Inventor · disambiguated record
Jon A. Casey
Also filed as: CASEY JON · CASEY JON A · CASEY JON ALFRED
79 granted patents·2 pending applications·1,459 citations·filing 1986–2021
99Inventor score
Top patents by PatentIndex Score
81 records- 0197US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0296US5870823AMethod of forming a multilayer electronic packaging substrate with integral cooling channelsIBM·Filed 1996·Granted Feb 16, 1999·229 cites·18 claims
- 0394US7015581B2Low-K dielectric material system for IC applicationIBM·Filed 2005·Granted Mar 21, 2006·22 cites·9 claims
- 0494US6262357B1Thermoelectric devices and methods for making the sameIBM·Filed 2000·Granted Jul 17, 2001·84 cites·11 claims
- 0592US8421217B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2012·Granted Apr 16, 2013·19 cites·19 claims
- 0692US8202765B2Achieving mechanical and thermal stability in a multi-chip packageCASEY JON A·Filed 2009·Granted Jun 19, 2012·28 cites·22 claims
- 0790US6121539AThermoelectric devices and methods for making the sameIBM·Filed 1998·Granted Sep 19, 2000·94 cites·30 claims
- 0890US5480503AProcess for producing circuitized layers and multilayer ceramic sub-laminates and composites thereofIBM·Filed 1993·Granted Jan 2, 1996·127 cites·11 claims
- 0987US10580738B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 1087US7452568B2Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formationIBM·Filed 2005·Granted Nov 18, 2008·15 cites·1 claims
- 1185US4885038AMethod of making multilayered ceramic structures having an internal distribution of copper-based conductorsIBM·Filed 1986·Granted Dec 5, 1989·72 cites·10 claims
- 1283US9601423B1Under die surface mounted electrical elementsIBM·Filed 2015·Granted Mar 21, 2017·4 cites·15 claims
- 1383US6278049B1Thermoelectric devices and methods for making the sameIBM·Filed 2000·Granted Aug 21, 2001·31 cites·35 claims
- 1482US5541005ALarge ceramic article and method of manufacturingIBM·Filed 1995·Granted Jul 30, 1996·64 cites·19 claims
- 1581US7875502B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2010·Granted Jan 25, 2011·5 cites·9 claims
- 1677US6878616B1Low-k dielectric material system for IC applicationIBM·Filed 2003·Granted Apr 12, 2005·16 cites·11 claims
- 1776US7917328B2Tracking thermal mini-cycle stressIBM·Filed 2008·Granted Mar 29, 2011·8 cites·20 claims
- 1875US5927193AProcess for via fillIBM·Filed 1997·Granted Jul 27, 1999·50 cites·10 claims
- 1974US9226426B2Electronic device console with natural draft coolingBODENWEBER PAUL F·Filed 2012·Granted Dec 29, 2015·2 cites·18 claims
- 2072US7288474B2Suspension for filling via holes in silicon and method for making the sameIBM·Filed 2006·Granted Oct 30, 2007·4 cites·10 claims
- 2171US11410894B2Polygon integrated circuit (IC) packagingIBM·Filed 2019·Granted Aug 9, 2022·1 cites·8 claims
- 2271US8680670B2Multi-chip module system with removable socketed modulesCASEY JON ALFRED·Filed 2010·Granted Mar 25, 2014·4 cites·16 claims
- 2370US11825592B2Electronic device console with natural draft coolingIBM·Filed 2020·Granted Nov 21, 2023·0 cites·19 claims
- 2469US11569181B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2020·Granted Jan 31, 2023·0 cites·11 claims
- 2569US5601672AMethod for making ceramic substrates from thin and thick ceramic greensheetsIBM·Filed 1994·Granted Feb 11, 1997·42 cites·10 claims
- 2668US8214658B2Enhanced thermal management for improved module reliabilityCASEY JON A·Filed 2008·Granted Jul 3, 2012·4 cites·22 claims
- 2767US8119206B2Negative coefficient of thermal expansion particlesHOUGHAM GARETH GEOFFREY·Filed 2009·Granted Feb 21, 2012·4 cites·10 claims
- 2863US7815968B2Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formationIBM·Filed 2008·Granted Oct 19, 2010·2 cites·46 claims
- 2963US7449067B2Method and apparatus for filling viasIBM·Filed 2003·Granted Nov 11, 2008·12 cites·19 claims
- 3062US7294909B2Electronic package repair processIBM·Filed 2005·Granted Nov 13, 2007·2 cites·14 claims
- 3162US7199450B2Materials and method to seal vias in silicon substratesIBM·Filed 2005·Granted Apr 3, 2007·2 cites·7 claims
- 3262US6015517AControlled porosity for ceramic contact sheets and setter tilesIBM·Filed 1998·Granted Jan 18, 2000·15 cites·20 claims
- 3362US5916374AOptimized in-line mask cleaning systemIBM·Filed 1998·Granted Jun 29, 1999·24 cites·17 claims
- 3461US12504747B2Multicomponent module design and fabricationIBM·Filed 2021·Granted Dec 23, 2025·0 cites·19 claims
- 3561US7312523B2Enhanced via structure for organic module performanceIBM·Filed 2005·Granted Dec 25, 2007·2 cites·20 claims
- 3661US6402866B1Powdered metallic sheet method for deposition of substrate conductorsIBM·Filed 1999·Granted Jun 11, 2002·25 cites·17 claims
- 3760US11177217B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2020·Granted Nov 16, 2021·0 cites·7 claims
- 3860US10892233B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2018·Granted Jan 12, 2021·0 cites·7 claims
- 3960US7732932B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2007·Granted Jun 8, 2010·1 cites·31 claims
- 4059US8786059B2Passivation layer surface topography modifications for improved integrity in packaged assembliesBLANDER ALEXANDRE·Filed 2012·Granted Jul 22, 2014·1 cites·17 claims
- 4158US5135595AProcess for fabricating a low dielectric composite substrateIBM·Filed 1990·Granted Aug 4, 1992·24 cites·9 claims
- 4257US7078259B2Method for integrating thermistorIBM·Filed 2004·Granted Jul 18, 2006·7 cites·18 claims
- 4357US6032683ASystem for cleaning residual paste from a maskIBM·Filed 1999·Granted Mar 7, 2000·19 cites·8 claims
- 4456US8236615B2Passivation layer surface topography modifications for improved integrity in packaged assembliesBLANDER ALEXANDRE·Filed 2009·Granted Aug 7, 2012·1 cites·9 claims
- 4556US6562169B2Multi-level web structure in use for thin sheet processingIBM·Filed 2001·Granted May 13, 2003·8 cites·15 claims
- 4655US10834808B2Electronic device console with natural draft coolingIBM·Filed 2015·Granted Nov 10, 2020·0 cites·18 claims
- 4755US5468445ACeramic via composition, multilayer ceramic circuit containing same, and process for using sameIBM·Filed 1994·Granted Nov 21, 1995·20 cites·6 claims
- 4854US5147741APhenyl-endcapped depolymerizable polymerIBM·Filed 1990·Granted Sep 15, 1992·12 cites·10 claims
- 4953US5139851ALow dielectric composite substrateIBM·Filed 1990·Granted Aug 18, 1992·22 cites·19 claims
- 5051US5277725AProcess for fabricating a low dielectric composite substrateIBM·Filed 1992·Granted Jan 11, 1994·17 cites·15 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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