of chips using a plurality of materialsIBM·Filed 1995·Granted Feb 25, 1997·67 cites·17 claims
- 0991US5239443ABlind hole cold plate cooling systemIBM·Filed 1992·Granted Aug 24, 1993·138 cites·18 claims
- 1089US6218730B1Apparatus for controlling thermal interface gap distanceIBM·Filed 1999·Granted Apr 17, 2001·88 cites·10 claims
- 1189US5825087AIntegral mesh flat plate cooling moduleIBM·Filed 1996·Granted Oct 20, 1998·100 cites·16 claims
- 1284US5770478AIntegral mesh flat plate cooling methodIBM·Filed 1997·Granted Jun 23, 1998·71 cites·6 claims
- 1383US5819402AMethod for cooling of chips using blind holes with customized depthIBM·Filed 1997·Granted Oct 13, 1998·63 cites·16 claims
- 1482US5981310AMulti-chip heat-sink cap assemblyIBM·Filed 1998·Granted Nov 9, 1999·59 cites·11 claims
- 1580US5706171AFlat plate cooling using a thermal paste retainerIBM·Filed 1995·Granted Jan 6, 1998·53 cites·18 claims
- 1679US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 1778US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 1878US5757620AApparatus for cooling of chips using blind holes with customized depthIBM·Filed 1996·Granted May 26, 1998·50 cites·26 claims
- 1975US6459160B1Package with low stress hermetic sealIBM·Filed 2002·Granted Oct 1, 2002·19 cites·26 claims
- 2071US6342407B1Low stress hermetic sealIBM·Filed 2000·Granted Jan 29, 2002·15 cites·20 claims
- 2171US6333460B1Structural support for direct lid attachIBM·Filed 2000·Granted Dec 25, 2001·18 cites·6 claims
- 2270US6373133B1Multi-chip module and heat-sink cap combinationIBM·Filed 1999·Granted Apr 16, 2002·34 cites·15 claims
- 2369US5891755AProcess for flat plate cooling a semiconductor chip using a thermal paste retainerIBM·Filed 1997·Granted Apr 6, 1999·31 cites·4 claims
- 2463US6111314AThermal cap with embedded particlesIBM·Filed 1998·Granted Aug 29, 2000·23 cites·48 claims
- 2559US6255139B1Method for providing a thermal path through particles embedded in a thermal capIBM·Filed 1999·Granted Jul 3, 2001·19 cites·51 claims
- 2659US6222263B1Chip assembly with load-bearing lid in thermal contact with the chipIBM·Filed 1999·Granted Apr 24, 2001·24 cites·9 claims
- 2744US6049456AElectronic module adjustment design and process using shimsIBM·Filed 1998·Granted Apr 11, 2000·12 cites·45 claims
- 2837US8697987B2Solar cell having front grid metallization that does not contact the active layersCOTAL HECTOR L·Filed 2004·Granted Apr 15, 2014·3 cites·13 claims
- 2932US5977625ASemiconductor package with low strain sealIBM·Filed 1997·Granted Nov 2, 1999·2 cites·12 claims
- 3031US5723905ASemiconductor package with low strain sealIBM·Filed 1995·Granted Mar 3, 1998·1 cites·2 claims
- 3130US2004261838A1Solar cell with an electrically insulating layer under the busbarCOTAL HECTOR·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →