Inventor · disambiguated record
Michael G. Peters
Also filed as: PETERS MICHAEL · PETERS MICHAEL G
30 granted patents·1 pending application·2,464 citations·filing 1991–2005
98Inventor score
Top patents by PatentIndex Score
31 records- 0198US6239485B1Reduced cross-talk noise high density signal interposer with power and ground wrapFUJITSU LTD·Filed 1999·Granted May 29, 2001·194 cites·6 claims
- 0298US6187652B1Method of fabrication of multiple-layer high density substrateFUJITSU LTD·Filed 1998·Granted Feb 13, 2001·177 cites·18 claims
- 0397US6039889AProcess flows for formation of fine structure layer pairs on flexible filmsFUJITSU LTD·Filed 1999·Granted Mar 21, 2000·156 cites·20 claims
- 0497US5454161AThrough hole interconnect substrate fabrication processFUJITSU LTD·Filed 1993·Granted Oct 3, 1995·256 cites·26 claims
- 0596US6706546B2Optical reflective structures and method for makingFUJITSU LTD·Filed 2001·Granted Mar 16, 2004·143 cites·38 claims
- 0696US6521530B2Composite interposer and method for producing a composite interposerFUJITSU LTD·Filed 2001·Granted Feb 18, 2003·237 cites·37 claims
- 0796US5854534AControlled impedence interposer substrateFUJITSU LTD·Filed 1995·Granted Dec 29, 1998·238 cites·23 claims
- 0894US5419038AMethod for fabricating thin-film interconnectorFUJITSU LTD·Filed 1993·Granted May 30, 1995·96 cites·33 claims
- 0990US6662443B2Method of fabricating a substrate with a via connectionFUJITSU LTD·Filed 2001·Granted Dec 16, 2003·47 cites·46 claims
- 1090US6168972B1Flip chip pre-assembly underfill processFUJITSU LTD·Filed 1998·Granted Jan 2, 2001·108 cites·20 claims
- 1190US5607723AMethod for making continuous thin diamond filmCRYSTALLUME·Filed 1994·Granted Mar 4, 1997·71 cites·1 claims
- 1289US5544017AMultichip module substrateFUJITSU LTD·Filed 1994·Granted Aug 6, 1996·91 cites·14 claims
- 1387US5872696ASputtered and anodized capacitors capable of withstanding exposure to high temperaturesFUJITSU LTD·Filed 1997·Granted Feb 16, 1999·69 cites·32 claims
- 1486US6081026AHigh density signal interposer with power and ground wrapFUJITSU LTD·Filed 1998·Granted Jun 27, 2000·61 cites·6 claims
- 1585US6102710AControlled impedance interposer substrate and method of makingFUJITSU LTD·Filed 1998·Granted Aug 15, 2000·68 cites·18 claims
- 1684US5432003AContinuous thin diamond film and method for making sameCRYSTALLUME·Filed 1991·Granted Jul 11, 1995·55 cites·2 claims
- 1783US5236740AMethods for coating adherent diamond films on cemented tungsten carbide substratesNAT CENTER FOR MANUFACTURING S·Filed 1991·Granted Aug 17, 1993·54 cites·4 claims
- 1881US7513037B2Method of embedding components in multi-layer circuit boardsFUJITSU LTD·Filed 2005·Granted Apr 7, 2009·9 cites·11 claims
- 1980US5455064AProcess for fabricating a substrate with thin film capacitor and insulating plugFUJITSU LTD·Filed 1993·Granted Oct 3, 1995·57 cites·4 claims
- 2077US5891354AMethods of etching through wafers and substrates with a composite etch stop layerFUJITSU LTD·Filed 1996·Granted Apr 6, 1999·50 cites·20 claims
- 2174US6197664B1Method for electroplating vias or through holes in substrates having conductors on both sidesFUJITSU LTD·Filed 1999·Granted Mar 6, 2001·35 cites·9 claims
- 2274US5817533AHigh-yield methods of fabricating large substrate capacitorsFUJITSU LTD·Filed 1996·Granted Oct 6, 1998·43 cites·26 claims
- 2370US5323520AProcess for fabricating a substrate with thin film capacitorFUJITSU LTD·Filed 1993·Granted Jun 28, 1994·35 cites·26 claims
- 2463US5652693ASubstrate with thin film capacitor and insulating plugFUJITSU LTD·Filed 1995·Granted Jul 29, 1997·25 cites·8 claims
- 2561US6898343B2Optical switching apparatus and method for fabricatingFUJITSU LTD·Filed 2001·Granted May 24, 2005·7 cites·10 claims
- 2660US6226171B1Power conducting substrates with high-yield integrated substrate capacitorFUJITSU LTD·Filed 1999·Granted May 1, 2001·24 cites·22 claims
- 2756US5567526ACemented tungsten carbide substrates having adherent diamond films coated thereonNAT CENTER FOR MANUFACTURING S·Filed 1995·Granted Oct 22, 1996·17 cites·1 claims
- 2853US5406446AThin film capacitorFUJITSU LTD·Filed 1994·Granted Apr 11, 1995·17 cites·7 claims
- 2948US6106923AVenting hole designs for multilayer conductor-dielectric structuresFUJITSU LTD·Filed 1997·Granted Aug 22, 2000·14 cites·23 claims
- 3044US5778529AMethod of making a multichip module substrateFUJITSU LTD·Filed 1996·Granted Jul 14, 1998·10 cites·24 claims
- 3138US2002175402A1Structure and method of embedding components in multi-layer substratesFiled 2001·Application pending·0 cites
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