Inventor · disambiguated record
Tzu-Li Lee
Also filed as: LEE TZU-LI
14 granted patents·5 pending applications·23 citations·filing 2005–2025
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11LIN JIAN-HONG3TAIWAN SEMICONDUCTOR MFG3CHANG HSIAO C1CHEN HSIEN-WEI1
Top patents by PatentIndex Score
19 records- 0190US11855192B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0285US8541264B2Method for forming semiconductor structure having protection layer for preventing laser damageLIN JIAN-HONG·Filed 2012·Granted Sep 24, 2013·7 cites·13 claims
- 0385US2025366005A1Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0480US2024213180A1Interconnect structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0579US10777510B2Semiconductor device including dummy via anchored to dummy metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 15, 2020·2 cites·19 claims
- 0679US2025359211A1Gate structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0776US11955441B2Interconnect structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 0874US8212330B2Process for improving the reliability of interconnect structures and resulting structureCHEN HSIEN-WEI·Filed 2010·Granted Jul 3, 2012·3 cites·18 claims
- 0974US2024097011A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1071US7816256B2Process for improving the reliability of interconnect structures and resulting structureTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 19, 2010·4 cites·8 claims
- 1170US11302654B2Method of fabricating semiconductor device including dummy via anchored to dummy metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 1269US8242576B2Protection layer for preventing laser damage on semiconductor devicesLIN JIAN-HONG·Filed 2005·Granted Aug 14, 2012·4 cites·13 claims
- 1365US12513951B2Gate structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 1454US7998873B2Method for fabricating low-k dielectric and Cu interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Aug 16, 2011·0 cites·20 claims
- 1553US8848374B2Method and structure for dissipating heat away from a resistor having neighboring devices and interconnectsLIN JIAN-HONG·Filed 2010·Granted Sep 30, 2014·1 cites·20 claims
- 1652US11222857B2Method of forming a photoresist over a bond pad to mitigate bond pad corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 1751US8988652B2Method and apparatus for ultraviolet (UV) patterning with reduced outgassingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Mar 24, 2015·0 cites·18 claims
- 1851US8354346B2Method for fabricating low-k dielectric and Cu interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Jan 15, 2013·0 cites·16 claims
- 1940US2007012335A1Photomask cleaning using vacuum ultraviolet (VUV) light cleaningCHANG HSIAO C·Filed 2005·Application pending·0 cites
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