Inventor · disambiguated record
Shuo-Hsun Chang
Also filed as: CHANG SHUO-HSUN
10 granted patents·2 pending applications·30 citations·filing 2006–2019
84Inventor score
Files withKINSUS INTERCONNECT TECH CORP7ADVANCED SEMICONDUCTOR ENG3ADVANCED SEMICONDUCTOR ENGINIE1HSU JUN-CHUNG1
Top patents by PatentIndex Score
12 records- 0189US9831167B1Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Nov 28, 2017·7 cites·18 claims
- 0285US7550375B2Method for forming metal bumpsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 23, 2009·15 cites·25 claims
- 0375US9406641B2Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Aug 2, 2016·3 cites·8 claims
- 0465US10334719B2Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Jun 25, 2019·1 cites·18 claims
- 0560US7560650B2Substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENGINIE·Filed 2006·Granted Jul 14, 2009·4 cites·15 claims
- 0657US11044806B2Method for manufacturing multi-layer circuit board capable of being applied with electrical testingKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 0752US10548214B2Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Jan 28, 2020·0 cites·20 claims
- 0850US10455694B2Method for manufacturing a multi-layer circuit board capable of being applied with electrical testingKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Oct 22, 2019·0 cites·20 claims
- 0946US9754870B2Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Sep 5, 2017·0 cites·4 claims
- 1043US7795722B2Substrate strip and substrate structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 14, 2010·0 cites·14 claims
- 1141US2007232051A1Method for forming metal bumpsADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1240US2011049703A1Flip-Chip Package StructureHSU JUN-CHUNG·Filed 2009·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →