Inventor · disambiguated record
Michiya Higashi
Also filed as: HIGASHI MICHIYA
10 granted patents·354 citations·filing 1985–1994
92Inventor score
Files withTOSHIBA KK10
Top patents by PatentIndex Score
10 records- 0189US4719502AEpoxy resin composition, and resin-sealed semiconductor device in which this composition is usedTOSHIBA KK·Filed 1986·Granted Jan 12, 1988·59 cites·11 claims
- 0283US5536970AResin-encapsulated semiconductor deviceTOSHIBA KK·Filed 1994·Granted Jul 16, 1996·80 cites·22 claims
- 0372US5145889AAcid anhydride-cured epoxy resin encapsulant with triorganothiophosphiteTOSHIBA KK·Filed 1989·Granted Sep 8, 1992·38 cites·5 claims
- 0467US4719255AEpoxy resin composition for encapsulation of semi-conductor deviceTOSHIBA KK·Filed 1985·Granted Jan 12, 1988·22 cites·13 claims
- 0564US5272377AMaleimide resin composition and resin encapsulated semiconductor device manufactured using the compositionTOSHIBA KK·Filed 1991·Granted Dec 21, 1993·34 cites·12 claims
- 0660US5258426ASemiconductor device encapsulantTOSHIBA KK·Filed 1990·Granted Nov 2, 1993·29 cites·18 claims
- 0760US5057457AMultimold semiconductor device and the manufacturing method thereforTOSHIBA KK·Filed 1990·Granted Oct 15, 1991·36 cites·1 claims
- 0855US4710796AResin encapsulation type semiconductor device by use of epoxy resin compositionTOSHIBA KK·Filed 1985·Granted Dec 1, 1987·22 cites·12 claims
- 0949US5346743AResin encapsulation type semiconductor deviceTOSHIBA KK·Filed 1993·Granted Sep 13, 1994·17 cites·20 claims
- 1049US5068267ASemiconductor device encapsulant consisting of epoxy resin compositionTOSHIBA KK·Filed 1989·Granted Nov 26, 1991·17 cites·10 claims
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