Inventor · disambiguated record
Kuniaki Horie
Also filed as: HORIE KUNIAKI
26 granted patents·3 pending applications·1,948 citations·filing 1997–2016
97Inventor score
Top patents by PatentIndex Score
29 records- 0198US6488774B1Trap apparatusEBARA CORP·Filed 2000·Granted Dec 3, 2002·378 cites·8 claims
- 0297US6282368B1Liquid feed vaporization system and gas injection deviceEBARA CORP·Filed 2000·Granted Aug 28, 2001·104 cites·5 claims
- 0397US6176929B1Thin-film deposition apparatusEBARA CORP·Filed 1998·Granted Jan 23, 2001·340 cites·32 claims
- 0497US5951923AVaporizer apparatus and film deposition apparatus therewithEBARA CORP·Filed 1997·Granted Sep 14, 1999·275 cites·45 claims
- 0596US6387182B1Apparatus and method for processing substrateEBARA CORP·Filed 2000·Granted May 14, 2002·113 cites·19 claims
- 0696US6132512AVapor-phase film growth apparatus and gas ejection headEBARA CORP·Filed 1998·Granted Oct 17, 2000·225 cites·9 claims
- 0795US6419462B1Positive displacement type liquid-delivery apparatusEBARA CORP·Filed 2000·Granted Jul 16, 2002·169 cites·12 claims
- 0891US6921722B2Coating, modification and etching of substrate surface with particle beam irradiation of the sameEBARA CORP·Filed 2001·Granted Jul 26, 2005·56 cites·24 claims
- 0990US7901551B2Substrate holder and plating apparatusEBARA CORP·Filed 2009·Granted Mar 8, 2011·5 cites·7 claims
- 1088US8337680B2Substrate holder and plating apparatusYOSHIOKA JUNICHIRO·Filed 2011·Granted Dec 25, 2012·3 cites·9 claims
- 1187US6195504B1Liquid feed vaporization system and gas injection deviceEBARA CORP·Filed 1997·Granted Feb 27, 2001·58 cites·13 claims
- 1284US7601248B2Substrate holder and plating apparatusEBARA CORP·Filed 2003·Granted Oct 13, 2009·11 cites·25 claims
- 1384US5862605AVaporizer apparatusEBARA CORP·Filed 1997·Granted Jan 26, 1999·62 cites·38 claims
- 1483US9388505B2Electrochemical deposition methodEBARA CORP·Filed 2014·Granted Jul 12, 2016·1 cites·15 claims
- 1583US8936705B2Electrochemical deposition apparatusEBARA CORP·Filed 2012·Granted Jan 20, 2015·1 cites·14 claims
- 1683US6517642B2Method and apparatus of producing thin film of metal or metal compoundEBARA CORP·Filed 2000·Granted Feb 11, 2003·25 cites·18 claims
- 1781US6730596B1Method of and apparatus for forming interconnectionEBARA CORP·Filed 2000·Granted May 4, 2004·19 cites·9 claims
- 1881US6269221B1Liquid feed vaporization system and gas injection deviceEBARA CORP·Filed 2000·Granted Jul 31, 2001·16 cites·18 claims
- 1980US9624596B2Electrochemical deposition methodEBARA CORP·Filed 2016·Granted Apr 18, 2017·3 cites·6 claims
- 2073US6972256B2Method and apparatus for forming thin film of metalEBARA CORP·Filed 2000·Granted Dec 6, 2005·17 cites·8 claims
- 2173US6116267AValving deviceEBARA CORP·Filed 1998·Granted Sep 12, 2000·29 cites·6 claims
- 2271US9506162B2Electrochemical deposition methodEBARA CORP·Filed 2016·Granted Nov 29, 2016·0 cites·3 claims
- 2368US2009301395A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2009·Application pending·0 cites
- 2467US9593430B2Electrochemical deposition methodEBARA CORP·Filed 2016·Granted Mar 14, 2017·1 cites·3 claims
- 2563US6780245B2Method and apparatus of producing thin film of metal or metal compoundEBARA CORP·Filed 2002·Granted Aug 24, 2004·7 cites·7 claims
- 2662US5950646AVapor feed supply systemEBARA CORP·Filed 1998·Granted Sep 14, 1999·23 cites·31 claims
- 2761US6458694B2High energy sputtering method for forming interconnectsEBARA CORP·Filed 2001·Granted Oct 1, 2002·7 cites·8 claims
- 2860US2013015075A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2012·Application pending·0 cites
- 2949US2006141157A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2004·Application pending·0 cites
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