Inventor · disambiguated record
Kei Koiwai
Also filed as: KOIWAI KEI
2 granted patents·5 citations·filing 2019–2021
48Inventor score
Technology areasB29C
Files withSUBARU CORP2
Top patents by PatentIndex Score
2 records- 0189US11679570B2Prepreg lamination apparatus, method of laminating prepregs and method of molding composite materialSUBARU CORP·Filed 2021·Granted Jun 20, 2023·2 cites·23 claims
- 0282US11548241B2Fiber width adjustment device, fiber width adjustment method and composite material molding methodSUBARU CORP·Filed 2019·Granted Jan 10, 2023·3 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →