Inventor · disambiguated record
Shur-Fen Liu
Also filed as: LIU SHUR-FEN
50 granted patents·12 pending applications·199 citations·filing 1999–2024
97Inventor score
Files withTAIWAN UNION TECHNOLOGY CORP26IND TECH RES INST15LIU SHUR-FEN3TAIWAN UNION TECH CORP3Chang li-ming2
Top patents by PatentIndex Score
62 records- 0192US8304666B2Structure of multiple coaxial leads within single via in substrate and manufacturing method thereofKO CHENG-TA·Filed 2009·Granted Nov 6, 2012·41 cites·21 claims
- 0291US10196502B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2016·Granted Feb 5, 2019·4 cites·16 claims
- 0391US8035951B2Capacitor devicesIND TECH RES INST·Filed 2010·Granted Oct 11, 2011·13 cites·2 claims
- 0490US7561410B1Hybrid capacitorIND TECH RES INST·Filed 2008·Granted Jul 14, 2009·21 cites·28 claims
- 0584US6359039B1Mixing barbituric acid-modified BMI with MEK solution of epoxy resin and elastomerIND TECH RES INST·Filed 2000·Granted Mar 19, 2002·21 cites·8 claims
- 0683US10575401B1Dielectric composite and uses thereofTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted Feb 25, 2020·1 cites·18 claims
- 0783US7804678B2Capacitor devicesIND TECH RES INST·Filed 2007·Granted Sep 28, 2010·9 cites·14 claims
- 0882US10689512B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Jun 23, 2020·1 cites·21 claims
- 0982US7102876B2Structure of an interleaving striped capacitor substrateIND TECH RES INST·Filed 2005·Granted Sep 5, 2006·10 cites·18 claims
- 1081US11529797B2Method of manufacturing metal-clad laminate and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Dec 20, 2022·1 cites·16 claims
- 1178US10662352B2Adhesive composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 26, 2020·1 cites·20 claims
- 1277US12485651B2Metal-clad laminateTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Granted Dec 2, 2025·0 cites·10 claims
- 1377US8420745B2Thermally curable solder resist compositionJENG JHY-LONG·Filed 2011·Granted Apr 16, 2013·3 cites·13 claims
- 1476US9657154B2Resin composition and uses of the sameTAIWAN UNION TECH CORP·Filed 2014·Granted May 23, 2017·2 cites·12 claims
- 1576US8488299B2Capacitor structureWU SHIH-HSIEN·Filed 2010·Granted Jul 16, 2013·4 cites·13 claims
- 1676US8289679B2Decoupling deviceCHENG CHENG-LIANG·Filed 2010·Granted Oct 16, 2012·3 cites·38 claims
- 1776US8101038B2Double-sided metal clad laminate and fabrication method thereofLU CHARNG-SHING·Filed 2009·Granted Jan 24, 2012·4 cites·15 claims
- 1874US11818838B2Metal-clad laminate and manufacturing method of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Nov 14, 2023·2 cites·8 claims
- 1974US10774216B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Sep 15, 2020·0 cites·15 claims
- 2073US6432613B1Photosensitive compositionIND TECH RES INST·Filed 2001·Granted Aug 13, 2002·12 cites·43 claims
- 2172US11345813B2Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted May 31, 2022·0 cites·14 claims
- 2272US8390984B2Capacitor substrate structureLIU SHUR-FEN·Filed 2009·Granted Mar 5, 2013·8 cites·15 claims
- 2370US11802198B2Fluororesin composition, and resin sheet, laminate and printed circuit boardTAIWAN UNION TECHNOLOGY CORP·Filed 2020·Granted Oct 31, 2023·0 cites·18 claims
- 2470US6780943B2Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resinIND TECH RES INST·Filed 2002·Granted Aug 24, 2004·7 cites·9 claims
- 2568US8138263B2Flexible, low dielectric loss composition and method for preparing the sameLIU SHUR-FEN·Filed 2008·Granted Mar 20, 2012·2 cites·27 claims
- 2668US2025163269A1Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2767US11124613B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Sep 21, 2021·0 cites·19 claims
- 2867US10513607B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2016·Granted Dec 24, 2019·0 cites·12 claims
- 2964US11124614B2Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted Sep 21, 2021·0 cites·17 claims
- 3063US2024084135A1Resin composition, and prepreg, metal-clad laminate and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3163US2024084063A1Solvent-free resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3262US10322565B2Resin composition and uses of the sameTAIWAN UNION TECH COMPANY·Filed 2018·Granted Jun 18, 2019·0 cites·14 claims
- 3361US10836919B2Solvent-free resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Nov 17, 2020·0 cites·14 claims
- 3461US7750092B2Nonaqueous electrolyte having maleimide additives and secondary cells employing the sameIND TECH RES INST·Filed 2007·Granted Jul 6, 2010·0 cites·13 claims
- 3559US2023143461A1Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 3658US10059841B2Resin Composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2015·Granted Aug 28, 2018·0 cites·12 claims
- 3756US9708484B2Resin composition and uses of the sameTAIWAN UNION TECH CORP·Filed 2014·Granted Jul 18, 2017·0 cites·14 claims
- 3855US11015052B2Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted May 25, 2021·0 cites·16 claims
- 3955US9051429B2Polyamic acid resin composition and method for forming polyimide resinChang li-ming·Filed 2009·Granted Jun 9, 2015·0 cites·7 claims
- 4054US8652622B2Polyimide film laminate and metal laminate employing the sameLU CHARNG-SHING·Filed 2011·Granted Feb 18, 2014·1 cites·18 claims
- 4154US8227894B2Stepwise capacitor structure and substrate employing the sameLEE MIN-LIN·Filed 2009·Granted Jul 24, 2012·2 cites·41 claims
- 4253US11667743B2Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2020·Granted Jun 6, 2023·0 cites·14 claims
- 4353US7271206B2Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereofIND TECH RES INST·Filed 2004·Granted Sep 18, 2007·4 cites·25 claims
- 4453US2009236132A1Organic/inorganic hybrid composition with electrostatic discharge protection propertyIND TECH RES INST·Filed 2008·Application pending·0 cites
- 4552US10793716B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2013·Granted Oct 6, 2020·0 cites·10 claims
- 4652US7008981B2Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereofIND TECHNOLOGY RESERARCH INST·Filed 2003·Granted Mar 7, 2006·7 cites·18 claims
- 4751US11840047B2Metal-clad laminate, printed circuit board, and method for manufacturing the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2020·Granted Dec 12, 2023·0 cites·9 claims
- 4851US11312829B2Flexible prepreg and uses thereofTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Apr 26, 2022·0 cites·14 claims
- 4950US10246588B1Solvent-free resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Apr 2, 2019·0 cites·20 claims
- 5050US9902136B2Resin composition and uses of the sameLIU SHUR FEN·Filed 2012·Granted Feb 27, 2018·0 cites·11 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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