Inventor · disambiguated record
Pai Yuan Li
Also filed as: LI PAI · LI PAI-YUAN
13 granted patents·3 pending applications·30 citations·filing 2014–2024
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13ANHUI LVWO RECYCLING ENERGY TECH CO LTD1SILICONWARE PRECISION INDUSTRIES CO LTD1UNIV HUBEI1
Top patents by PatentIndex Score
16 records- 0194US10770405B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 8, 2020·11 cites·20 claims
- 0294US10707177B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 7, 2020·11 cites·20 claims
- 0392US10629545B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 21, 2020·6 cites·20 claims
- 0484US2025062250A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0582US11916023B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 27, 2024·1 cites·20 claims
- 0680US12165990B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 0779US2024162166A1Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0869US11587886B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 0968US10867951B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·20 claims
- 1055US11201254B2(GaMe)2O3 ternary alloy material, its preparation method and application in solar-blind ultraviolet photodetectorUNIV HUBEI·Filed 2020·Granted Dec 14, 2021·0 cites·4 claims
- 1151US11502366B2Echelon utilization battery pack with good seismic resistanceANHUI LVWO RECYCLING ENERGY TECH CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·9 claims
- 1251US11201097B2Method of manufacture of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 1349US10872871B2Chip package structure with dummy bump and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 1448US11121050B2Method of manufacture of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 14, 2021·0 cites·20 claims
- 1548US10340242B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 2, 2019·0 cites·20 claims
- 1643US2015179597A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →