Inventor · disambiguated record
Kuo-Yen Liu
Also filed as: LIU KUO-YEN
7 granted patents·5 pending applications·18 citations·filing 2002–2025
78Inventor score
Top patents by PatentIndex Score
12 records- 0180US2024213180A1Interconnect structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0279US10777510B2Semiconductor device including dummy via anchored to dummy metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 15, 2020·2 cites·19 claims
- 0376US11955441B2Interconnect structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 0474US2025343077A1Modifying tsv layout and the structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0572US2025343140A1Gradually changed dummy pattern distribution around tsvsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0671US10629527B2Method of manufacturing semiconductor device with multi wire structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·1 cites·20 claims
- 0770US11302654B2Method of fabricating semiconductor device including dummy via anchored to dummy metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 0869US2025046655A1Modifying tsv layout and the structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0966US2025062227A1Gradually Changed Dummy Pattern Distribution Around TSVsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1065US11177211B2Method of manufacturing via structures of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 1163US6835649B2Tungsten plug with conductor capping layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 28, 2004·15 cites·9 claims
- 1251US10269697B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →