Inventor · disambiguated record
Byung-Se So
Also filed as: SO BYUNG-SE
43 granted patents·7 pending applications·680 citations·filing 1996–2016
98Inventor score
Top patents by PatentIndex Score
50 records- 0194US7215561B2Semiconductor memory system having multiple system data busesSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 8, 2007·90 cites·22 claims
- 0293US7276786B2Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mountedSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 2, 2007·32 cites·26 claims
- 0393US6414904B2Two channel memory system having shared control and address bus and memory modules used thereforSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jul 2, 2002·85 cites·24 claims
- 0488US7615869B2Memory module with stacked semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 10, 2009·20 cites·20 claims
- 0588US6480409B2Memory modules having integral terminating resistors and computer system boards for use with sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 12, 2002·52 cites·8 claims
- 0683US7656181B2Apparatus and method for testing circuit characteristics by using eye maskSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 2, 2010·11 cites·22 claims
- 0782US7313715B2Memory system having stub bus configurationSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 25, 2007·31 cites·53 claims
- 0882US6815621B2Chip scale package, printed circuit board, and method of designing a printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 9, 2004·36 cites·34 claims
- 0981US7180327B2Memory module system with efficient control of on-die terminationSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 20, 2007·29 cites·25 claims
- 1081US7072201B2Memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 4, 2006·30 cites·21 claims
- 1178US7566958B2Multi-chip package for reducing parasitic load of pinSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 28, 2009·6 cites·11 claims
- 1278US6944737B2Memory modules and methods having a buffer clock that operates at different clock frequencies according to the operating modeSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 13, 2005·27 cites·11 claims
- 1378US6382986B1Socket for mounting memory module boards on a printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 7, 2002·31 cites·7 claims
- 1477US7447954B2Method of testing a memory module and hub of the memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 4, 2008·8 cites·19 claims
- 1576US7849373B2Method of testing a memory module and hub of the memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 7, 2010·2 cites·10 claims
- 1676US7818488B2Memory module with registersSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 19, 2010·24 cites·18 claims
- 1776US6836138B1Module having test architecture for facilitating the testing of ball grid array packages, and test method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 28, 2004·24 cites·10 claims
- 1875US6772262B1Memory module with improved data bus performanceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 3, 2004·19 cites·30 claims
- 1974US6252805B1Semiconductor memory device including programmable output pin determining unit and method of reading the same during test modeSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 26, 2001·22 cites·10 claims
- 2073US7148563B2Multi-chip package for reducing parasitic load of pinSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 12, 2006·14 cites·4 claims
- 2167US7847383B2Multi-chip package for reducing parasitic load of pinSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 7, 2010·3 cites·20 claims
- 2264US8051343B2Method of testing a memory module and hub of the memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Nov 1, 2011·2 cites·15 claims
- 2363US7505521B2Data transmission system and methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 17, 2009·8 cites·20 claims
- 2461US7606110B2Memory module, memory unit, and hub with non-periodic clock and methods of using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 20, 2009·5 cites·20 claims
- 2561US7106613B2Memory module and a method of arranging a signal line of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 12, 2006·2 cites·18 claims
- 2661US6828819B2High-speed memory systemSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 7, 2004·11 cites·26 claims
- 2758US7254675B2Memory system having memory modules with different memory device loadsSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 7, 2007·6 cites·9 claims
- 2856US6632705B1Memory modules and packages using different orientations and terminal assignmentsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 14, 2003·7 cites·14 claims
- 2955US7868438B2Multi-chip package for reducing parasitic load of pinSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 11, 2011·0 cites·9 claims
- 3054US7227258B2Mounting structure in integrated circuit moduleSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 5, 2007·8 cites·9 claims
- 3151US7334137B2Memory interface systems that couple a memory to a memory controller and are responsive to a terminal voltage that is independent of supply voltages for the memory and the memory controllerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 19, 2008·2 cites·16 claims
- 3249US6754112B2Integrated circuit devices having delay circuits for controlling setup/delay times of data signals that are provided to memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 22, 2004·6 cites·13 claims
- 3348US7049849B2Signal transmission circuits that use multiple input signals to generate a respective transmit signalSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 23, 2006·0 cites·9 claims
- 3446US10313217B2System on chip (SoC) capable of sharing resources with network device and devices having the SoCSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 4, 2019·0 cites·20 claims
- 3546US2007033457A1Circuit board and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3644US7539910B2Memory module test system for memory module including hubSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 26, 2009·4 cites·11 claims
- 3744US6990543B2Memory module with improved data bus performanceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 24, 2006·1 cites·20 claims
- 3843US2005002241A1Memory system with improved signal integrityFiled 2004·Application pending·0 cites
- 3942US2006069948A1Error detecting memory module and methodSEO JONG-CHEOL·Filed 2005·Application pending·0 cites
- 4041US6870742B2System boardSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 22, 2005·0 cites·5 claims
- 4139US5856982AHigh-speed disturb testing method and word line decoder in semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jan 5, 1999·8 cites·11 claims
- 4238US6587976B1Semiconductor device tester for measuring skew between output pins of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jul 1, 2003·9 cites·15 claims
- 4336US2016323283A1Semiconductor device for controlling access right to resource based on pairing technique and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 4436US2016337322A1Semiconductor device for managing user data according to security level and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 4534US7930465B2Determining operation mode for semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 19, 2011·0 cites·18 claims
- 4634US7350120B2Buffered memory module and method for testing sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 25, 2008·0 cites·12 claims
- 4734US7219274B2Memory module and method of testing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 15, 2007·0 cites·12 claims
- 4833US6714595B1Signal transmission circuits that use multiple input signals to generate a respective transmit signal and methods of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Mar 30, 2004·5 cites·8 claims
- 4933US2006059298A1Memory module with memory devices of different capacityCHO JEONG-HYEON·Filed 2005·Application pending·0 cites
- 5032US2006064611A1Method of testing memory module and memory moduleSHIN SEUNG-MAN·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →