Inventor · disambiguated record
Jeffrey A. Zitz
Also filed as: ZITZ JEFFREY · ZITZ JEFFREY A · ZITZ JEFFREY ALLEN
63 granted patents·7 pending applications·985 citations·filing 1994–2023
99Inventor score
Top patents by PatentIndex Score
70 records- 0197US7928562B2Segmentation of a die stack for 3D packaging thermal managementIBM·Filed 2008·Granted Apr 19, 2011·58 cites·18 claims
- 0296US11800666B2Temporary removable module lidIBM·Filed 2021·Granted Oct 24, 2023·4 cites·19 claims
- 0396US8693200B2Semiconductor device cooling moduleCOLGAN EVAN G·Filed 2012·Granted Apr 8, 2014·31 cites·17 claims
- 0495US10842043B1Fabricating coolant-cooled heat sinks with internal thermally-conductive finsIBM·Filed 2019·Granted Nov 17, 2020·22 cites·20 claims
- 0595US10541156B1Multi integrated circuit chip carrier packageIBM·Filed 2018·Granted Jan 21, 2020·16 cites·20 claims
- 0694US11156409B2Coolant-cooled heat sinks with internal thermally-conductive fins joined to the coverIBM·Filed 2020·Granted Oct 26, 2021·6 cites·20 claims
- 0794US10757833B2Cooling structure for electronic boardsIBM·Filed 2019·Granted Aug 25, 2020·7 cites·17 claims
- 0894US8937810B2Electronic assembly with detachable coolant manifold and coolant-cooled electronic moduleBRUNSCHWILER THOMAS J·Filed 2012·Granted Jan 20, 2015·24 cites·16 claims
- 0993US9366591B2Determining magnitude of compressive loadingIBM·Filed 2014·Granted Jun 14, 2016·10 cites·12 claims
- 1092US6740959B2EMI shielding for semiconductor chip carriersIBM·Filed 2001·Granted May 25, 2004·97 cites·28 claims
- 1191US10172258B2Cooling structure for electronic boardsIBM·Filed 2017·Granted Jan 1, 2019·5 cites·10 claims
- 1291US7834442B2Electronic package method and structure with cure-melt hierarchyIBM·Filed 2007·Granted Nov 16, 2010·24 cites·20 claims
- 1390US9437515B2Heat spreading layer with high thermal conductivityIBM·Filed 2015·Granted Sep 6, 2016·6 cites·1 claims
- 1490US5471027AMethod for forming chip carrier with a single protective encapsulantIBM·Filed 1994·Granted Nov 28, 1995·132 cites·17 claims
- 1589US7394659B2Apparatus and methods for cooling semiconductor integrated circuit package structuresIBM·Filed 2004·Granted Jul 1, 2008·50 cites·22 claims
- 1688US7250576B2Chip package having chip extension and methodIBM·Filed 2005·Granted Jul 31, 2007·17 cites·12 claims
- 1788US6413353B2Method for direct attachment of a chip to a cooling memberIBM·Filed 1999·Granted Jul 2, 2002·68 cites·15 claims
- 1887US9721870B2Cooling structure for electronic boardsIBM·Filed 2014·Granted Aug 1, 2017·5 cites·16 claims
- 1987US7768121B2Apparatus and methods for cooling semiconductor integrated circuit package structuresIBM·Filed 2007·Granted Aug 3, 2010·13 cites·14 claims
- 2087US6774482B2Chip coolingIBM·Filed 2002·Granted Aug 10, 2004·44 cites·27 claims
- 2187US6657864B1High density thermal solution for direct attach modulesIBM·Filed 2002·Granted Dec 2, 2003·52 cites·17 claims
- 2287US5533256AMethod for directly joining a chip to a heat sinkIBM·Filed 1995·Granted Jul 9, 1996·102 cites·14 claims
- 2386US7443026B2IC chip package having force-adjustable member between stiffener and printed circuit boardIBM·Filed 2006·Granted Oct 28, 2008·12 cites·12 claims
- 2485US6191480B1Universal land grid array socket engagement mechanismIBM·Filed 1999·Granted Feb 20, 2001·85 cites·9 claims
