Inventor · disambiguated record
Reid John Chesterfield
Also filed as: CHESTERFIELD REID · CHESTERFIELD REID J · CHESTERFIELD REID JOHN
28 granted patents·14 pending applications·106 citations·filing 2005–2023
95Inventor score
Top patents by PatentIndex Score
42 records- 0196US8343381B1Hole transport compositionDU PONT·Filed 2009·Granted Jan 1, 2013·26 cites·5 claims
- 0295US8063399B2Electroactive materialsJOHANSSON GARY A·Filed 2008·Granted Nov 22, 2011·26 cites·18 claims
- 0391US7528448B2Thin film transistor comprising novel conductor and dielectric compositionsDU PONT·Filed 2006·Granted May 5, 2009·16 cites·17 claims
- 0490US7582403B2Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefromDU PONT·Filed 2006·Granted Sep 1, 2009·8 cites·10 claims
- 0583US9159927B2Electroactive materialsDU PONT·Filed 2013·Granted Oct 13, 2015·3 cites·22 claims
- 0681US8487055B2Hole transport polymersRADU NORA SABINA·Filed 2011·Granted Jul 16, 2013·4 cites·3 claims
- 0780US8907353B2Process for forming an electroactive layerDU PONT·Filed 2013·Granted Dec 9, 2014·3 cites·9 claims
- 0875US9227205B2Pressure wave damper apparatus for continuous liquid printingDU PONT·Filed 2014·Granted Jan 5, 2016·2 cites·10 claims
- 0973US7901596B2Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefromDU PONT·Filed 2009·Granted Mar 8, 2011·5 cites·3 claims
- 1071US8440383B2Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefromBAILEY RICHARD KEVIN·Filed 2011·Granted May 14, 2013·3 cites·11 claims
- 1168US2023391986A1One component thermally conductive ambient temperature curable materialsHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 1265US12441881B2Thermal interface materialsHENKEL AG & CO KGAA·Filed 2021·Granted Oct 14, 2025·0 cites·15 claims
- 1365US2022380547A1Thermal interface materials and methods for applicationHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 1464US8062824B2Thermally imageable dielectric layers, thermal transfer donors and receiversBAILEY RICHARD KEVIN·Filed 2006·Granted Nov 22, 2011·2 cites·14 claims
- 1564US8053840B2Thin film transistor comprising novel conductor and dielectric compositionsDU PONT·Filed 2009·Granted Nov 8, 2011·1 cites·28 claims
- 1663US8778785B2Process for forming an electroactive layerCHESTERFIELD REID JOHN·Filed 2009·Granted Jul 15, 2014·1 cites·20 claims
- 1762US9574084B2Hole transport compositionDU PONT·Filed 2012·Granted Feb 21, 2017·0 cites·8 claims
- 1861US8889269B2Electroactive materialsJOHANSSON GARY A·Filed 2011·Granted Nov 18, 2014·0 cites·21 claims
- 1961US8778708B2Process for forming an electroactive layerCHESTERFIELD REID JOHN·Filed 2010·Granted Jul 15, 2014·1 cites·15 claims
- 2061US8308886B2Donor elements and processes for thermal transfer of nanoparticle layersANDREWS GERALD DONALD·Filed 2006·Granted Nov 13, 2012·3 cites·37 claims
- 2159US9209398B2Process for forming an electroactive layerCHESTERFIELD REID JOHN·Filed 2010·Granted Dec 8, 2015·1 cites·18 claims
- 2258US8158831B2Chrysene compounds for deep blue luminescent applicationsROSTOVTSEV VSEVOLOD·Filed 2008·Granted Apr 17, 2012·0 cites·12 claims
- 2357US8372525B2Organic electronic deviceDU PONT·Filed 2007·Granted Feb 12, 2013·1 cites·22 claims
- 2456US8652655B2Electroactive materialsJOHANSSON GARY A·Filed 2011·Granted Feb 18, 2014·0 cites·1 claims
- 2556US8604247B2Chrysenes for deep blue luminescent applicationsROSTOVTSEV VSEVOLOD·Filed 2011·Granted Dec 10, 2013·0 cites·12 claims
- 2655US12490412B2Three-dimensionally patternable thermal interfaceHENKEL AG & CO KGAA·Filed 2022·Granted Dec 2, 2025·0 cites·31 claims
- 2755US2024279426A1Non-silicone thermal interface materialHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 2855US2014264307A1Process for forming an electroactive layerDU PONT·Filed 2014·Application pending·0 cites
- 2955US2012235562A1Chrysenes for deep blue luminescent applicationsROSTOVTSEV VSEVOLOD·Filed 2012·Application pending·0 cites
- 3053US2008061685A1Organic electronic devicesCHESTERFIELD REID J·Filed 2007·Application pending·0 cites
- 3152US8242223B2Hole transport polymersRADU NORA SABINA·Filed 2007·Granted Aug 14, 2012·0 cites·8 claims
- 3251US8377622B2Thermally imageable dielectric layers, thermal transfer donors and receiversDU PONT·Filed 2011·Granted Feb 19, 2013·0 cites·13 claims
- 3350US2012049177A1Organic electronic devicesCHESTERFIELD REID JOHN·Filed 2011·Application pending·0 cites
- 3450US2008097076A1Hole transport polymersRADU NORA S·Filed 2007·Application pending·0 cites
- 3548US2014326752A1Dispensing vessel having a self-supporting secondary container for use in a printing apparatus for depositing a liquid composition on a backplaneDU PONT·Filed 2014·Application pending·0 cites
- 3647US2008160342A1Host compositions for luminescent materialsMENG HONG·Filed 2007·Application pending·0 cites
- 3745US2008303425A1Chrysenes for blue luminescent applicationsROSTOVTSEV VSEVOLOD·Filed 2008·Application pending·0 cites
- 3844US2008207823A1Active Compositions And MethodsDU PONT·Filed 2005·Application pending·0 cites
- 3942US9209397B2Process for forming an electroactive layerCHESTERFIELD REID JOHN·Filed 2010·Granted Dec 8, 2015·0 cites·11 claims
- 4041US9149830B2Liquid replenishment system for a printing apparatus for depositing a liquid composition on a backplane including a dispensing vessel having a self-supporting secondary containerDU PONT·Filed 2014·Granted Oct 6, 2015·0 cites·6 claims
- 4141US2013256603A1Liquid composition for deposition of organic electroactive materialsCHESTERFIELD REID JOHN·Filed 2011·Application pending·0 cites
- 4240US2021212241A1Abrasion-resistant coatings for thermal interfacesHenkel IP & Holding GmbH·Filed 2021·Application pending·0 cites
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