Inventor · disambiguated record
Kazutaka Mori
Also filed as: MORI KAZUTAKA
49 granted patents·16 pending applications·500 citations·filing 1986–2020
98Inventor score
Files withHITACHI LTD22MITSUBISHI HEAVY IND LTD18RENESAS TECH CORP10MITSUBISHI HITACHI POWER SYS4AISIN SEIKI2
Top patents by PatentIndex Score
65 records- 0193US6656644B2Manufacturing method of photomask and photomaskHITACHI LTD·Filed 2001·Granted Dec 2, 2003·64 cites·23 claims
- 0284US10584223B2Optical member, optical semiconductor device, and illumination apparatusDOW CORNING TORAY CO LTD·Filed 2015·Granted Mar 10, 2020·2 cites·17 claims
- 0383US9573542B2Bumper reinforcementAISIN SEIKI·Filed 2015·Granted Feb 21, 2017·6 cites·4 claims
- 0477US6194915B1Semiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 1996·Granted Feb 27, 2001·31 cites·13 claims
- 0576US5362998AComposite circuit of bipolar transistors and MOS transistors and semiconductor integrated circuit device using the sameHITACHI LTD·Filed 1994·Granted Nov 8, 1994·28 cites·42 claims
- 0672US6916551B2Thermal barrier coating material, gas turbine parts and gas turbineMITSUBISHI HEAVY IND LTD·Filed 2002·Granted Jul 12, 2005·10 cites·21 claims
- 0771US7522083B2Semiconductor device having D/A conversion portionHITACHI LTD·Filed 2007·Granted Apr 21, 2009·7 cites·6 claims
- 0871US6596656B2Manufacturing use of photomasks with an opaque pattern comprising an organic layer photoabsorptive to exposure light with wavelengths exceeding 200 NMHITACHI LTD·Filed 2001·Granted Jul 22, 2003·11 cites·27 claims
- 0970US7859100B2Thermal barrier coating material, thermal barrier member, and member coated with thermal barrier and method for manufacturing the sameMITSUBISHI HEAVY IND LTD·Filed 2005·Granted Dec 28, 2010·12 cites·6 claims
- 1069US8586169B2Thermal barrier coating member, method for producing the same, thermal barrier coating material, gas turbine, and sintered bodyNAMBA KATSUMI·Filed 2006·Granted Nov 19, 2013·10 cites·8 claims
- 1169US7354663B2Thermal barrier coating, manufacturing method thereof, turbine part and gas turbineMITSUBISHI HEAVY IND LTD·Filed 2004·Granted Apr 8, 2008·22 cites·14 claims
- 1269US6029220APipelined semiconductor devices suitable for ultra large scale integrationHITACHI LTD·Filed 1992·Granted Feb 22, 2000·43 cites·20 claims
- 1368US6392277B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted May 21, 2002·23 cites·25 claims
- 1468US5408676AParallel data processing system with plural-system bus configuration capable of fast data communication between processors by using common busesHITACHI LTD·Filed 1992·Granted Apr 18, 1995·49 cites·9 claims
- 1567US6636075B2Semiconductor integrated circuit and its fabrication methodHITACHI LTD·Filed 2002·Granted Oct 21, 2003·10 cites·18 claims
- 1666US2010062173A1Thermal barrier coating material and method for production thereof, gas turbine member using the thermal barrier coating material, and gas turbineMITSUBISHI HEAVY IND LTD·Filed 2009·Application pending·0 cites
- 1765US6937068B2Semiconductor integrated circuitHITACHI LTD·Filed 2003·Granted Aug 30, 2005·8 cites·16 claims
- 1864US8021718B2Heat treatment methodMITSUBISHI HEAVY IND LTD·Filed 2007·Granted Sep 20, 2011·1 cites·8 claims
- 1963US9822437B2Process for producing thermal barrier coatingTORIGOE TAIJI·Filed 2010·Granted Nov 21, 2017·2 cites·2 claims
- 2062US10166598B2Precision-casting core, precision-casting core manufacturing method, and precision-casting moldMITSUBISHI HEAVY IND LTD·Filed 2014·Granted Jan 1, 2019·0 cites·3 claims
- 2161US7109076B2Method of manufacturing semiconductor integrated circuit device, and semiconductor integrated circuit device made by its methodRENESAS TECH CORP·Filed 2004·Granted Sep 19, 2006·9 cites·7 claims
- 2261US6846598B2Manufacturing method of photomask and photomaskHITACHI LTD·Filed 2003·Granted Jan 25, 2005·6 cites·1 claims
- 2361US5657264ASemiconductor memoryHITACHI LTD·Filed 1993·Granted Aug 12, 1997·18 cites·1 claims
- 2461US5285414ASemiconductor memory having transistors which drive data lines in accordance with values of write data and column select signalHITACHI LTD·Filed 1991·Granted Feb 8, 1994·18 cites·13 claims
