Inventor · disambiguated record
Chia-Fu Wu
Also filed as: WU CHIA H · WU CHIA-FU
6 granted patents·4 pending applications·101 citations·filing 1996–2018
82Inventor score
Files withADVANCED SEMICONDUCTOR ENG4HTC CORP2ARASENS INC1BAI SHWANG S1INT UNITED TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
10 records- 0193US7719094B2Semiconductor package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted May 18, 2010·35 cites·15 claims
- 0285US7579672B2Semiconductor package with electromagnetic shielding capabilitiesADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Aug 25, 2009·17 cites·13 claims
- 0375US7999359B2Semiconductor package with electromagnetic shieldADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Aug 16, 2011·8 cites·18 claims
- 0468US5603374AHeat sink assembly for an integrated circuitMALICO INC·Filed 1996·Granted Feb 18, 1997·41 cites·6 claims
- 0545US2009065911A1Semiconductor package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 0644US9201947B2Methods and systems for media file managementHTC CORP·Filed 2013·Granted Dec 1, 2015·0 cites·43 claims
- 0741US2013141331A1Method for performing wireless display control, and associated apparatus and associated computer program productHTC CORP·Filed 2012·Application pending·0 cites
- 0839US8025377B2Ink cartridgeINT UNITED TECHNOLOGY CO LTD·Filed 2007·Granted Sep 27, 2011·0 cites·11 claims
- 0937US2020204884A1Correlation-Based Sensor Network and Control Method thereofARASENS INC·Filed 2018·Application pending·0 cites
- 1035US2006081968A1Semiconductor packageBAI SHWANG S·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →