Inventor · disambiguated record
Evan G. Colgan
Also filed as: COLGAN EVAN · COLGAN EVAN G · COLGAN EVAN GEORGE
202 granted patents·17 pending applications·5,640 citations·filing 1991–2024
99Inventor score
Top patents by PatentIndex Score
219 records- 0199US7990711B1Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plateIBM·Filed 2010·Granted Aug 2, 2011·142 cites·25 claims
- 0298US7808781B2Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirementsIBM·Filed 2008·Granted Oct 5, 2010·47 cites·14 claims
- 0398US7331796B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2006·Granted Feb 19, 2008·50 cites·7 claims
- 0498US6648485B1Highly collimating tapered light guide for uniform illumination of flat panel displaysIBM·Filed 2000·Granted Nov 18, 2003·167 cites·35 claims
- 0598US6377233B2Micromechanical display and fabrication methodIBM·Filed 2001·Granted Apr 23, 2002·203 cites·9 claims
- 0697US8004841B2Method and apparatus of water cooling several parallel circuit cards each containing several chip packagesIBM·Filed 2008·Granted Aug 23, 2011·66 cites·22 claims
- 0797US7928562B2Segmentation of a die stack for 3D packaging thermal managementIBM·Filed 2008·Granted Apr 19, 2011·58 cites·18 claims
- 0897US7832095B2Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·24 cites·3 claims
- 0997US7486513B2Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid coolingIBM·Filed 2007·Granted Feb 3, 2009·71 cites·14 claims
- 1097US7342789B2Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid coolingIBM·Filed 2006·Granted Mar 11, 2008·130 cites·15 claims
- 1197US6529189B1Touch screen stylus with IR-coupled selection buttonsIBM·Filed 2000·Granted Mar 4, 2003·182 cites·14 claims
- 1297US6057903ALiquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layerIBM·Filed 1998·Granted May 2, 2000·287 cites·11 claims
- 1396US11307147B2Accurate colorimetric based test strip reader systemIBM·Filed 2020·Granted Apr 19, 2022·6 cites·18 claims
- 1496US10605741B2Accurate colorimetric based test strip reader systemIBM·Filed 2018·Granted Mar 31, 2020·8 cites·21 claims
- 1596US9207002B2Contaminant separator for a vapor-compression refrigeration apparatusCAMPBELL LEVI A·Filed 2011·Granted Dec 8, 2015·17 cites·15 claims
- 1696US8693200B2Semiconductor device cooling moduleCOLGAN EVAN G·Filed 2012·Granted Apr 8, 2014·31 cites·17 claims
- 1796US7665999B2Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier planeIBM·Filed 2008·Granted Feb 23, 2010·19 cites·3 claims
- 1896US7354277B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 8, 2008·20 cites·4 claims
- 1996US7344907B2Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scaleIBM·Filed 2004·Granted Mar 18, 2008·82 cites·13 claims
- 2096US7116886B2Devices and methods for side-coupling optical fibers to optoelectronic componentsIBM·Filed 2005·Granted Oct 3, 2006·52 cites·3 claims
- 2196US6495005B1Electroplating apparatusIBM·Filed 2000·Granted Dec 17, 2002·104 cites·17 claims
- 2295US8081473B2Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packagesCIPOLLA THOMAS M·Filed 2008·Granted Dec 20, 2011·52 cites·18 claims
- 2395US7836585B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 23, 2010·16 cites·3 claims
- 2495US7832094B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·16 cites·5 claims
- 2595US7823283B2Method of forming a land grid array interposerIBM·Filed 2008·Granted Nov 2, 2010·16 cites·8 claims
- 2695US7484966B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Feb 3, 2009·16 cites·1 claims
- 2795US7361025B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 22, 2008·16 cites·6 claims
- 2895US7230334B2Semiconductor integrated circuit chip packages having integrated microchannel cooling modulesIBM·Filed 2004·Granted Jun 12, 2007·66 cites·25 claims
- 2995US7190580B2Apparatus and methods for microchannel cooling of semiconductor integrated circuit packagesIBM·Filed 2004·Granted Mar 13, 2007·103 cites·29 claims
- 3095US6323834B1Micromechanical displays and fabrication methodIBM·Filed 1998·Granted Nov 27, 2001·137 cites·22 claims
- 3195US6204897B1Integrated resistor for measuring touch position in a liquid crystal display deviceIBM·Filed 1998·Granted Mar 20, 2001·206 cites·10 claims
- 3295US5281485AStructure and method of making Alpha-Ta in thin filmsIBM·Filed 1993·Granted Jan 25, 1994·213 cites·26 claims
- 3395US5221449AMethod of making Alpha-Ta thin filmsIBM·Filed 1992·Granted Jun 22, 1993·206 cites·13 claims
- 3494US9470439B2Contaminant separator for a vapor-compression refrigeration apparatusIBM·Filed 2013·Granted Oct 18, 2016·10 cites·16 claims
- 3594US8937810B2Electronic assembly with detachable coolant manifold and coolant-cooled electronic moduleBRUNSCHWILER THOMAS J·Filed 2012·Granted Jan 20, 2015·24 cites·16 claims
- 3694US6177918B1Liquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layerIBM·Filed 1999·Granted Jan 23, 2001·204 cites·34 claims
- 3793US8901621B1Nanochannel process and structure for bio-detectionIBM·Filed 2013·Granted Dec 2, 2014·11 cites·11 claims
- 3893US8115302B2Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling deviceANDRY PAUL S·Filed 2008·Granted Feb 14, 2012·19 cites·15 claims
- 3993US8115303B2Semiconductor package structures having liquid coolers integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2008·Granted Feb 14, 2012·28 cites·11 claims
- 4093US8037600B2Method of producing a land grid array interposer structureIBM·Filed 2008·Granted Oct 18, 2011·11 cites·7 claims
- 4193US7139172B2Apparatus and methods for microchannel cooling of semiconductor integrated circuit packagesIBM·Filed 2004·Granted Nov 21, 2006·83 cites·18 claims
- 4293US6620719B1Method of forming ohmic contacts using a self doping layer for thin-film transistorsIBM·Filed 2000·Granted Sep 16, 2003·82 cites·27 claims
- 4393US5706067AReflective spatial light modulator arrayIBM·Filed 1997·Granted Jan 6, 1998·138 cites·19 claims
- 4492US9941189B2Counter-flow expanding channels for enhanced two-phase heat removalIBM·Filed 2015·Granted Apr 10, 2018·7 cites·24 claims
- 4592US9313921B2Chip stack structures that implement two-phase cooling with radial flowIBM·Filed 2013·Granted Apr 12, 2016·12 cites·19 claims
- 4692US8713955B2Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatusCAMPBELL LEVI A·Filed 2011·Granted May 6, 2014·13 cites·20 claims
- 4792US6483498B1Liquid crystal display with integrated resistive touch sensorIBM·Filed 1999·Granted Nov 19, 2002·199 cites·25 claims
- 4892US5625233AThin film multi-layer oxygen diffusion barrier consisting of refractory metal, refractory metal aluminide, and aluminum oxideIBM·Filed 1995·Granted Apr 29, 1997·116 cites·19 claims
- 4991US10232337B2Flow cell array and uses thereofIBM·Filed 2015·Granted Mar 19, 2019·2 cites·3 claims
- 5091US8772927B2Semiconductor package structures having liquid cooler integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2011·Granted Jul 8, 2014·12 cites·10 claims
Showing the top 50 of 219 patent records by PatentIndex Score.
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