Inventor · disambiguated record
Boyi Yang
Also filed as: YANG BOYI
10 granted patents·1 pending application·112 citations·filing 2011–2023
89Inventor score
Top patents by PatentIndex Score
11 records- 0196US8994115B2Power device integration on a common substrateIO SEMICONDUCTOR INC·Filed 2014·Granted Mar 31, 2015·24 cites·10 claims
- 0296US8674440B2Power device integration on a common substrateIO SEMICONDUCTOR INC·Filed 2013·Granted Mar 18, 2014·39 cites·20 claims
- 0395US9412881B2Power device integration on a common substrateSILANNA ASIA PTE LTD·Filed 2013·Granted Aug 9, 2016·17 cites·23 claims
- 0488US9825124B2Power device integration on a common substrateSILANNA ASIA PTE LTD·Filed 2016·Granted Nov 21, 2017·4 cites·14 claims
- 0588US8928116B2Power device integration on a common substrateI O SEMICONDUCTOR INC·Filed 2013·Granted Jan 6, 2015·17 cites·16 claims
- 0683US10290702B2Power device on bulk substrateSILANNA ASIA PTE LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
- 0783US8722503B2Capacitors and methods of formingKOREC JACEK·Filed 2011·Granted May 13, 2014·7 cites·5 claims
- 0883US2023420497A1Power device integration on a common substrateSILANNA ASIA PTE LTD·Filed 2023·Application pending·0 cites
- 0977US11791377B2Power device integration on a common substrateSILANNA ASIA PTE LTD·Filed 2022·Granted Oct 17, 2023·0 cites·8 claims
- 1063US11302775B2Power device integration on a common substrateSILANNA ASIA PTE LTD·Filed 2019·Granted Apr 12, 2022·0 cites·8 claims
- 1159US10290703B2Power device integration on a common substrateSILANNA ASIA PTE LTD·Filed 2017·Granted May 14, 2019·0 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →