Inventor · disambiguated record
Richard A. Larder
Also filed as: LARDER RICHARD A
12 granted patents·511 citations·filing 1999–2009
93Inventor score
Files withFORMFACTOR INC12
Top patents by PatentIndex Score
12 records- 0197US6672875B1Spring interconnect structuresFORMFACTOR INC·Filed 1999·Granted Jan 6, 2004·249 cites·23 claims
- 0294US7841863B2Spring interconnect structuresFORMFACTOR INC·Filed 2009·Granted Nov 30, 2010·24 cites·14 claims
- 0394US7553165B2Spring interconnect structuresFORMFACTOR INC·Filed 2008·Granted Jun 30, 2009·27 cites·18 claims
- 0493US7119564B2Method and system for compensating thermally induced motion of probe cardsFORMFACTOR INC·Filed 2005·Granted Oct 10, 2006·20 cites·28 claims
- 0593US7071715B2Probe card configuration for low mechanical flexural strength electrical routing substratesFORMFACTOR INC·Filed 2004·Granted Jul 4, 2006·73 cites·12 claims
- 0692US6972578B2Method and system for compensating thermally induced motion of probe cardsFORMFACTOR INC·Filed 2002·Granted Dec 6, 2005·43 cites·14 claims
- 0790US7312618B2Method and system for compensating thermally induced motion of probe cardsFORMFACTOR INC·Filed 2006·Granted Dec 25, 2007·12 cites·9 claims
- 0886US7071714B2Method and system for compensating for thermally induced motion of probe cardsFORMFACTOR INC·Filed 2001·Granted Jul 4, 2006·25 cites·32 claims
- 0982US7825674B2Probe card configuration for low mechanical flexural strength electrical routing substratesFORMFACTOR INC·Filed 2006·Granted Nov 2, 2010·7 cites·38 claims
- 1081US7560941B2Method and system for compensating thermally induced motion of probe cardsFORMFACTOR INC·Filed 2006·Granted Jul 14, 2009·8 cites·9 claims
- 1177US7371072B2Spring interconnect structuresFORMFACTOR INC·Filed 2003·Granted May 13, 2008·20 cites·37 claims
- 1276US7642794B2Method and system for compensating thermally induced motion of probe cardsFORMFACTOR INC·Filed 2007·Granted Jan 5, 2010·3 cites·8 claims
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