Inventor · disambiguated record
David R. Pirkle
Also filed as: PIRKLE DAVID · PIRKLE DAVID R
13 granted patents·1 pending application·1,448 citations·filing 1991–2016
95Inventor score
Files withLAM RES CORP14
Top patents by PatentIndex Score
14 records- 0199US5234526AWindow for microwave plasma processing deviceLAM RES CORP·Filed 1991·Granted Aug 10, 1993·449 cites·37 claims
- 0298US5846373AMethod for monitoring process endpoints in a plasma chamber and a process monitoring arrangement in a plasma chamberLAM RES CORP·Filed 1996·Granted Dec 8, 1998·221 cites·18 claims
- 0397US5647953APlasma cleaning method for removing residues in a plasma process chamberLAM RES CORP·Filed 1995·Granted Jul 15, 1997·189 cites·23 claims
- 0496US5915190AMethods for filling trenches in a semiconductor waferLAM RES CORP·Filed 1997·Granted Jun 22, 1999·324 cites·18 claims
- 0593US7334477B1Apparatus and methods for the detection of an arc in a plasma processing systemLAM RES CORP·Filed 2004·Granted Feb 26, 2008·50 cites·26 claims
- 0690US7722778B2Methods and apparatus for sensing unconfinement in a plasma processing chamberLAM RES CORP·Filed 2006·Granted May 25, 2010·18 cites·22 claims
- 0789US6670278B2Method of plasma etching of silicon carbideLAM RES CORP·Filed 2001·Granted Dec 30, 2003·54 cites·22 claims
- 0886US6016766AMicrowave plasma processorLAM RES CORP·Filed 1997·Granted Jan 25, 2000·54 cites·16 claims
- 0985US6962879B2Method of plasma etching silicon nitrideLAM RES CORP·Filed 2001·Granted Nov 8, 2005·43 cites·30 claims
- 1075US6909195B2Trench etch process for low-k dielectricsLAM RES CORP·Filed 2004·Granted Jun 21, 2005·16 cites·5 claims
- 1172US6794293B2Trench etch process for low-k dielectricsLAM RES CORP·Filed 2001·Granted Sep 21, 2004·14 cites·19 claims
- 1249US7534363B2Method for providing uniform removal of organic materialLAM RES CORP·Filed 2004·Granted May 19, 2009·3 cites·13 claims
- 1346US5841623AChuck for substrate processing and method for depositing a film in a radio frequency biased plasma chemical depositing systemLAM RES CORP·Filed 1995·Granted Nov 24, 1998·13 cites·14 claims
- 1436US2016293502A1Method and apparatus for detecting defects on wafersLAM RES CORP·Filed 2016·Application pending·0 cites
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