Inventor · disambiguated record
Tetsuya Koyama
Also filed as: KOYAMA TETSUYA
21 granted patents·3 pending applications·190 citations·filing 2005–2022
94Inventor score
Files withSHINKO ELECTRIC IND CO14ASAHI GLASS CO LTD3TOYOTA JIDOSHOKKI KK2KATAOKA NARIYUKI1KOYAMA TETSUYA1
Top patents by PatentIndex Score
24 records- 0197US7989707B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 2, 2011·71 cites·12 claims
- 0294US8793868B2Chip embedded substrate and method of producing the sameYAMANO TAKAHARU·Filed 2011·Granted Aug 5, 2014·14 cites·6 claims
- 0393US7501696B2Semiconductor chip-embedded substrate and method of manufacturing sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Mar 10, 2009·30 cites·15 claims
- 0492US9137900B2Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Sep 15, 2015·15 cites·12 claims
- 0591US7884484B2Wiring board and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 8, 2011·24 cites·9 claims
- 0682US9257386B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Feb 9, 2016·6 cites·16 claims
- 0780US7882627B2Method of manufacturing a multilayer wiring boardSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 8, 2011·7 cites·4 claims
- 0876US7772689B2Semiconductor package with a conductive post and wiring patternSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 10, 2010·7 cites·10 claims
- 0974US7955454B2Method for forming wiring on insulating resin layerSHINKO ELECTRIC IND CO·Filed 2006·Granted Jun 7, 2011·8 cites·2 claims
- 1074US7847384B2Semiconductor package and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2006·Granted Dec 7, 2010·6 cites·7 claims
- 1167US8096049B2Method of manufacturing a multilayer wiring boardKOYAMA TETSUYA·Filed 2010·Granted Jan 17, 2012·2 cites·7 claims
- 1261US2025030056A1Electrode unit manufacturing device, and electrode unit manufacturing methodTOYOTA JIDOSHOKKI KK·Filed 2022·Application pending·0 cites
- 1360US8997526B2Vacuum degassing apparatus and vacuum degassing method for molten glassASAHI GLASS CO LTD·Filed 2013·Granted Apr 7, 2015·0 cites·6 claims
- 1458US10134680B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Nov 20, 2018·0 cites·16 claims
- 1558US9451702B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Sep 20, 2016·0 cites·19 claims
- 1657US9768122B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Sep 19, 2017·0 cites·19 claims
- 1755US8468851B2Vacuum degassing apparatus and vacuum degassing method for molten glassNISHIKAWA TORU·Filed 2012·Granted Jun 25, 2013·0 cites·21 claims
- 1854US8347654B2Vacuum degassing apparatus and vacuum degassing method for molten glassASAHI GLASS CO LTD·Filed 2010·Granted Jan 8, 2013·0 cites·13 claims
- 1942US8736053B2Semiconductor deviceTANAKA KOICHI·Filed 2012·Granted May 27, 2014·0 cites·10 claims
- 2042US2015152004A1Glass sheet/fluororesin laminateASAHI GLASS CO LTD·Filed 2015·Application pending·0 cites
- 2140US9059088B2Electronic component built-in substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Jun 16, 2015·0 cites·4 claims
- 2237US7882619B2Method for setting stator coilTOYOTA JIDOSHOKKI KK·Filed 2007·Granted Feb 8, 2011·0 cites·3 claims
- 2334US2016143139A1Electronic component device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2015·Application pending·0 cites
- 2430US9097606B2Imbalance correction method and imbalance correction amount calculation device for rotorKATAOKA NARIYUKI·Filed 2011·Granted Aug 4, 2015·0 cites·7 claims
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