Inventor · disambiguated record
David J. Perlman
Also filed as: PERLMAN DAVID J · PERLMAN DAVID JACOB
18 granted patents·1,037 citations·filing 1978–2007
96Inventor score
Top patents by PatentIndex Score
18 records- 0198US7234099B2High reliability memory module with a fault tolerant address and command busIBM·Filed 2003·Granted Jun 19, 2007·114 cites·12 claims
- 0295US5567654AMethod and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packagingIBM·Filed 1994·Granted Oct 22, 1996·150 cites·56 claims
- 0394US5478781APolyimide-insulated cube package of stacked semiconductor device chipsIBM·Filed 1994·Granted Dec 26, 1995·174 cites·36 claims
- 0493US5786628AMethod and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packagingIBM·Filed 1997·Granted Jul 28, 1998·127 cites·11 claims
- 0591US5719438AMethod and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packagingIBM·Filed 1995·Granted Feb 17, 1998·97 cites·84 claims
- 0687US5532519ACube wireability enhancement with chip-to-chip alignment and thickness controlIBM·Filed 1995·Granted Jul 2, 1996·70 cites·17 claims
- 0785US7363533B2High reliability memory module with a fault tolerant address and command busIBM·Filed 2006·Granted Apr 22, 2008·10 cites·19 claims
- 0883US7761771B2High reliability memory module with a fault tolerant address and command busIBM·Filed 2006·Granted Jul 20, 2010·7 cites·17 claims
- 0980US8489936B2High reliability memory module with a fault tolerant address and command busGOWER KEVIN C·Filed 2007·Granted Jul 16, 2013·5 cites·21 claims
- 1079US5923181AMethods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip moduleIBM·Filed 1997·Granted Jul 13, 1999·41 cites·7 claims
- 1178US5229639ALow powder distribution inductance lead frame for semiconductor chipsIBM·Filed 1991·Granted Jul 20, 1993·62 cites·10 claims
- 1277US5414637AIntra-module spare routing for high density electronic packagesIBM·Filed 1992·Granted May 9, 1995·57 cites·55 claims
- 1371US5686843AMethods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip moduleIBM·Filed 1995·Granted Nov 11, 1997·30 cites·29 claims
- 1470US4341942AMethod of bonding wires to passivated chip microcircuit conductorsIBM·Filed 1980·Granted Jul 27, 1982·36 cites·12 claims
- 1569US5567653AProcess for aligning etch masks on an integrated circuit surface using electromagnetic energyIBM·Filed 1994·Granted Oct 22, 1996·31 cites·11 claims
- 1646US5297091AEarly row address strobe (RAS) prechargeIBM·Filed 1991·Granted Mar 22, 1994·11 cites·13 claims
- 1744US5712190AProcess for controlling distance between integrated circuit chips in an electronic moduleIBM·Filed 1996·Granted Jan 27, 1998·9 cites·8 claims
- 1843US4196389ATest site for a charged coupled device (CCD) arrayIBM·Filed 1978·Granted Apr 1, 1980·6 cites·4 claims
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