Inventor · disambiguated record
Stephen L. Tisdale
Also filed as: TISDALE STEPHEN · TISDALE STEPHEN L · TISDALE STEPHEN LEO
30 granted patents·942 citations·filing 1984–2001
98Inventor score
Top patents by PatentIndex Score
30 records- 0196US6323436B1High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layerIBM·Filed 1997·Granted Nov 27, 2001·156 cites·12 claims
- 0295US5374454AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1993·Granted Dec 20, 1994·71 cites·39 claims
- 0394US6268016B1Manufacturing computer systems with fine line circuitized substratesIBM·Filed 1996·Granted Jul 31, 2001·89 cites·21 claims
- 0485US5443865AMethod for conditioning a substrate for subsequent electroless metal depositionIBM·Filed 1992·Granted Aug 22, 1995·56 cites·33 claims
- 0584US4554182AMethod for conditioning a surface of a dielectric substrate for electroless platingIBM·Filed 1985·Granted Nov 19, 1985·50 cites·46 claims
- 0682US5730890AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1996·Granted Mar 24, 1998·35 cites·29 claims
- 0782US5591285AFluorinated carbon polymer compositesIBM·Filed 1995·Granted Jan 7, 1997·38 cites·12 claims
- 0881US5397863AFluorinated carbon polymer compositesIBM·Filed 1992·Granted Mar 14, 1995·35 cites·17 claims
- 0979US5318803AConditioning of a substrate for electroless plating thereonIBM·Filed 1990·Granted Jun 7, 1994·48 cites·28 claims
- 1076US5556899AFluorinated carbon polymer compositesIBM·Filed 1994·Granted Sep 17, 1996·28 cites·8 claims
- 1175US5242713AMethod for conditioning an organic polymeric materialIBM·Filed 1988·Granted Sep 7, 1993·28 cites·35 claims
- 1272US5800858AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1996·Granted Sep 1, 1998·20 cites·7 claims
- 1371US5863332AFluid jet impregnating and coating device with thickness control capabilityIBM·Filed 1996·Granted Jan 26, 1999·26 cites·3 claims
- 1470US6436803B2Manufacturing computer systems with fine line circuitized substratesIBM·Filed 2001·Granted Aug 20, 2002·11 cites·33 claims
- 1569US5725668AExpandable fluid treatment device for tublar surface treatmentsIBM·Filed 1996·Granted Mar 10, 1998·22 cites·19 claims
- 1668US5571852AFluorinated carbon polymer compositesIBM·Filed 1995·Granted Nov 5, 1996·20 cites·14 claims
- 1767US5863447AMethod for providing a selective reference layer isolation technique for the production of printed circuit boardsIBM·Filed 1997·Granted Jan 26, 1999·28 cites·6 claims
- 1866US5203955AMethod for etching an organic polymeric materialIBM·Filed 1991·Granted Apr 20, 1993·28 cites·18 claims
- 1965US5824157AFluid jet impregnationIBM·Filed 1995·Granted Oct 20, 1998·21 cites·18 claims
- 2062US5158645AMethod of external circuitization of a circuit panelIBM·Filed 1991·Granted Oct 27, 1992·28 cites·38 claims
- 2159US4904506ACopper deposition from electroless plating bathIBM·Filed 1987·Granted Feb 27, 1990·19 cites·23 claims
- 2258US5709906AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1995·Granted Jan 20, 1998·12 cites·33 claims
- 2353US6510392B2In-situ test for embedded passivesHONEYWELL ADVANCED CIRCUITS IN·Filed 2000·Granted Jan 21, 2003·6 cites·14 claims
- 2452US5462628AMethod for bonding two surfaces togetherIBM·Filed 1994·Granted Oct 31, 1995·12 cites·18 claims
- 2550US6923882B2Compliant pre-form interconnectHONEYWELL INT INC·Filed 2001·Granted Aug 2, 2005·5 cites·10 claims
- 2650US5919596AToughened photosensitive polycyanurate resist, and structure made therefrom and process of makingIBM·Filed 1997·Granted Jul 6, 1999·12 cites·5 claims
- 2750US5874154AStructure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive patternIBM·Filed 1996·Granted Feb 23, 1999·9 cites·7 claims
- 2847US5135779AMethod for conditioning an organic polymeric materialIBM·Filed 1991·Granted Aug 4, 1992·11 cites·18 claims
- 2944US6207351B1Method for pattern seeding and plating of high density printed circuit boardsIBM·Filed 1995·Granted Mar 27, 2001·11 cites·5 claims
- 3042US4534797AMethod for providing an electroless copper plating bath in the take modeIBM·Filed 1984·Granted Aug 13, 1985·7 cites·18 claims
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