Inventor · disambiguated record
David V. Pedersen
Also filed as: PEDERSEN DAVID · PEDERSEN DAVID V
56 granted patents·7 pending applications·5,407 citations·filing 1994–2023
99Inventor score
Files withFORMFACTOR INC43CUBIC MEMORY INC9CORELOGIC SOLUTIONS LLC3WORLDCOM INC3AERIS COMMUNICATIONS INC1
Top patents by PatentIndex Score
63 records- 0199US6690185B1Large contactor with multiple, aligned contactor unitsFORMFACTOR INC·Filed 1998·Granted Feb 10, 2004·268 cites·8 claims
- 0299US6525555B1Wafer-level burn-in and testFORMFACTOR INC·Filed 2000·Granted Feb 25, 2003·164 cites·52 claims
- 0399US6064213AWafer-level burn-in and testFORMFACTOR INC·Filed 1997·Granted May 16, 2000·416 cites·56 claims
- 0498US6788094B2Wafer-level burn-in and testFORMFACTOR INC·Filed 2002·Granted Sep 7, 2004·95 cites·21 claims
- 0598US6534856B1Sockets for “springed” semiconductor devicesFORMFACTOR INC·Filed 2001·Granted Mar 18, 2003·138 cites·29 claims
- 0698US6184053B1Method of making microelectronic spring contact elementsFORMFACTOR INC·Filed 1997·Granted Feb 6, 2001·372 cites·21 claims
- 0798US5675180AVertical interconnect process for silicon segmentsCUBIC MEMORY INC·Filed 1994·Granted Oct 7, 1997·172 cites·21 claims
- 0897US11430069B1Damage prediction system using artificial intelligenceCORELOGIC SOLUTIONS LLC·Filed 2019·Granted Aug 30, 2022·36 cites·20 claims
- 0997US6825052B2Test assembly including a test die for testing a semiconductor product dieFORMFACTOR INC·Filed 2002·Granted Nov 30, 2004·114 cites·17 claims
- 1097US6640415B2Segmented contactorFORMFACTOR INC·Filed 2002·Granted Nov 4, 2003·166 cites·40 claims
- 1197US6621260B2Special contact points for accessing internal circuitry of an integrated circuitFORMFACTOR INC·Filed 2000·Granted Sep 16, 2003·98 cites·17 claims
- 1297US6597187B2Special contact points for accessing internal circuitry of an integrated circuitFORMFACTOR INC·Filed 2000·Granted Jul 22, 2003·99 cites·23 claims
- 1397US6456099B1Special contact points for accessing internal circuitry of an integrated circuitFORMFACTOR INC·Filed 1998·Granted Sep 24, 2002·183 cites·26 claims
- 1497US6232149B1Sockets for “springed” semiconductor devicesFORMFACTOR INC·Filed 2000·Granted May 15, 2001·98 cites·2 claims
- 1597US6043563AElectronic components with terminals and spring contact elements extending from areas which are remote from the terminalsFORMFACTOR INC·Filed 1997·Granted Mar 28, 2000·294 cites·32 claims
- 1697US6033935ASockets for "springed" semiconductor devicesFORMFACTOR INC·Filed 1998·Granted Mar 7, 2000·174 cites·3 claims
- 1797US5998864AStacking semiconductor devices, particularly memory chipsFORMFACTOR INC·Filed 1997·Granted Dec 7, 1999·311 cites·30 claims
- 1896US6644982B1Method and apparatus for the transport and tracking of an electronic componentFORMFACTOR INC·Filed 1999·Granted Nov 11, 2003·173 cites·29 claims
- 1996US6603324B2Special contact points for accessing internal circuitry of an integrated circuitFORMFACTOR INC·Filed 2000·Granted Aug 5, 2003·84 cites·20 claims
- 2096US6429029B1Concurrent design and subsequent partitioning of product and test dieFORMFACTOR INC·Filed 1998·Granted Aug 6, 2002·215 cites·49 claims
- 2196US5661087AVertical interconnect process for silicon segmentsCUBIC MEMORY INC·Filed 1995·Granted Aug 26, 1997·104 cites·6 claims
- 2295US7345493B2Wafer-level burn-in and testFORMFACTOR INC·Filed 2006·Granted Mar 18, 2008·21 cites·8 claims
- 2395US6727580B1Microelectronic spring contact elementsFORMFACTOR INC·Filed 2000·Granted Apr 27, 2004·102 cites·18 claims
- 2495US6627483B2Method for mounting an electronic componentFORMFACTOR INC·Filed 1999·Granted Sep 30, 2003·155 cites·32 claims
- 2595US6330164B1Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor deviceFORMFACTOR INC·Filed 1998·Granted Dec 11, 2001·196 cites·41 claims
