Inventor · disambiguated record
David W. Wang
Also filed as: WANG DAVID · WANG DAVID W · WANG DAVID WEI · WANG DAVID WEI-GWO
65 granted patents·15 pending applications·2,396 citations·filing 1983–2013
99Inventor score
Files withIBM25FIBERA INC13CHIPMOS TECHNOLOGIES INC9SCHLUMBERGER TECHNOLOGY CORP8AMERICAN CYANAMID CO7
Top patents by PatentIndex Score
80 records- 0198US4705820ASurgical suture coatingAMERICAN CYANAMID CO·Filed 1986·Granted Nov 10, 1987·127 cites·11 claims
- 0297US6748138B2Optical grating fabricationFIBERA INC·Filed 2001·Granted Jun 8, 2004·140 cites·24 claims
- 0397US5126192AFlame retardant, low dielectric constant microsphere filled laminateIBM·Filed 1990·Granted Jun 30, 1992·151 cites·13 claims
- 0495US4781183ASurgical prosthesisAMERICAN CYANAMID CO·Filed 1986·Granted Nov 1, 1988·274 cites·14 claims
- 0593US4745215AFluorine containing dicyanate resinsIBM·Filed 1987·Granted May 17, 1988·74 cites·5 claims
- 0692US7493959B2Joining tubular membersSCHLUMBERGER TECHNOLOGY CORP·Filed 2006·Granted Feb 24, 2009·49 cites·12 claims
- 0792US5194930ADielectric composition and solder interconnection structure for its useIBM·Filed 1991·Granted Mar 16, 1993·143 cites·8 claims
- 0891US8220533B2Downhole piezoelectric devicesLONGFIELD COLIN·Filed 2009·Granted Jul 17, 2012·21 cites·7 claims
- 0991US7973310B2Semiconductor package structure and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Jul 5, 2011·37 cites·44 claims
- 1091US7363974B2Gravel packing a wellSCHLUMBERGER TECHNOLOGY CORP·Filed 2006·Granted Apr 29, 2008·39 cites·19 claims
- 1191US5250848ASolder interconnection structureIBM·Filed 1991·Granted Oct 5, 1993·61 cites·24 claims
- 1291US5089440ASolder interconnection structure and process for makingIBM·Filed 1990·Granted Feb 18, 1992·62 cites·20 claims
- 1391US4999699ASolder interconnection structure and process for makingIBM·Filed 1990·Granted Mar 12, 1991·137 cites·21 claims
- 1489US5055342AFluorinated polymeric composition, fabrication thereof and use thereofIBM·Filed 1990·Granted Oct 8, 1991·69 cites·28 claims
- 1588US8269352B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·10 cites·13 claims
- 1688US5656862ASolder interconnection structureIBM·Filed 1993·Granted Aug 12, 1997·86 cites·45 claims
- 1787US8469109B2Deformable dart and methodWANG DAVID WEI·Filed 2010·Granted Jun 25, 2013·12 cites·20 claims
- 1887US5103293AElectronic circuit packages with tear resistant organic coresIBM·Filed 1990·Granted Apr 7, 1992·108 cites·17 claims
- 1985US7798212B2System and method for forming downhole connectionsSCHLUMBERGER TECHNOLOGY CORP·Filed 2006·Granted Sep 21, 2010·31 cites·21 claims
- 2085US5668059ASolder interconnection structure and process for makingIBM·Filed 1996·Granted Sep 16, 1997·72 cites·24 claims
- 2182US7139295B2Tunable wavelength locker, tunable wavelength spectrum monitor, and relative wavelength measurement systemFIBERA INC·Filed 2004·Granted Nov 21, 2006·18 cites·11 claims
- 2282US6790473B2Lead protective coating composition, process and structure thereofIBM·Filed 2001·Granted Sep 14, 2004·38 cites·21 claims
- 2382US6745843B2Base-pipe flow control mechanismSCHLUMBERGER TECHNOLOGY CORP·Filed 2002·Granted Jun 8, 2004·57 cites·33 claims
- 2481US4636535ACurable epoxy resin compositionsAMERICAN CYANAMID CO·Filed 1985·Granted Jan 13, 1987·32 cites·36 claims
- 2577US8752635B2Downhole wet mate connectionWANG DAVID WEI·Filed 2006·Granted Jun 17, 2014·17 cites·9 claims
