Inventor · disambiguated record
Luc Petit
Also filed as: PETIT LUC
7 granted patents·2 pending applications·72 citations·filing 1997–2024
84Inventor score
Files withST MICROELECTRONICS GRENOBLE 23SGS THOMSON MICROELECTRONICS2ST MICROELECTRONICS SA2ST MICROELECTRONICS INT NV1STMICROELECTRONICS (GRENOBLE 2) SAS1
Top patents by PatentIndex Score
9 records- 0187US9818664B2Electronic device comprising an encapsulating block locally of smaller thicknessSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Granted Nov 14, 2017·6 cites·12 claims
- 0276US6399475B1Process for producing electrical connections on the surface of a semiconductor package with electrical-connection dropsST MICROELECTRONICS SA·Filed 2000·Granted Jun 4, 2002·24 cites·7 claims
- 0362US2025079259A1Package for integrated circuit with heat dissipationST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0456US9006904B2Dual side package on packageST MICROELECTRONICS GRENOBLE 2·Filed 2012·Granted Apr 14, 2015·1 cites·12 claims
- 0556US2023411271A1Integrated circuit packagesST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 0652US6049971ACasing for integrated circuit chips and method of fabricationSGS THOMSON MICROELECTRONICS·Filed 1997·Granted Apr 18, 2000·21 cites·15 claims
- 0751US10186466B2Electronic device comprising an encapsulating block locally of smaller thicknessST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Jan 22, 2019·0 cites·4 claims
- 0848US5959355ASemiconductor package having mechanically and electrically bonded supportive elementsSGS THOMSON MICROELECTRONICS·Filed 1997·Granted Sep 28, 1999·16 cites·13 claims
- 0946US6528407B1Process for producing electrical-connections on a semiconductor package, and semiconductor packageST MICROELECTRONICS SA·Filed 2000·Granted Mar 4, 2003·4 cites·21 claims
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