Inventor · disambiguated record
Jaynal A. Molla
Also filed as: MOLLA JAYNAL · MOLLA JAYNAL A · MOLLA JAYNAL ABEDIN
57 granted patents·4 pending applications·1,433 citations·filing 1987–2024
99Inventor score
Top patents by PatentIndex Score
61 records- 0198US5435057AInterconnection method and structure for organic circuit boardsIBM·Filed 1994·Granted Jul 25, 1995·290 cites·9 claims
- 0297US10269678B1Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereofNXP USA INC·Filed 2017·Granted Apr 23, 2019·31 cites·16 claims
- 0397US10199302B1Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2017·Granted Feb 5, 2019·15 cites·13 claims
- 0497US10199303B1Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2017·Granted Feb 5, 2019·14 cites·18 claims
- 0597US10141182B1Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2017·Granted Nov 27, 2018·21 cites·20 claims
- 0696US11128268B1Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted Sep 21, 2021·10 cites·20 claims
- 0794US11749639B2Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methodsNXP USA INC·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 0894US9922894B1Air cavity packages and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Mar 20, 2018·15 cites·14 claims
- 0994US5185073AMethod of fabricating nendritic materialsIBM·Filed 1991·Granted Feb 9, 1993·173 cites·4 claims
- 1092US10485091B2Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Nov 19, 2019·9 cites·20 claims
- 1192US5298685AInterconnection method and structure for organic circuit boardsIBM·Filed 1992·Granted Mar 29, 1994·79 cites·10 claims
- 1291US9099567B2Packaged semiconductor devices and methods of their fabricationVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Aug 4, 2015·13 cites·25 claims
- 1391US5137461ASeparable electrical connection technologyIBM·Filed 1990·Granted Aug 11, 1992·134 cites·8 claims
- 1490US11616040B2Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methodsNXP USA INC·Filed 2021·Granted Mar 28, 2023·2 cites·20 claims
- 1590US7829980B2Magnetoresistive device and method of packaging sameEVERSPIN TECHNOLOGIES INC·Filed 2007·Granted Nov 9, 2010·22 cites·6 claims
- 1689US5237743AMethod of forming a conductive end portion on a flexible circuit memberIBM·Filed 1992·Granted Aug 24, 1993·69 cites·21 claims
- 1788US9941210B1Semiconductor devices with protruding conductive vias and methods of making such devicesNXP USA INC·Filed 2016·Granted Apr 10, 2018·7 cites·26 claims
- 1886US9538659B2Solder wettable flanges and devices and systems incorporating solder wettable flangesVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Jan 3, 2017·6 cites·20 claims
- 1984US2024404914A1Thick-silver layer interfaceNXP USA INC·Filed 2024·Application pending·0 cites
- 2082US7598596B2Methods and apparatus for a dual-metal magnetic shield structureFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 6, 2009·11 cites·19 claims
- 2181US9589860B2Electronic devices with semiconductor die coupled to a thermally conductive substrateVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Mar 7, 2017·4 cites·34 claims
- 2280US5940729AMethod of planarizing a curved substrate and resulting structureIBM·Filed 1996·Granted Aug 17, 1999·41 cites·24 claims
- 2380US5798050AProcess for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrateIBM·Filed 1997·Granted Aug 25, 1998·50 cites·13 claims
- 2479US10741446B2Method of wafer dicing for wafers with backside metallization and packaged diesNXP USA INC·Filed 2017·Granted Aug 11, 2020·2 cites·20 claims
- 2579US6936763B2Magnetic shielding for electronic circuits which include magnetic materialsFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Aug 30, 2005·26 cites·23 claims
- 2679US5813870ASelectively filled adhesives for semiconductor chip interconnection and encapsulationIBM·Filed 1996·Granted Sep 29, 1998·55 cites·22 claims
- 2778US10861764B2Microelectronic components having integrated heat dissipation posts and systems including the sameNXP USA INC·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 2878US6885074B2Cladded conductor for use in a magnetoelectronics device and method for fabricating the sameFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Apr 26, 2005·21 cites·15 claims
- 2977US7105363B2Cladded conductor for use in a magnetoelectronics device and method for fabricating the sameFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 12, 2006·6 cites·19 claims
- 3077US4894296ACathode for zinc air cellsDURACELL INC·Filed 1987·Granted Jan 16, 1990·43 cites·19 claims
- 3176US10529638B2Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2018·Granted Jan 7, 2020·1 cites·20 claims
- 3276US10396006B2Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2018·Granted Aug 27, 2019·1 cites·20 claims
- 3376US9799580B2Semiconductor device package and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 24, 2017·2 cites·17 claims
- 3476US6362089B1Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formedMOTOROLA INC·Filed 1999·Granted Mar 26, 2002·41 cites·4 claims
- 3576US5432998AMethod of solder bonding processor packageIBM·Filed 1993·Granted Jul 18, 1995·40 cites·1 claims
- 3675US9425161B2Semiconductor device with mechanical lock features between a semiconductor die and a substrateFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Aug 23, 2016·2 cites·19 claims
- 3774US10431449B2Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Oct 1, 2019·1 cites·20 claims
- 3874US6517698B1System and method for providing rotation to plating flowMOTOROLA INC·Filed 2000·Granted Feb 11, 2003·8 cites·5 claims
- 3972US12094801B2Thick-silver layer interfaceNXP USA INC·Filed 2020·Granted Sep 17, 2024·0 cites·30 claims
- 4072US6137213AField emission device having a vacuum bridge focusing structure and methodMOTOROLA INC·Filed 1998·Granted Oct 24, 2000·26 cites·44 claims
- 4171US10825747B2Semiconductor device package and methods of manufacture thereofNXP USA INC·Filed 2017·Granted Nov 3, 2020·1 cites·17 claims
- 4268US9698116B2Thick-silver layer interface for a semiconductor die and corresponding thermal layerVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Jul 4, 2017·1 cites·8 claims
- 4368US6927072B2Method of applying cladding material on conductive lines of MRAM devicesFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Aug 9, 2005·13 cites·17 claims
- 4468US6414509B1Method and apparatus for in-situ testing of integrated circuit chipsIBM·Filed 2000·Granted Jul 2, 2002·18 cites·5 claims
- 4568US5910641ASelectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulationIBM·Filed 1997·Granted Jun 8, 1999·29 cites·9 claims
- 4666US6943038B2Method for fabricating a flux concentrating system for use in a magnetoelectronics deviceFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Sep 13, 2005·13 cites·19 claims
- 4763US5759046ADendritic interconnection systemIBM·Filed 1996·Granted Jun 2, 1998·24 cites·22 claims
- 4862US11437276B2Packaged dies with metal outer layers extending from die back sides toward die front sidesNXP USA INC·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 4958US10727153B2Thick-silver layer interfaceNXP USA INC·Filed 2017·Granted Jul 28, 2020·0 cites·19 claims
- 5057US12482719B2Low-stress thermal interfaceNXP USA INC·Filed 2022·Granted Nov 25, 2025·0 cites·26 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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