- 2675US6904200B2Multidimensional optical gratingsFIBERA INC·Filed 2001·Granted Jun 7, 2005·21 cites·22 claims
- 2774US6129955AEncapsulating a solder joint with a photo cured epoxy resin or cyanateIBM·Filed 1997·Granted Oct 10, 2000·48 cites·9 claims
- 2874US5288542AComposite for providing a rigid-flexible circuit board construction and method for fabrication thereofIBM·Filed 1992·Granted Feb 22, 1994·33 cites·25 claims
- 2972US7147054B2Gravel packing a wellSCHLUMBERGER TECHNOLOGY CORP·Filed 2003·Granted Dec 12, 2006·34 cites·40 claims
- 3072US6972665B2Haptic reconfigurable dashboard systemHANDSHAKE VR INC·Filed 2002·Granted Dec 6, 2005·28 cites·41 claims
- 3172US5607744ACoated filler and use thereofIBM·Filed 1994·Granted Mar 4, 1997·22 cites·12 claims
- 3271US7243715B2Mesh screen apparatus and method of manufactureSCHLUMBERGER TECHNOLOGY CORP·Filed 2003·Granted Jul 17, 2007·35 cites·14 claims
- 3370US6804060B1Interference filter fabricationFIBERA INC·Filed 2001·Granted Oct 12, 2004·12 cites·19 claims
- 3469US5605781APhotosensitive composition with cyanate esters and use thereofIBM·Filed 1995·Granted Feb 25, 1997·18 cites·15 claims
- 3568US8269351B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·2 cites·11 claims
- 3668US8264068B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 11, 2012·2 cites·9 claims
- 3768US7981725B2Fabricating process of a chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2010·Granted Jul 19, 2011·2 cites·23 claims
- 3868US5061779ALiquid epoxy polymer composition and use thereof based on cycloaliphatic amine cured difunctional/polyfunctional resin blendsIBM·Filed 1989·Granted Oct 29, 1991·15 cites·21 claims
- 3968US5032638ABioabsorbable coating for a surgical deviceAMERICAN CYANAMID CO·Filed 1986·Granted Jul 16, 1991·65 cites·2 claims
- 4067US7749806B2Fabricating process of a chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Jul 6, 2010·3 cites·13 claims
- 4164US6731659B1Frequency lockerFIBERA INC·Filed 2002·Granted May 4, 2004·6 cites·30 claims
- 4262US7960214B2Chip packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Jun 14, 2011·2 cites·18 claims
- 4362US7638880B2Chip packageCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted Dec 29, 2009·2 cites·17 claims
- 4462US5102970ALiquid epoxy polymer composition based on cycloaliphatic amine cured difunctional/polyfunctional epoxy blendsIBM·Filed 1991·Granted Apr 7, 1992·22 cites·22 claims
- 4561US7027136B2Structure analysis and defect detection systemFIBERA INC·Filed 2003·Granted Apr 11, 2006·9 cites·32 claims
- 4660US5378306AComposite for providing a rigid-flexible circuit board construction and method for fabrication thereofIBM·Filed 1994·Granted Jan 3, 1995·17 cites·13 claims
- 4756US7116846B2Athermal fiber Bragg gratingFIBERA INC·Filed 2005·Granted Oct 3, 2006·2 cites·20 claims
- 4855US6807339B1Wavelength division multiplexing and de-multiplexing systemFIBERA INC·Filed 2001·Granted Oct 19, 2004·4 cites·60 claims
- 4955US5665526AThermally stable photoimaging compositionIBM·Filed 1995·Granted Sep 9, 1997·13 cites·16 claims
- 5054US5136011ATriazine networks with homogeneous and oriented structures and method for making sameCORNELL RES FOUNDATION INC·Filed 1990·Granted Aug 4, 1992·8 cites·15 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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