- 2559US9884598B2Bumper device for a vehicleAISIN SEIKI·Filed 2015·Granted Feb 6, 2018·1 cites·14 claims
- 2659US6958292B2Method of manufacturing integrated circuitRENESAS TECH CORP·Filed 2003·Granted Oct 25, 2005·4 cites·8 claims
- 2759US6467004B1Pipelined semiconductor devices suitable for ultra large scale integrationHITACHI LTD·Filed 2000·Granted Oct 15, 2002·5 cites·12 claims
- 2858US10259034B2Slurry for forming mold, mold and method for producing moldMITSUBISHI HEAVY IND LTD·Filed 2015·Granted Apr 16, 2019·0 cites·9 claims
- 2958US6670201B2Manufacturing method of semiconductor deviceHITACHI LTD·Filed 2001·Granted Dec 30, 2003·6 cites·17 claims
- 3056US6794207B2Method of manufacturing integrated circuitRENESAS TECH CORP·Filed 2003·Granted Sep 21, 2004·3 cites·10 claims
- 3155US7361530B2Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking lightRENESAS TECH CORP·Filed 2007·Granted Apr 22, 2008·3 cites·11 claims
- 3255US6902868B2Method of manufacturing integrated circuitRENESAS TECH CORP·Filed 2001·Granted Jun 7, 2005·3 cites·15 claims
- 3355US6727152B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 27, 2004·5 cites·16 claims
- 3454US5038056AOutput circuitHITACHI LTD·Filed 1990·Granted Aug 6, 1991·12 cites·23 claims
- 3554US2008131608A1Thermal barrier coating material, thermal barrier member, and member coated with thermal barrier and method for manufacturing the sameMITSUBISHI HEAVY IND LTD·Filed 2007·Application pending·0 cites
- 3653US7655326B2Thermal barrier coating material and method for production thereof, gas turbine member using the thermal barrier coating material, and gas turbineMITSUBISHI HEAVY IND LTD·Filed 2002·Granted Feb 2, 2010·11 cites·15 claims
- 3752US6936406B2Method of manufacturing integrated circuitRENESAS TECH CORP·Filed 2003·Granted Aug 30, 2005·2 cites·4 claims
- 3852US2016121390A1Precision-casting core, precision-casting core manufacturing method, and precision-casting moldMITSUBISHI HEAVY IND LTD·Filed 2014·Application pending·0 cites
- 3952US2016114384A1Precision-casting core, precision-casting core manufacturing method, and precision-casting moldMITSUBISHI HEAVY IND LTD·Filed 2014·Application pending·0 cites
- 4051US8370084B2Method for estimating physical property of ceramic, method for estimating physical property of thermal barrier coating, method for estimating remaining lifetime of thermal barrier coating, method for estimating remaining lifetime of high-temperature member, and physical property acquiring apparatusMITSUBISHI HEAVY IND LTD·Filed 2009·Granted Feb 5, 2013·0 cites·14 claims
- 4151US2011262770A1Thermal barrier coating material, thermal barrier coating, turbine member, and gas turbineMITSUBISHI HEAVY IND LTD·Filed 2009·Application pending·0 cites
- 4249US10245636B2Method for manufacturing core, and method for manufacturing turbine member in which core is acquired by said core manufacturing methodMITSUBISHI HEAVY IND LTD·Filed 2015·Granted Apr 2, 2019·0 cites·11 claims
- 4349US7205222B2Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking lightRENESAS TECH CORP·Filed 2004·Granted Apr 17, 2007·1 cites·15 claims
- 4449US2015266085A1Precision casting mold and method of producing the sameMITSUBISHI HITACHI POWER SYS·Filed 2013·Application pending·0 cites
- 4549US2015217366A1Precision casting mold and method of producing the sameMITSUBISHI HITACHI POWER SYS·Filed 2013·Application pending·0 cites
- 4649US2015224569A1Precision casting mold and method of producing the sameMITSUBISHI HITACHI POWER SYS·Filed 2013·Application pending·0 cites
- 4749US2010242797A1Thermal barrier coating materialMITSUBISHI HEAVY IND LTD·Filed 2009·Application pending·0 cites
- 4849US2015273571A1Precision casting mold and method of producing the sameMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 4949US2015283601A1Precision casting mold and method of producing the sameMITSUBISHI HITACHI POWER SYS·Filed 2013·Application pending·0 cites
- 5048US4692354AMethod for preparing ceramic membrane for separation of condensed componentASAEDA MASASHI·Filed 1986·Granted Sep 8, 1987·17 cites·6 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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