Inventor · disambiguated record
Rao Annapragada
Also filed as: ANNAPRAGADA RAO · ANNAPRAGADA RAO V · ANNAPRAGADA RAO VENKATESWARA
31 granted patents·8 pending applications·640 citations·filing 1998–2015
97Inventor score
Files withLAM RES CORP12VLSI TECHNOLOGY INC6KONINKL PHILIPS ELECTRONICS NV5PHILIPS ELECTRONICS NA4CHENG CHIA-CHENG2
Top patents by PatentIndex Score
39 records- 0196US6413877B1Method of preventing damage to organo-silicate-glass materials during resist strippingLAM RES CORP·Filed 2000·Granted Jul 2, 2002·132 cites·18 claims
- 0288US6630407B2Plasma etching of organic antireflective coatingLAM RES CORP·Filed 2001·Granted Oct 7, 2003·58 cites·20 claims
- 0387US6465365B1Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabricationKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Oct 15, 2002·31 cites·9 claims
- 0487US6001747AProcess to improve adhesion of cap layers in integrated circuitsVLSI TECHNOLOGY INC·Filed 1998·Granted Dec 14, 1999·73 cites·23 claims
- 0580US9660177B2Method to minimize MTJ sidewall damage and bottom electrode redeposition using IBE trimmingHEADWAY TECH INC·Filed 2015·Granted May 23, 2017·3 cites·14 claims
- 0679US6777344B2Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applicationsLAM RES CORP·Filed 2001·Granted Aug 17, 2004·25 cites·13 claims
- 0779US6518174B2Combined resist strip and barrier etch process for dual damascene structuresLAM RES CORP·Filed 2000·Granted Feb 11, 2003·23 cites·12 claims
- 0878US7129171B2Selective oxygen-free etching process for barrier materialsLAM RES CORP·Filed 2003·Granted Oct 31, 2006·21 cites·15 claims
- 0977US7323116B2Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltageLAM RES CORP·Filed 2004·Granted Jan 29, 2008·29 cites·32 claims
- 1077US6303525B1Method and structure for adhering MSQ material to liner oxidePHILIPS ELECTRONICS NO AMERICA·Filed 2000·Granted Oct 16, 2001·20 cites·15 claims
- 1174US6380092B1Gas phase planarization process for semiconductor wafersVLSI TECHNOLOGY INC·Filed 2000·Granted Apr 30, 2002·13 cites·20 claims
- 1272US8801947B2Methods for forming microlensesMATTSON TECH INC·Filed 2013·Granted Aug 12, 2014·4 cites·20 claims
- 1372US6048494AAutoclave with improved heating and accessVLSI TECHNOLOGY INC·Filed 1998·Granted Apr 11, 2000·34 cites·5 claims
- 1471US7081407B2Method of preventing damage to porous low-k materials during resist strippingLAM RES CORP·Filed 2003·Granted Jul 25, 2006·11 cites·16 claims
- 1567US6303192B1Process to improve adhesion of PECVD cap layers in integrated circuitsPHILIPS SEMICONDUCTOR INC·Filed 1998·Granted Oct 16, 2001·33 cites·20 claims
- 1665US6828250B1Process for etching vias in organosilicate glass materials without causing RIE lagLAM RES CORP·Filed 2000·Granted Dec 7, 2004·10 cites·12 claims
- 1763US6267076B1Gas phase planarization process for semiconductor wafersVLSI TECHNOLOGY INC·Filed 2000·Granted Jul 31, 2001·6 cites·32 claims
- 1859US6916697B2Etch back process using nitrous oxideLAM RES CORP·Filed 2003·Granted Jul 12, 2005·6 cites·19 claims
- 1959US6543459B1Method of determining an end point for a remote microwave plasma cleaning systemKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Apr 8, 2003·15 cites·9 claims
- 2059US6387797B1Method for reducing the capacitance between interconnects by forming voids in dielectric materialPHILIPS ELECTRONICS NO AMERICA·Filed 1999·Granted May 14, 2002·24 cites·20 claims
- 2154US6418875B1Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabricationKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Jul 16, 2002·3 cites·7 claims
- 2254US6057245AGas phase planarization process for semiconductor wafersVLSI TECHNOLOGY INC·Filed 1999·Granted May 2, 2000·14 cites·15 claims
- 2353US6140221AMethod for forming vias through porous dielectric material and devices formed therebyPHILIPS ELECTRONICS NA·Filed 1998·Granted Oct 31, 2000·17 cites·15 claims
- 2453US6028013AMoisture repellant integrated circuit dielectric material combinationVLSI TECHNOLOGY INC·Filed 1999·Granted Feb 22, 2000·17 cites·14 claims
- 2550US7202177B2Nitrous oxide stripping process for organosilicate glassLAM RES CORP·Filed 2003·Granted Apr 10, 2007·2 cites·22 claims
- 2650US2006240661A1Method of preventing damage to porous low-K materials during resist strippingANNAPRAGADA RAO·Filed 2006·Application pending·0 cites
- 2749US7534363B2Method for providing uniform removal of organic materialLAM RES CORP·Filed 2004·Granted May 19, 2009·3 cites·13 claims
- 2845US6700200B1Reliable via structures having hydrophobic inner wall surfacesKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Mar 2, 2004·1 cites·17 claims
- 2943US2004211517A1Method of etching with NH3 and fluorine chemistriesFiled 2004·Application pending·0 cites
- 3042US6876063B1Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabricationKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Apr 5, 2005·0 cites·7 claims
- 3140US6165905AMethods for making reliable via structures having hydrophobic inner wall surfacesPHILIPS ELECTRONICS NA·Filed 1999·Granted Dec 26, 2000·7 cites·16 claims
- 3240US2001023989A1Semiconductor dielectric structure and method for making the samePHILIPS ELECTRONICS NA·Filed 2001·Application pending·0 cites
- 3339US2005101135A1Minimizing the loss of barrier materials during photoresist strippingLAM RES CORP·Filed 2003·Application pending·0 cites
- 3439US2002121500A1Method of etching with NH3 and fluorine chemistriesFiled 2000·Application pending·0 cites
- 3536US2001009812A1Process to improve adhesion of cap layers in integrated circuitsFiled 2001·Application pending·0 cites
- 3634US6218735B1Process to improve adhesion of cap layers in intergrated circuitsPHILIPS SEMICONDUCTOR INC·Filed 1999·Granted Apr 17, 2001·3 cites·26 claims
- 3733US2006065632A1Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequencyCHENG CHIA-CHENG·Filed 2004·Application pending·0 cites
- 3833US2006065631A1Methods and apparatus for monitoring a process in a plasma processing system by measuring impedanceCHENG CHIA-CHENG·Filed 2004·Application pending·0 cites
- 3932US6255210B1Semiconductor dielectric structure and method for making the samePHILIPS ELECTRONICS NA·Filed 1999·Granted Jul 3, 2001·2 cites·18 claims
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