Inventor · disambiguated record
Kun-Chih Wang
Also filed as: WANG KUN · WANG KUN-CHIH
37 granted patents·14 pending applications·769 citations·filing 1997–2023
98Inventor score
Files withUNITED MICROELECTRONICS CORP22ASIA OPTICAL CO INC8HEWLETT PACKARD DEVELOPMENT CO4UNIV MICHIGAN3SHENZHEN GUANGYI TECH CO LTD2
Top patents by PatentIndex Score
51 records- 0198US6249073B1Device including a micromechanical resonator having an operating frequency and method of extending sameUNIV MICHIGAN·Filed 2000·Granted Jun 19, 2001·152 cites·14 claims
- 0291US10234905B2Hinge for foldable componentsHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Mar 19, 2019·13 cites·14 claims
- 0391US6900541B1Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2004·Granted May 31, 2005·68 cites·16 claims
- 0488US7372168B2Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2006·Granted May 13, 2008·15 cites·29 claims
- 0588US7147454B2Optical lens molding apparatus and precision molding apparatusASIA OPTICAL CO INC·Filed 2005·Granted Dec 12, 2006·8 cites·18 claims
- 0687US5976994AMethod and system for locally annealing a microstructure formed on a substrate and device formed therebyUNIV MICHIGAN·Filed 1997·Granted Nov 2, 1999·75 cites·21 claims
- 0786US7304385B2Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2006·Granted Dec 4, 2007·12 cites·3 claims
- 0884US6169321B1Method and system for locally annealing a microstructure formed on a substrate and device formed therebyUNIV MICHIGAN·Filed 1999·Granted Jan 2, 2001·63 cites·26 claims
- 0982US7208837B2Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Apr 24, 2007·9 cites·11 claims
- 1080US6080646AMethod of fabricating a metal-oxide-semiconductor transistor with a metal gateUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jun 27, 2000·46 cites·21 claims
- 1179US7071575B2Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jul 4, 2006·22 cites·27 claims
- 1279US6348398B1Method of forming pad openings and fuse openingsUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 19, 2002·27 cites·19 claims
- 1379US6046097ADeposition method with improved step coverageUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 4, 2000·57 cites·7 claims
- 1469US6339025B1Method of fabricating a copper capping layerUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jan 15, 2002·33 cites·24 claims
- 1569US6169028B1Method fabricating metal interconnected structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jan 2, 2001·34 cites·18 claims
- 1667US7026234B2Parasitic capacitance-preventing dummy solder bump structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2004·Granted Apr 11, 2006·14 cites·17 claims
- 1766US12467131B2Fabrication methods for 3D structures based on rolling-up kirigami techniquesUNIV CITY HONG KONG·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 1865US6707129B2Fuse structure integrated wire bonding on the low k interconnect and method for making the sameUNITED MICROELECTRONICS CORP·Filed 2001·Granted Mar 16, 2004·12 cites·14 claims
- 1964US6710448B2Bonding pad structureUNITED MICROELECTRONICS CORP·Filed 2001·Granted Mar 23, 2004·12 cites·15 claims
- 2062US10002720B2Preparation of metal oxide-graphene composite filmsUNIV EAST CHINA SCIENCE & TECH·Filed 2013·Granted Jun 19, 2018·1 cites·19 claims
- 2159US7211500B2Pre-process before cutting a wafer and method of cutting a waferUNITED MICROELECTRONICS CORP·Filed 2004·Granted May 1, 2007·6 cites·13 claims
- 2258US12386240B2Electrochromic aperture and manufacturing method therefor, and lens module having electrochromic apertureSHENZHEN GUANGYI TECH CO LTD·Filed 2020·Granted Aug 12, 2025·0 cites·34 claims
- 2358US7170167B2Method for manufacturing wafer level chip scale package structureUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jan 30, 2007·8 cites·9 claims
- 2457US6371045B1Physical vapor deposition device for forming a metallic layer on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 16, 2002·12 cites·7 claims
- 2557US2007010122A1Miniaturized lens assembly and method for making the sameASIA OPTICAL CO INC·Filed 2006·Application pending·0 cites
- 2655US11581859B2Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurationsCREE INC·Filed 2020·Granted Feb 14, 2023·0 cites·41 claims
- 2755US6013579ASelf-aligned via process for preventing poison via formationUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 11, 2000·20 cites·15 claims
- 2854US2011061799A1Miniaturized Lens Assembly and Method for Making the SameWANG KUN-CHIH·Filed 2010·Application pending·0 cites
- 2953US11714450B2Stylus holdersHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Aug 1, 2023·0 cites·15 claims
- 3051US10826314B2Wireless chargersHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Nov 3, 2020·0 cites·15 claims
- 3151US6080660AVia structure and method of manufactureUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jun 27, 2000·16 cites·12 claims
- 3251US2007056325A1Optical article and molding assembly for making the sameASIA OPTICAL CO INC·Filed 2006·Application pending·0 cites
- 3350US2006048544A1Molding coreASIA OPTICAL CO INC·Filed 2005·Application pending·0 cites
- 3450US2006026995A1Molding core and method for making the sameASIA OPTICAL CO INC·Filed 2005·Application pending·0 cites
- 3549US2025109013A1Cantilever-based opto-electromechanical systems and fabrication methodsUNIV CITY HONG KONG·Filed 2023·Application pending·0 cites
- 3648US11424092B2Rolling elements-based pivoting supports for keyboardsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Aug 23, 2022·0 cites·15 claims
- 3748US2006010919A1Molding coreASIA OPTICAL CO INC·Filed 2005·Application pending·0 cites
- 3847US12498608B2Electrochromic device and manufacturing methodSHENZHEN GUANGYI TECH CO LTD·Filed 2020·Granted Dec 16, 2025·0 cites·10 claims
- 3946US7562539B2Method and the device for making high precision coating of insert for glass moldingASIA OPTICAL CO INC·Filed 2004·Granted Jul 21, 2009·0 cites·6 claims
- 4046US6048796AMethod of manufacturing multilevel metal interconnectUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 11, 2000·12 cites·17 claims
- 4143US6245380B1Method of forming bonding padUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 12, 2001·10 cites·23 claims
- 4242US5976984AProcess of making unlanded viasUNITED MICROELECTRONICS CORP·Filed 1997·Granted Nov 2, 1999·10 cites·13 claims
- 4341US2015130025A1Transistor fabricating method and transistorUNIV PEKING FOUNDER GROUP CO·Filed 2014·Application pending·0 cites
- 4440US10513003B2Precision lapping and polishing device for external cylindrical surface of the disk part and its taper error adjustment method thereofUNIV DALIAN TECH·Filed 2017·Granted Dec 24, 2019·0 cites·10 claims
- 4540US2006037363A1Heat transfer plate for molding glassASIA OPTICAL CO INC·Filed 2004·Application pending·0 cites
- 4639US2006022195A1Scribe line structureWANG KUN-CHIH·Filed 2004·Application pending·0 cites
- 4739US2005110120A1Scribe line structure of waferFiled 2003·Application pending·0 cites
- 4837US2012060914A1Coplanar type photovoltaic cell and method for fabricating the sameHSU KUO-CHIANG·Filed 2011·Application pending·0 cites
- 4933US6180484B1Chemical plasma treatment for rounding tungsten surface spiresUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 30, 2001·2 cites·3 claims
- 5033US2003020163A1Bonding pad structure for copper/low-k dielectric material BEOL processFiled 2001·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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