Inventor · disambiguated record
Chun-Tang Lin
Also filed as: LIN CHUN-TANG
35 granted patents·12 pending applications·37 citations·filing 2011–2022
95Inventor score
Top patents by PatentIndex Score
47 records- 0188US9324582B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Apr 26, 2016·9 cites·11 claims
- 0285US10522453B2Substrate structure with filling material formed in concave portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 31, 2019·4 cites·11 claims
- 0374US8952537B2Conductive bump structure with a plurality of metal layersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 10, 2015·3 cites·8 claims
- 0474US8519526B2Semiconductor package and fabrication method thereofHUANG JUNG-PANG·Filed 2011·Granted Aug 27, 2013·5 cites·6 claims
- 0573US9899303B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 20, 2018·2 cites·11 claims
- 0672US9842758B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 12, 2017·2 cites·5 claims
- 0771US9147668B2Method for fabricating semiconductor structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 29, 2015·4 cites·10 claims
- 0871US8952528B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 10, 2015·2 cites·11 claims
- 0965US9269693B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 23, 2016·1 cites·9 claims
- 1064US9087780B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jul 21, 2015·1 cites·8 claims
- 1163US11227842B2Electronic package and substrate structure having chamfersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·11 claims
- 1262US9397081B2Fabrication method of semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 19, 2016·1 cites·12 claims
- 1361US12046494B2Chip matching system and method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·5 claims
- 1461US8895367B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 25, 2014·1 cites·10 claims
- 1560US9177859B2Semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 3, 2015·1 cites·10 claims
- 1660US8603911B2Semiconductor device and fabrication method thereofHUANG HUI-MIN·Filed 2011·Granted Dec 10, 2013·1 cites·14 claims
- 1759US11973014B2Method of manufacturing substrate structure with filling material formed in concave portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Apr 30, 2024·0 cites·7 claims
- 1859US11527491B2Method for fabricating substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·7 claims
- 1953US11532495B2Chip matching system and method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·6 claims
- 2051US10763223B2Substrate structure having chamfersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·13 claims
- 2151US10403567B2Fabrication method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·14 claims
- 2250US9257381B2Semiconductor package, and interposer structure of the semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 9, 2016·0 cites·9 claims
- 2349US9418874B2Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 16, 2016·0 cites·9 claims
- 2449US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2548US9627226B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Apr 18, 2017·0 cites·26 claims
- 2648US9548220B2Method of fabricating semiconductor package having an interposer structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jan 17, 2017·0 cites·14 claims
- 2748US9349705B2Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 24, 2016·0 cites·15 claims
- 2847US11056442B2Substrate structure, electronic package having the same, and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jul 6, 2021·0 cites·10 claims
- 2946US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 3045US9224646B2Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 29, 2015·0 cites·8 claims
- 3144US9754898B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 5, 2017·0 cites·18 claims
- 3244US9607941B2Conductive via structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·16 claims
- 3344US8829687B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Sep 9, 2014·0 cites·18 claims
- 3443US9337061B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 10, 2016·0 cites·10 claims
- 3543US2015179597A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 3642US8987012B2Method of testing a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 24, 2015·0 cites·10 claims
- 3742US2015014864A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 3841US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 3940US2014127864A1Method of fabricating a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 4040US2014008819A1Substrate structure, semiconductor package and methods of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 4138US9607974B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·6 claims
- 4238US2014077387A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 4337US2014191386A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 4437US2015162301A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 4536US9515040B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 6, 2016·0 cites·15 claims
- 4632US2016079110A1Semiconductor package, carrier structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 4729US2013256915A1Packaging substrate, semiconductor package and fabrication method thereofHUANG HUEI-NUAN·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →