Inventor

SWAN JOHANNA

US84 patents

⚠️ This page may combine multiple inventors who share the name “SWAN JOHANNA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SWAN JOHANNA

INTEL CORP

Stackable integrated circuit packaging

Thinned die integrated circuit package

Thinned die integrated circuit package

Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board

Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board

Thinned die integrated circuit package

Thermal management solutions for stacked integrated circuit devices

Reconstituted wafer assembly

Mmwave waveguide to waveguide connectors for automotive applications

Composite interposer structure and method of providing same

Composite IC chips including a chiplet embedded within metallization layers of a host IC chip

Heat spreading layer integrated within a composite IC die structure and methods of forming the same

Mixed hybrid bonding structures and methods of forming the same

High-density interconnects for integrated circuit packages

Composite interposer structure and method of providing same

Thermal management solutions for stacked integrated circuit devices

Mixed hybrid bonding structures and methods of forming the same

Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices

Thermal management solutions for substrates in integrated circuit packages

Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements

Waveguide coupling systems and methods

Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices

Multiplexer and combiner structures embedded in a mmwave connector interface

Flexible electronic system with wire bonds

Selective recess of interconnects for probing hybrid bond devices

Organic interposers for integrated circuit packages

Vias in composite IC chip structures

Technologies for providing a cognitive capacity test for autonomous driving

Flexible electronic system with wire bonds

Architecture for seamless integrated display system

Integrated circuit and method that utilize a shape memory material

Waveguide interconnects for semiconductor packages and related methods

Liquid cooled interposer for integrated circuit stack

Thermal management solutions for embedded integrated circuit devices

Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections

Additive manufacturing for integrated circuit assembly connector support structures

Thermal management solutions for embedded integrated circuit devices

Thermal management solutions for embedded integrated circuit devices

Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections

Optical interconnect on bumpless build-up layer package

Porous mesh structures for the thermal management of integrated circuit devices

Selective interconnects in back-end-of-line metallization stacks of integrated circuitry

Composite interposer structure and method of providing same

Thermal performance in hybrid bonded 3D die stacks

High-density interconnects for integrated circuit packages

High-throughput additively manufactured power delivery vias and traces

LU DAOQIANG

Method of mounting an optical device

Lin kevin l

Semiconductor package with air pressure sensor

CHAKRAVORTY KISHORE K

Optoelectrical package

MA QING

Techniques, systems and devices related to acceleration measurement