Inventor · disambiguated record
Sangho An
Also filed as: AN SANGHO
3 granted patents·3 citations·filing 2014–2017
54Inventor score
Top patents by PatentIndex Score
3 records- 0164US9881827B2Substrate treating apparatus and substrate treating methodKIM GEUNWOO·Filed 2015·Granted Jan 30, 2018·2 cites·19 claims
- 0256US9390992B2Semiconductor packages including a metal layer between first and second semiconductor chipsKWON HEUNGKYU·Filed 2014·Granted Jul 12, 2016·1 cites·20 claims
- 0343US10658326B2Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 19, 2020·0 cites·19 claims
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