Inventor · disambiguated record
Kohei Nishiguchi
Also filed as: NISHIGUCHI KOHEI
10 granted patents·3 pending applications·3 citations·filing 2007–2022
78Inventor score
Top patents by PatentIndex Score
13 records- 0177US11569081B2Method for analyzing metal fine particles, and inductively coupled plasma mass spectrometry methodIAS INC·Filed 2019·Granted Jan 31, 2023·2 cites·1 claims
- 0271US12354862B2Method for analyzing metal microparticles, and inductively coupled plasma mass spectrometry methodIAS INC·Filed 2022·Granted Jul 8, 2025·0 cites·2 claims
- 0354US8020458B2Sample introducing systemSUMITOMO SEIKA CHEMICALS·Filed 2007·Granted Sep 20, 2011·1 cites·8 claims
- 0453US10249500B2Method for manufacturing substrate for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 2, 2019·0 cites·8 claims
- 0551US12451397B2Semiconductor wafer and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Oct 21, 2025·0 cites·6 claims
- 0649US11335594B2Method for manufacturing semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted May 17, 2022·0 cites·12 claims
- 0748US9966264B2Substrate for semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted May 8, 2018·0 cites·5 claims
- 0847US2025022922A1Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0947US2024128351A1Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1046US11881516B2Semiconductor element comprising a MIM capacitor and a via hole, a bottom of the via hole being placed between a rear surface of a source electrode and a rear surface of a barrier metal layerMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 23, 2024·0 cites·20 claims
- 1145US2011133074A1Analytical method and analytical systemSUMITOMO SEIKA CHEMICALS·Filed 2009·Application pending·0 cites
- 1244US9691722B2Surface mount high-frequency circuitMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jun 27, 2017·0 cites·8 claims
- 1340US11171005B2Semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Nov 9, 2021·0 cites·9 claims
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