Inventor · disambiguated record
Chao-Wei Li
Also filed as: LI CHAO · LI CHAO-WEI
32 granted patents·25 pending applications·21 citations·filing 2008–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD17LI CHAO-WEI6UNIV SHANGHAI JIAOTONG5AU OPTRONICS CORP4IND TECH RES INST4
Top patents by PatentIndex Score
57 records- 0191US12368086B2Package structure having thermoelectric coolerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·20 claims
- 0284US2025132268A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0383US8926130B2Illumination device and assembling method thereofLI CHAO-WEI·Filed 2012·Granted Jan 6, 2015·7 cites·26 claims
- 0482US12512419B2Method of fabricating memory device and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0582US12218082B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0682US2025347870A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0775US2025093593A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0874US8115218B2Light emitting diode package structure and method for fabricating the sameTSAI YAO-JUN·Filed 2009·Granted Feb 14, 2012·6 cites·20 claims
- 0974US2025300130A1Manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1074US2025309042A1Method of forming package structure having thermoelectric coolerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1174US2025299973A1Staggered metal mesh on backside of device die and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1273US11855006B2Memory device, package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·17 claims
- 1368US12438007B2Staggered metal mesh on backside of device die and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 1468US7923746B2Light emitting diode package structure and method for fabricating the sameIND TECH RES INST·Filed 2008·Granted Apr 12, 2011·3 cites·13 claims
- 1567US12380528B2Watermark embedding method and display deviceAUO CORP·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 1665US9330310B2Methods and devices for obtaining card informationTENCENT TECH SHENZHEN CO LTD·Filed 2014·Granted May 3, 2016·4 cites·17 claims
- 1764US12354997B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 8, 2025·0 cites·20 claims
- 1862US11842421B1Method and display device for embedding watermark information to dimming signal of backlight moduleAUO CORP·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 1960US11656493B1Display apparatusAU OPTRONICS CORP·Filed 2022·Granted May 23, 2023·0 cites·11 claims
- 2059US2025172774A1Photonic system with removable fiber array unit assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2159US2025147245A1Package assembly and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2258US2025140643A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2358US2022219161A1Analyte meters, test strip ejectors, and methods of using samePHC CORP·Filed 2022·Application pending·0 cites
- 2457US2024311649A1Data processing method and apparatus for federated learning system, computer, and readable storage mediumTENCENT TECH SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 2556US10824034B1Display moduleAU OPTRONICS CORP·Filed 2019·Granted Nov 3, 2020·0 cites·9 claims
- 2655US11875426B2Graph sampling and random walk acceleration method and system on GPUUNIV SHANGHAI JIAOTONG·Filed 2022·Granted Jan 16, 2024·0 cites·9 claims
- 2754US12483626B2Sensor systemUNIV HONG KONG SCIENCE & TECH·Filed 2024·Granted Nov 25, 2025·0 cites·19 claims
- 2854US2023287224A1pH-SENSITIVE CAPSULE AND RELEASE SYSTEMLI CHAO·Filed 2021·Application pending·0 cites
- 2953US12354929B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 3052US2023067664A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3151US9052418B2Light source moduleIND TECH RES INST·Filed 2013·Granted Jun 9, 2015·0 cites·25 claims
- 3250US11562541B2Topology-change-aware volumetric fusion for real-time dynamic 4D reconstructionUNIV TEXAS·Filed 2020·Granted Jan 24, 2023·0 cites·16 claims
- 3350US2023037805A1Information sending method, information receiving method, and related apparatus and deviceHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 3449US11915470B2Target detection method based on fusion of vision, lidar, and millimeter wave radarQUANZHOU EQUIPMENT MANUFACTURING RES INSTITUTE·Filed 2022·Granted Feb 27, 2024·0 cites·7 claims
- 3549US8979313B2Semiconductor light source deviceIND TECH RES INST·Filed 2012·Granted Mar 17, 2015·0 cites·13 claims
- 3649US8349627B2Method for fabricating a light emitting diode package structureIND TECH RES INST·Filed 2010·Granted Jan 8, 2013·0 cites·24 claims
- 3749US2020201093A1Polarizer module and operation method thereofAU OPTRONICS CORP·Filed 2019·Application pending·0 cites
- 3849US2023274466A1Point cloud polar coordinate coding method and deviceQUANZHOU EQUIPMENT MANUFACTURING RES INSTITUTE·Filed 2023·Application pending·0 cites
- 3949US2022134301A1Ph-sensitive capsule and release systemOHIO STATE INNOVATION FOUNDATION·Filed 2020·Application pending·0 cites
- 4048US11803080B2Polarizer module and operation method thereofAU OPTRONICS CORP·Filed 2022·Granted Oct 31, 2023·0 cites·8 claims
- 4145US2013168714A1Light emitting diode package structureLI CHAO-WEI·Filed 2012·Application pending·0 cites
- 4244US8178890B2Light emitting diode package structureLI CHAO-WEI·Filed 2009·Granted May 15, 2012·0 cites·22 claims
- 4343US11605087B2Method and apparatus for identifying identity informationADVANCED NEW TECHNOLOGIES CO LTD·Filed 2020·Granted Mar 14, 2023·0 cites·7 claims
- 4443US2009290837A1Optical devices for coupling of lightUNIV HONG KONG CHINESE·Filed 2009·Application pending·0 cites
- 4542US11150458B2Multi-mode imaging optical systemINSTITUTE OF MEDICAL SUPPORT TECH ACADEMY OF SYSTEM ENGINEERING ACADEMY OF MILITARY SCIENCE·Filed 2020·Granted Oct 19, 2021·0 cites·9 claims
- 4642US2013114243A1Ceiling fixtureCHU MU-TAO·Filed 2012·Application pending·0 cites
- 4741US11635799B2Nanosecond-scale power resource allocation method and system for microservicesUNIV SHANGHAI JIAOTONG·Filed 2020·Granted Apr 25, 2023·0 cites·13 claims
- 4841US2012168801A1Light emitting device and package structure thereofXUAN RONG·Filed 2009·Application pending·0 cites
- 4941US2025348296A1Method and system for compiling neural network, computer storage medium, and compilation deviceUNIV SHANGHAI JIAOTONG·Filed 2021·Application pending·0 cites
- 5041US2025335257A1Resource allocation method, medium, and serverUNIV SHANGHAI JIAOTONG·Filed 2021·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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