Inventor · disambiguated record
Hung-Ming Wang
Also filed as: WANG HUNG-MING · WANG HUNG-MING (NMI)
25 granted patents·7 pending applications·107 citations·filing 1998–2024
94Inventor score
Files withNOVATEK MICROELECTRONICS CORP6SUNPOWER CORP6TESSERA INC6UNIV NAT CHENG KUNG5NOVELLUS SYSTEMS INC3
Top patents by PatentIndex Score
32 records- 0187US9680273B2Electrical connector with electrical contacts protected by a layer of compressible material and method of making itLIGHT DAVID NOEL·Filed 2013·Granted Jun 13, 2017·15 cites·15 claims
- 0283US7416975B2Method of forming contact layers on substratesNOVELLUS SYSTEMS INC·Filed 2005·Granted Aug 26, 2008·7 cites·37 claims
- 0382US11502213B2Solar cell having a plurality of sub-cells coupled by cell level interconnectionSUNPOWER CORP·Filed 2016·Granted Nov 15, 2022·2 cites·20 claims
- 0476US9774844B2Unpacking method, unpacking device and unpacking system of packed frameUNIV NAT CHENG KUNG·Filed 2014·Granted Sep 26, 2017·3 cites·42 claims
- 0575US11824130B2Solar cell having a plurality of sub-cells coupled by cell level interconnectionSUNPOWER CORP·Filed 2022·Granted Nov 21, 2023·0 cites·4 claims
- 0674US6573459B2Graded metallic leads for connection to microelectronic elementsTESSERA INC·Filed 2002·Granted Jun 3, 2003·18 cites·11 claims
- 0773US10456791B2Method and apparatus for performing contactless optically-induced dielectrophoresis for separation of circulating tumor cellsUNIV CHANG GUNG·Filed 2016·Granted Oct 29, 2019·1 cites·2 claims
- 0869US12024785B2Dual wafer plating fixture for a continuous plating lineMAXEON SOLAR PTE LTD·Filed 2023·Granted Jul 2, 2024·0 cites·14 claims
- 0969US7704880B1Method of forming contact layers on substratesNOVELLUS SYSTEMS INC·Filed 2008·Granted Apr 27, 2010·2 cites·25 claims
- 1060US11598018B2Dual wafer plating fixture for a continuous plating lineSUNPOWER CORP·Filed 2019·Granted Mar 7, 2023·0 cites·15 claims
- 1159US11670262B2Method of generating OSD dataNOVATEK MICROELECTRONICS CORP·Filed 2021·Granted Jun 6, 2023·0 cites·10 claims
- 1258US6255723B1Layered lead structuresTESSERA INC·Filed 1998·Granted Jul 3, 2001·22 cites·64 claims
- 1356US9521428B2Method, device and system for resizing original depth frame into resized depth frameUNIV NAT CHENG KUNG·Filed 2014·Granted Dec 13, 2016·0 cites·12 claims
- 1455US6465744B2Graded metallic leads for connection to microelectronic elementsTESSERA INC·Filed 1999·Granted Oct 15, 2002·17 cites·37 claims
- 1554US9832446B2Method, device and system for packing color frame and original depth frameUNIV NAT CHENG KUNG·Filed 2014·Granted Nov 28, 2017·0 cites·39 claims
- 1654US9529825B2Method, device and system for restoring resized depth frame into original depth frameUNIV NAT CHENG KUNG·Filed 2014·Granted Dec 27, 2016·0 cites·21 claims
- 1753US2024331592A1Display apparatus and image processing method thereof and image processing device thereofNOVATEK MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1852US11127871B2Structures and methods for forming electrodes of solar cellsSUNPOWER CORP·Filed 2019·Granted Sep 21, 2021·0 cites·16 claims
- 1951US12499651B2Image processor and operation method for optimizing on screen display resolutionNOVATEK MICROELECTRONICS CORP·Filed 2023·Granted Dec 16, 2025·0 cites·10 claims
- 2051US12015884B2Method of layer blending and reconstruction based on the alpha channelNOVATEK MICROELECTRONICS CORP·Filed 2021·Granted Jun 18, 2024·0 cites·15 claims
- 2151US7098074B2Microelectronic assemblies having low profile connectionsTESSERA INC·Filed 2003·Granted Aug 29, 2006·4 cites·40 claims
- 2251US2025336028A1Image processing ic and image processing methodNOVATEK MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2346US6248656B1Metal-jacketed lead manufacturing process using resist layersTESSERA INC·Filed 1999·Granted Jun 19, 2001·13 cites·25 claims
- 2446US2006275951A1Microelectronic assemblies having low profile connectionsTESSERA INC·Filed 2006·Application pending·0 cites
- 2544US11195966B2Bifacial solar cells with reflective back contactsSUNPOWER CORP·Filed 2015·Granted Dec 7, 2021·0 cites·6 claims
- 2644US7257893B2Efficient wafer processing technologyNOVELLUS SYSTEMS INC·Filed 2006·Granted Aug 21, 2007·0 cites·21 claims
- 2743US2014204175A1Image conversion method and module for naked-eye 3d displayUNIV NAT CHENG KUNG·Filed 2013·Application pending·0 cites
- 2842US6685820B2Method for treating spent tin/lead stripping solutionAMIA CO LTD·Filed 2002·Granted Feb 3, 2004·3 cites·20 claims
- 2940US2004182715A1Process and apparatus for air bubble removal during electrochemical processingFiled 2003·Application pending·0 cites
- 3039US2021193852A1Subtractive metallization for solar cellsSUNPOWER CORP·Filed 2019·Application pending·0 cites
- 3135US10462449B2Method and system for 360-degree video playbackNOVATEK MICROELECTRONICS CORP·Filed 2017·Granted Oct 29, 2019·0 cites·18 claims
- 3230US2018358770A1Electrical Connector with Electrical Contacts Protected by a Layer of Compressible Material and Method of Making ItLIGHT DAVID NOEL·Filed 2017·Application pending·0 cites
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