- 2694US7078926B2Wafer-level burn-in and testFORMFACTOR INC·Filed 2004·Granted Jul 18, 2006·44 cites·24 claims
- 2794US6664628B2Electronic component overlapping dice of unsingulated semiconductor waferFORMFACTOR INC·Filed 2001·Granted Dec 16, 2003·80 cites·24 claims
- 2894US6215196B1Electronic component with terminals and spring contact elements extending from areas which are remote from the terminalsFORMFACTOR INC·Filed 2000·Granted Apr 10, 2001·94 cites·29 claims
- 2993US6551844B1Test assembly including a test die for testing a semiconductor product dieFORMFACTOR INC·Filed 1998·Granted Apr 22, 2003·109 cites·18 claims
- 3093US5657206AConductive epoxy flip-chip package and methodCUBIC MEMORY INC·Filed 1995·Granted Aug 12, 1997·73 cites·15 claims
- 3192US6134118AConductive epoxy flip-chip package and methodCUBIC MEMORY INC·Filed 1997·Granted Oct 17, 2000·73 cites·18 claims
- 3291US5698895ASilicon segment programming method and apparatusCUBIC MEMORY INC·Filed 1995·Granted Dec 16, 1997·70 cites·6 claims
- 3389US5837566AVertical interconnect process for silicon segmentsCUBIC MEMORY INC·Filed 1997·Granted Nov 17, 1998·56 cites·5 claims
- 3488US6940093B2Special contact points for accessing internal circuitry of an integrated circuitFORMFACTOR INC·Filed 2000·Granted Sep 6, 2005·30 cites·40 claims
- 3586US7534654B2Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a componentFORMFACTOR INC·Filed 2007·Granted May 19, 2009·10 cites·19 claims
- 3686US6766348B1Method and system for load-balanced data exchange in distributed network-based resource allocationWORLDCOM INC·Filed 1999·Granted Jul 20, 2004·148 cites·20 claims
- 3785US7217580B2Method for processing an integrated circuitFORMFACTOR INC·Filed 2004·Granted May 15, 2007·22 cites·30 claims
- 3882US7557596B2Test assembly including a test die for testing a semiconductor product dieFORMFACTOR INC·Filed 2004·Granted Jul 7, 2009·24 cites·22 claims
- 3979US7714235B1Lithographically defined microelectronic contact structuresFORMFACTOR INC·Filed 2000·Granted May 11, 2010·28 cites·16 claims
- 4078US7578057B2Method of fabricating segmented contactorFORMFACTOR INC·Filed 2006·Granted Aug 25, 2009·6 cites·14 claims
- 4178US7202677B2Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a componentFORMFACTOR INC·Filed 2003·Granted Apr 10, 2007·19 cites·14 claims
- 4277US12236489B2Damage prediction system using artificial intelligenceCORELOGIC SOLUTIONS LLC·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 4377US7059047B2Sockets for “springed” semiconductor devicesFORMFACTOR INC·Filed 2003·Granted Jun 13, 2006·15 cites·38 claims
- 4474US11727500B2Damage prediction system using artificial intelligenceCORELOGIC SOLUTIONS LLC·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 4574US6665701B1Method and system for contention controlled data exchange in a distributed network-based resource allocationWORLDCOM INC·Filed 1999·Granted Dec 16, 2003·75 cites·51 claims
- 4673US5936302ASpeaker diaphragmCUBIC MEMORY INC·Filed 1997·Granted Aug 10, 1999·27 cites·8 claims
- 4768US6523065B1Method and system for maintenance of global network information in a distributed network-based resource allocation systemWORLDCOM INC·Filed 1999·Granted Feb 18, 2003·69 cites·57 claims
- 4868US6486528B1Silicon segment programming apparatus and three terminal fuse configurationVERTICAL CIRCUITS INC·Filed 1999·Granted Nov 26, 2002·28 cites·8 claims
- 4968US6188126B1Vertical interconnect process for silicon segmentsCUBIC MEMORY INC·Filed 1997·Granted Feb 13, 2001·20 cites·3 claims
- 5066US8011089B2Method of repairing segmented contactorFORMFACTOR INC·Filed 2009·Granted Sep 6, 2011·2 cites·8 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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