Inventor · disambiguated record
Hiroyuki Ishitomi
Also filed as: ISHITOMI HIROYUKI
6 granted patents·4 pending applications·42 citations·filing 2003–2013
81Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD4HIRAI SHOGO2HIGUCHI TAKAYUKI1HIMORI TSUYOSHI1PANASONIC CORP1
Top patents by PatentIndex Score
10 records- 0181US8563872B2Wiring board, wiring board manufacturing method, and via pasteHIRAI SHOGO·Filed 2011·Granted Oct 22, 2013·8 cites·17 claims
- 0271US8604350B2Multilayer wiring substrate and manufacturing method of multilayer wiring substrateHIMORI TSUYOSHI·Filed 2011·Granted Dec 10, 2013·3 cites·15 claims
- 0370US7001662B2Transfer sheet and wiring board using the same, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 21, 2006·12 cites·6 claims
- 0467US6787884B2Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module productionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 7, 2004·12 cites·38 claims
- 0563US7667977B2Mounting board, mounted body, and electronic equipment using the samePANASONIC CORP·Filed 2006·Granted Feb 23, 2010·2 cites·19 claims
- 0654US7140104B2Method of producing circuit component built-in module with embedded circuit componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 28, 2006·5 cites·4 claims
- 0749US2006078669A1Transfer sheet and wiring board using the same, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 0847US2014008104A1Resistance-formed substrate and method for manufacturing sameSUGAYA YASUHIRO·Filed 2013·Application pending·0 cites
- 0939US2013068513A1Wiring board, production method of the same, and via pasteHIRAI SHOGO·Filed 2011·Application pending·0 cites
- 1036US2013062107A1Multilayer wiring board and production method of the sameHIGUCHI TAKAYUKI·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →