Inventor · disambiguated record
Chieh-Yuan Chi
Also filed as: CHI CHIEH-YUAN
12 granted patents·1 pending application·12 citations·filing 2013–2018
84Inventor score
Top patents by PatentIndex Score
13 records- 0175US8828796B1Semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 9, 2014·4 cites·18 claims
- 0273US9899303B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 20, 2018·2 cites·11 claims
- 0372US9842758B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 12, 2017·2 cites·5 claims
- 0462US9548219B2Semiconductor package and fabrication method thereof and carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Jan 17, 2017·2 cites·22 claims
- 0562US9397081B2Fabrication method of semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 19, 2016·1 cites·12 claims
- 0660US9177859B2Semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 3, 2015·1 cites·10 claims
- 0751US10403567B2Fabrication method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·14 claims
- 0847US9768140B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Sep 19, 2017·0 cites·11 claims
- 0945US9224646B2Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 29, 2015·0 cites·8 claims
- 1044US9607941B2Conductive via structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·16 claims
- 1143US9337061B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 10, 2016·0 cites·10 claims
- 1241US2014134797A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1336US9515040B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 6, 2016·0 cites·15 claims
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