- 2584US8445331B2Multichip electronic packages and methods of manufactureKADAKIA SURESH D·Filed 2012·Granted May 21, 2013·6 cites·17 claims
- 2683US9066460B2Disassemblable electronic assembly with leak-inhibiting coolant capillariesIBM·Filed 2013·Granted Jun 23, 2015·6 cites·20 claims
- 2781US8794079B2Determining magnitude of compressive loadingBODENWEBER PAUL F·Filed 2011·Granted Aug 5, 2014·3 cites·9 claims
- 2880US10424494B2Chip module with stiffening frame and orthogonal heat spreaderIBM·Filed 2017·Granted Sep 24, 2019·2 cites·7 claims
- 2980US7733655B2Lid edge capping loadIBM·Filed 2008·Granted Jun 8, 2010·11 cites·16 claims
- 3078US7803664B2Apparatus and methods for cooling semiconductor integrated circuit package structuresIBM·Filed 2008·Granted Sep 28, 2010·7 cites·13 claims
- 3177US11158562B2Conformal integrated circuit (IC) device package lidIBM·Filed 2020·Granted Oct 26, 2021·1 cites·19 claims
- 3277US9583408B1Reducing directional stress in an orthotropic encapsulation member of an electronic packageIBM·Filed 2015·Granted Feb 28, 2017·3 cites·15 claims
- 3373US10593564B2Lid attach optimization to limit electronic package warpageIBM·Filed 2018·Granted Mar 17, 2020·1 cites·6 claims
- 3472US10083886B2Lid attach optimization to limit electronic package warpageIBM·Filed 2017·Granted Sep 25, 2018·1 cites·7 claims
- 3572US9153460B2Heatsink attachment moduleIBM·Filed 2013·Granted Oct 6, 2015·2 cites·12 claims
- 3669US8592970B2Multichip electronic packages and methods of manufactureSIKKA KAMAL K·Filed 2011·Granted Nov 26, 2013·3 cites·24 claims
- 3769US8587114B2Multichip electronic packages and methods of manufactureKADAKIA SURESH D·Filed 2010·Granted Nov 19, 2013·2 cites·19 claims
- 3868US8717043B2Determining thermal interface material (TIM) thickness changeBODENWEBER PAUL F·Filed 2011·Granted May 6, 2014·2 cites·19 claims
- 3967US10049896B2Lid attach optimization to limit electronic package warpageIBM·Filed 2015·Granted Aug 14, 2018·1 cites·3 claims
- 4066US12028997B2Rotating lid for module coolerIBM·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
- 4166US7436057B2Elastomer interposer with voids in a compressive loading systemIBM·Filed 2005·Granted Oct 14, 2008·3 cites·23 claims
- 4266US7288839B2Apparatus and methods for cooling semiconductor integrated circuit package structuresIBM·Filed 2004·Granted Oct 30, 2007·11 cites·25 claims
- 4365US10905029B2Cooling structure for electronic boardsIBM·Filed 2019·Granted Jan 26, 2021·0 cites·12 claims
- 4464US8900927B2Multichip electronic packages and methods of manufactureBEAUMIER MARTIN M·Filed 2010·Granted Dec 2, 2014·2 cites·22 claims
- 4563US8823164B2Heatsink attachment moduleCOLGAN EVAN G·Filed 2011·Granted Sep 2, 2014·1 cites·18 claims
- 4662US6964885B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2004·Granted Nov 15, 2005·9 cites·33 claims
- 4762US6955543B2Method and apparatus to form a reworkable seal on an electronic moduleIBM·Filed 2003·Granted Oct 18, 2005·11 cites·24 claims
- 4861US10542636B2Cooling structure for electronic boardsIBM·Filed 2018·Granted Jan 21, 2020·0 cites·8 claims
- 4960US10566215B2Method of fabricating a chip module with stiffening frame and orthogonal heat spreaderIBM·Filed 2017·Granted Feb 18, 2020·0 cites·5 claims
- 5059US10978314B2Multi integrated circuit chip carrier packageIBM·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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