Inventor · disambiguated record
Yoichi Hiruta
Also filed as: HIRUTA YOICHI
19 granted patents·1 pending application·1,004 citations·filing 1986–2013
96Inventor score
Top patents by PatentIndex Score
20 records- 0194US5629566AFlip-chip semiconductor devices having two encapsulantsTOSHIBA KK·Filed 1995·Granted May 13, 1997·199 cites·18 claims
- 0293US6111317AFlip-chip connection type semiconductor integrated circuit deviceTOSHIBA KK·Filed 1997·Granted Aug 29, 2000·157 cites·16 claims
- 0390US5648686AConnecting electrode portion in semiconductor deviceTOSHIBA KK·Filed 1995·Granted Jul 15, 1997·115 cites·22 claims
- 0489US5801447AFlip chip mounting type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Sep 1, 1998·107 cites·5 claims
- 0583US5998861ASemiconductor device having ball grid arrayTOSHIBA KK·Filed 1996·Granted Dec 7, 1999·72 cites·49 claims
- 0683US5461197AElectronic device having a chip with an external bump terminal equal or smaller than a via hole on a boardTOSHIBA KK·Filed 1994·Granted Oct 24, 1995·72 cites·13 claims
- 0774US5401688ASemiconductor device of multichip module-typeTOSHIBA KK·Filed 1993·Granted Mar 28, 1995·55 cites·7 claims
- 0869US4764478AMethod of manufacturing MOS transistor by dual species implantation and rapid annealingTOSHIBA KK·Filed 1986·Granted Aug 16, 1988·25 cites·17 claims
- 0968US9059143B2Semiconductor deviceIMAIZUMI YUKARI·Filed 2011·Granted Jun 16, 2015·5 cites·15 claims
- 1068US5138433AMulti-chip package type semiconductor deviceTOSHIBA KK·Filed 1991·Granted Aug 11, 1992·38 cites·15 claims
- 1164US6182828B1Reel tape for provisionally supporting a bare chipTOSHIBA KK·Filed 1999·Granted Feb 6, 2001·25 cites·4 claims
- 1264US6094057ABoard for evaluating the characteristics of a semiconductor chip and a method for mounting a semiconductor chip thereonTOSHIBA KK·Filed 1996·Granted Jul 25, 2000·25 cites·6 claims
- 1362US4713356AManufacturing MOS semiconductor device with planarized conductive layerTOSHIBA KK·Filed 1986·Granted Dec 15, 1987·28 cites·11 claims
- 1461US5533664AMethod of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1994·Granted Jul 9, 1996·28 cites·11 claims
- 1552US5952841ABare chip prober deviceTOSHIBA KK·Filed 1997·Granted Sep 14, 1999·15 cites·4 claims
- 1646US5477079APower source noise suppressing type semiconductor deviceTOSHIBA KK·Filed 1994·Granted Dec 19, 1995·15 cites·28 claims
- 1740US5424917ASemiconductor device and method for mounting semiconductor waferTOSHIBA KK·Filed 1993·Granted Jun 13, 1995·10 cites·13 claims
- 1837US5463245ASemiconductor integrated circuit device having sealing meansTOSHIBA KK·Filed 1993·Granted Oct 31, 1995·8 cites·5 claims
- 1933US5179434ASemiconductor device and manufacturing method thereofTOSHIBA KK·Filed 1991·Granted Jan 12, 1993·5 cites·5 claims
- 2030US2013256865A1Semiconductor moduleUMEKI AKIHIRO·Filed 2013·Application pending·0 cites
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